• 한국응용과학기술학회지
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• 제27권1호
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• pp.50-55
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• 2010

본 논문은 메탈 이중층 전극을 이용한 유기 박막 트랜지스터를 제작하여 Au나 Ag 금속만으로 제작한 일반적인 유기 박막 트랜지스터와의 전기적 특성을 비교하였다. 전기적 특성에서 게이트 절연층은 높은 K 값을 갖는 $Al_2O_3$를 사용하였고, 유기 반도체층은 펜타센을 사용하였다. 본 실험에서 제작한 유기 박막 트랜지스터는 $1.6 \;{\times}\;10^{-1}\;cm^2$의 포화영역 이동도를 얻을 수 있었으며, 또한 드레인 전압을 -5V로 하고, 게이트 전압을 3 V에서 -10 V 까지 인가하였을 때 $3{\times}10^5$의 전멸 비를 얻을 수 있었다.

• 한국세라믹학회지
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• 제56권4호
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• pp.394-398
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• 2019

In this paper, the joining characteristics of GDC-LSM ceramics with Crofer 22 APU metal alloys was investigated at different brazing temperatures and holding times by reactive air brazing. Brazing was performed using Ag-10 wt% CuO filler, at three different temperatures (1000, 1050, and 1100℃ for 30 minutes) as well as for three different holding times (10, 30, and 60 minutes at 1050℃). The interfacial microstructures were examined by scanning electron microscopy and the joining strengths were assessed by measuring shear strengths at room temperature. The results show that with increasing brazing temperature and holding time, joint microstructure changed obviously and shear strength was decreased. Shear strength varied from a maximum of 100±6 MPa to a minimum of 18±5 MPa, depending on the brazing conditions. These changes were attributed to an increase in the thickness of the oxide layer at the filler/metal alloy interface.

• 방사선산업학회지
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• 제5권1호
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• pp.95-99
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• 2011

The electrical and mechanical properties of electrode for radiation detection are very important. In general, Au electrode and CZT crystal are combined to form ohmic contacts, and the best energy resolution is shown at the Au electrode. The metal contacts are fabricated by electroless deposition method, sputtering deposition method and thermal evaporation method. The electrode fabrication is easy with use of the thermal evaporation method, while an adhesive strength is weak. Thus interface materials such as Ag, Al and Ni were investigated to overcome defects generated by the this method. The thickness of the interface material between the Au electrode and the CZT crystal was 100 Angstroms, the Au electrode with thickness of 400 Angstroms was deposited. The Al+Au electrode is shown that the results of current-voltage and radiation response are similar to results of Au electrode.

• 한국전기전자재료학회논문지
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• 제17권12호
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• pp.1352-1355
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• 2004

We have applied front contact metallization of plated nickel and copper for high efficiency passivated emitter rear contact(PERC) solar cell. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. The plating technique is a preferred method for commercial solar cell fabrication because it is a room temperature process with high growth rates and good morphology. In this system, the electroless plated Ni is utilized as the contact to silicon and the plated Cu serves as the primary conductor layer instead of traditional solution that are based on Ti/Pd/Ag contact system. Experimental results are shown for over 20 % PERC cells with the Plated Ni/Cu contact system for good performance at low cost.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1546-1548
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• 1998

Dual mode ring resonators(DMRR) have been fabricated using laser ablated $YBa_2Cu_3O_{7-x}$ superconducting thin films. The transition temperature of YBCO thin films were 85 - 88 K and the film thicknesses were about 5,000 $\AA$. Dual mode ring resonators were patterned by standard photolithography process and wet-etching. Then two-layer metal thin films (Ti/Ag) have been deposited for the ground plane on the back side of substrate by e-beam and thermal evaporation. The input/output feedline angles of each resonator were $60^{\circ}$, $100^{\circ}$, $180^{\circ}$. A network analyzer was used for testing the performance of the resonators in the frequency range of 6-13 GHz at 77 K.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.41-44
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• 1998

Dual mode resonators were fabricated using high temperature superconductor. The deposited material was $Y_1Ba_2Cu_3O_{7-x}$(YBCO) on MgO(100) substrate using pulsed laser deposition. Dual mode resonators were patterned by standard photolithography process and wet etching. At the back-side of the substrate, the ground plane with the metal layer of Ti and Ag was fabricated. The transition temperatures of YBCO films were 85-88 K, and network analyzer was used for testing the performance of the resonators. The input/output feedline angles of each resonator were $60^{\circ}$and $100^{\circ}$. The resonant frequency of resonators was 10 GHz. In this paper, dual mode resonator was fabricated for the application of satellite communication.

• E2M - 전기 전자와 첨단 소재
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• 제7권2호
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• pp.100-106
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• 1994

A bilayer film consisting of a layer of a-Se$_{75}$ Ge$_{25}$ with a surface layer of silver -100[.angs.] thick and a monolayer film of a-Se$_{75}$ Ge$_{25}$ are irradiated with 9[keV] Ga$^{+}$ ion beam. The Ga$^{+}$ ion (10$^{16}$ [ions/cm$^{2}$] exposed a-Se$_{75}$ Ge$_{25}$ and Ag/a-Se$_{75}$ Ge$_{25}$ thin films show an increase in optical absorption, and the absorption edge on irradiation with shifts toward longer wavelength. The shift toward longer wavelength called a "darkening effect" is observed also in film exposure to optical radiation(4.5*10$^{20}$ [photons/cm$^{2}$]). The 0.3[eV] edge shift for ion irradiation films is about twice to that obtained on irradiation with photons. These large changes are primarily due to structural changes, which lead to high etch selectivity and high sensitivity.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.410.2-410.2
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• 2016

Tandem structure is promising in organic solar cells because of its double open-circuit voltage (VOC) and efficient photon energy conversion. In a typical tandem device, the two single sub-cells are stacked and connected by an interconnecting layer. The fabrication of two sub-cells are usually carried out in a glovebox filled with nitrogen or argon gas, which makes it expensive and laborious. We report a glovebox-free fabricated inverted tandem organic solar cells wherein the tandem structure comprises sandwiched interconnecting layer based on p-doped hole-transporting, metal, and electron-transporting materials. Complete fabrication process of the tandem device was performed outside the glove box. The tandem solar cells based on poly(3-hexylthiophene) (P3HT) and (6,6)-phenyl C61-butyric acid methyl ester (PCBM) can realize a high VOC, which sums up of the two sub-cells. The tandem device structure was ITO/ZnO/P3HT:PCBM/PEDOT:PSS/MoO3/Au/Al/ZnO-d/P3HT:PCBM/PEDOT:PSS/Ag. The separate sub-cells were morphologically and thermally stable up to 160 oC. The high stability of the active layer benefits in the fabrication processes of tandem device. The performance of tandem organic solar cells comes from the sub-cells with an 50 nm thick active layer of P3HT:PCBM, achieving an average power conversion efficiency (PCE) of 2.9% (n=12) with short-circuit current density (JSC) = 4.26 mA/cm2, VOC = 1.10 V, and fill factor (FF) = 0.62. Based on these findings, we propose a new method to improve the performance and stability of tandem organic solar cells.

• 헤리티지:역사와 과학
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• 제39권
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• pp.243-280
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• 2006

서산 부장리 유적 백제시대 분구묘 5호분 출토 금동관모는 백제시대의 고고학적 자료로서 당시 국제적 교류 관계를 밝힐 수 있는 중요한 유물이다. 본 논문은 금동관모를 보존처리하는 과정 중에 획득한 정보를 바탕으로 금동관모의 제작기법을 연구한 결과이다. 관모의 단면은 총 5개층으로 구분할 수 있다. 이 단면 중 직물층이 백화수피층과 금속층 사이에서 발견되었는데, 금속과 백화수피의 직접적인 접촉을 피하기 위한 것으로 추정된다. 분석은 단면 중 2개의 층인 직물층과 섬유질층의 분석을 수행하였다. 직물층은 가장 간단한 조직인 평직으로 이루어져 있고, 한 겹으로 되어 있었다. 또한, 조직의 꼬임, 미세조직 구조상 몇 가지 직물로 추정할 수 있었다. 섬유질은 두 세 개의 섬유가 혼재되어 있는 것을 알 수 있었다. FT-IR 분석 결과 직물층과 섬유질층은 모두 마섬유로 확인되었다. 또한 백화수피는 자작나무껍질 15겹을 붙여 사용하였음을 알 수 있었다. 도금편의 미세조직 관찰을 위해 금속현미경과 주사전자현미경(SEM) 및 파장분산형X선 분석기(WDS)를 이용하였다. 분석결과 아말간도금이 행해졌음을 알 수 있었으며, 도금기술의 척도를 알 수 있는 도금층 두께는 최소 $1.7{\mu}m$부터 최대 $8.7{\mu}m$이었다. 금의 순도는 금(Au)이 98%, 약 1% 이내의 은(Ag)이 함유되어 있었다. 위 금동관모의 과학적 보존처리와 분석을 통해 얻어진 결과는 향후 제작기술의 비교연구 뿐만 아니라 복원품의 제작을 위한 자료로 활용될 수 있다.