• Title/Summary/Keyword: Mechanical etching

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Dual Surface Modifications of Silicon Surfaces for Tribological Application in MEMS

  • Pham, Duc-Cuong;Singh, R. Arvind;Yoon, Eui-Sung
    • KSTLE International Journal
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    • v.8 no.2
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    • pp.26-28
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    • 2007
  • Si(100) surfaces were topographically modified i.e. the surfaces were patterned at micro-scale using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterned shapes included micro-pillars and microchannels. After the fabrication of the patterns, the patterned surfaces were chemically modified by coating a thin DLC film. The surfaces were then evaluated for their friction behavior at micro-scale in comparison with those of bare Si(100) flat, DLC coated Si(100) flat and uncoated patterned surfaces. Experimental results showed that the chemically treated (DLC coated) patterned surfaces exhibited the lowest values of coefficient of friction when compared to the rest of the surfaces. This indicates that a combination of both the topographical and chemical modification is very effective in reducing the friction property. Combined surface treatments such as these could be useful for tribological applications in miniaturized devices such as Micro-Electro-Mechanical-Systems (MEMS).

Full 3D Level Set Simulation of Nanodot Fabrication using FIBs

  • Kim, Heung-Bae
    • Applied Science and Convergence Technology
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    • v.25 no.5
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    • pp.98-102
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    • 2016
  • The level set method has recently become popular in the simulation of semiconductor processes such as etching, deposition and photolithography, as it is a highly robust and accurate computational technique for tracking moving interfaces. In this research, full three-dimensional level set simulation has been developed for the investigation of focused ion beam processing. Especially, focused ion beam induced nanodot formation was investigated with the consideration of three-dimensional distribution of redeposition particles which were obtained by Monte-Carlo simulation. Experimental validations were carried out with the nanodots that were fabricated using focused $Ga^+$ beams on Silicon substrate. Detailed description of level set simulation and characteristics of nanodot formation will be discussed in detail as well as surface propagation under focused ion beam bombardment.

SILICON DIOXIDE FILMS FOR INTERMETAL DIELECTRIC APPLICATIONS DEPOSITED BY AN ECR HIGH DENSITY PLASMA SYSTEM

  • Denison, D.R.;Harshbarger, W.R.
    • Journal of the Korean Vacuum Society
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    • v.4 no.S1
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    • pp.130-137
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    • 1995
  • Deopsition of thermal quality SiO2 using a high density plasma ECR CVD process has been demonstrated to give void and seam free gap fill of high aspect ratio metallization structures with a simple oxygen-silane chemistry. This is achieved by continuous sputter etching of the film during the deposition process. A two-step process is utilized to deposit a composite layer for higher manufacturing efficiency. The first step, which has a deposition rate of approximately 0.5 $\mu$m/min., is used to provide complete gap fill between the metal lines. The second step, which has a deposition rate of up to 1.5 $\mu$m/min., is used to deposit a total thickness of 2.0$\mu$m for the intermetal dielectric film. The topography of this composite film is very compatible with subsequent chemicl mechanical polishing(CMP) planarization processing.

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ER:YAG LASER-TREATED ENAMEL FOR PIT AND FISSURE SEALANT: A COMPARISON OF MICROLEAKAGE (Er:YAG 레이저를 이용한 법랑질 표면처리 후 치면열구전색재의 미세누출에 관한 평가)

  • Lee, Seon-Suk;Lee, Nan-Young;Lee, Sang-Ho
    • Journal of the korean academy of Pediatric Dentistry
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    • v.33 no.4
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    • pp.597-605
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    • 2006
  • It is introduced that pit and fissure sealant is the most universal and effective to prevent occlusal dental caries. In processing of being applied the pit and fissure sealant, the various kinds of methods are developed to remove organic matters, plaque, microflora and debris in the pit and fissure for increasing the rates of maintain the sealant. Recently, the Er:YAG laser has been used as a new enamel surface treatment method. The purpose of this thesis is compared whether that enamel surface treatment method is superior to other methods or not. 1. 100mJ 5Hz Er:YAG lased enamel surface was similar to acid-etched enamel in SEM evaluation. 2, Mechanical preparation showed decreased microleakage when compared with acid-etching only, but no significant differences in both method. 3. After laser and acid-etching method showed decreased microleakage when compared with acid-etching only.

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Development of capacitive Micromachined Ultrasonic Transducer (II) - Analysis of Microfabrication Process (미세가공 정전용량형 초음파 탐촉자 개발(II) - 미세공정기술 분석)

  • Kim, Ki-Bok;Ahn, Bong-Young;Park, Hae-Won;Kim, Young-Joo;Kim, Kuk-Jin;Lee, Seung-Seok
    • Journal of the Korean Society for Nondestructive Testing
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    • v.24 no.6
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    • pp.573-580
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    • 2004
  • The main goal of this study was to develop a micro-fabrication process for the capacitive micromachined ultrasonic transducer (cMUT). In order to achieve this goal, the former research results of the micro-electro-mechanical system (MEMS) process for the cMUT were analyzed. The membrane deposition, sacrificial layer deposition and etching were found to be a main process of fabricating the cMUT. The optimal conditions for those microfabrication were determined by the experiment. The thickness, uniformity, and residual stress of the $Si_3N_3$ deposition which forms the membrane of the cMUT were characterized after growing the $Si_3N_3$ on Si-wafer under various process conditions. As a sacrificial layer, the growth rate of the $SiO_2$ deposition was analyzed under several process conditions. The optimal etching conditions of the sacrificial layer were analyzed. The microfabrication process developed in this study will be used to fabricate the cMUT.

A study on the shear bond strengths of orthodontic brackets according to surface treatments and polymerizing techniques. (도재표면의 처리방법과 접착제의 중합방식에 따른 교정용 브라켓의 전단강도의 연구)

  • Kim, Young-Joo;Cha, Kyung-Suk;Lee, Jin-Woo
    • The korean journal of orthodontics
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    • v.29 no.4 s.75
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    • pp.445-456
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    • 1999
  • As a result of increased education and communication, the field of orthodontics has recently been expanded to include a greater number of adult treatment procedures. With this increased demand for adult orthodontic treatment, a problem that frequently arises is the placement of appliances on teeth restored with porcelain. But conventional acid-etching is ineffective in the preparation of porcelain surface for mechanical retention of orthodontic attachments. Also, it is possible to damage on porcelain. The purpose of this study was to evaluate the effect of composite bonding materials and the porcelain surface treatment methods on shear bond strength, and to observe the porcelain fracture rates. To accomplish this purpose, this study was carried out with feldsphatic porcelain, Ceram II. Porcelain surface treatment methods were divided into intact glazed porcelain which had not treatment and surface roughening. Surface roughening by etching with Hydroluoric acid(HF), sandblasting with Microetcher II and compound treatment with etching and sandblasting. Bonding materials were Ortho-two and Transbond. All porcelain specimens were applicated with porcelain primer. 1. In comparision according to porcelain surface treatment, surface roughening groups by HF etching and sandblasting had higher shear bond than intact group. No significant difference was found in Transbond group. 2. Ortho-two group had the higher shear bond strength than that of Transbond group in B:.u etching and sandblasting. 3. E(Transbond. Intact)group had the lowest shear bond strength in all experimental group. The bond strength was higher than clinically successful bond strength. 4. Non-treated group had very higher porcelain rates than treated group. 5. This study indicates that porcelain surface-roughening may not be necessary to attachment of orthodontic brackets to porcelain surfaces.

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Interaction of cracks and precipitate particles on the REBCO superconducting layers of practical CC tapes through fractographic observations

  • de Leon, Michael;Diaz, Mark A.;Shin, Hyung-Seop
    • Progress in Superconductivity and Cryogenics
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    • v.22 no.3
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    • pp.7-12
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    • 2020
  • Electromechanical properties of REBCO CC tapes are known to be limited by defects (cracks) that form in the brittle REBCO layer. These defects could be inherently acquired during the CC tapes' manufacturing process, such as slitting, and which can be initiated at the CC tapes' edges. If propagated and long enough, they are believed to cause critical current degradation and can substantially decrease the delamination strength of CC tapes. Currently, commercially available CC tapes from various manufacturers utilize different growth techniques for depositing the REBCO layers on the substrates in their CC tapes preparation. Their epitaxial techniques, unfortunately, cannot perfectly avoid the formation of particles, in which sometimes acts as current blocking defects, known as outgrowths. Collective research regarding the composition, size, and formation of these particles for various CC tapes with different deposition techniques are particularly uncommon in a single study. Most importantly, these particles might interact in one way or another to the existing cracks. Therefore, systematic investigation on the interactions between the cracks' development mechanism and particles on the REBCO superconducting layers of practical CC tapes are of great importance, especially in the design of superconducting devices. Here, a proper etching process was employed for the CC tapes to expose and observe the REBCO layers, clearly. The scanning electron microscope, field emission scanning microscope, and energy-dispersive x-ray spectroscopy were utilized to observe the interactions between cracks and particles in various practical CC tapes. Particle compositions were identified whether as non-superconducting or superconducting and in what manner it interacts with the cracks were studied.

Surface Modification Effect and Mechanical Property of para-aramid Fiber by Low-temperature Plasma Treatment (저온 플라즈마 처리를 이용한 파라 아라미드 섬유의 표면 개질 효과 및 역학적 특성(2))

  • Park, Sung-Min;Son, Hyun-Sik;Sim, Ji-Hyun;Kim, Joo-Young;Kim, Taekyeong;Bae, Jin-Seok
    • Textile Coloration and Finishing
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    • v.27 no.1
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    • pp.18-26
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    • 2015
  • para-aramid fibers were treated by atmosphere air plasma to improve the interfacial adhesion. The wettability of plasma-treated aramid fiber was observed by means of dynamic contact angle surface free energy measurement. Surface roughness were investigated with the help of scanning electron microscopy and atomic force microscopy. The tensile test of aramid fiber roving was carried out to determine the effect of plasma surface treatments on the mechanical properties of the fibers. A pull-out force test was carried out to observe the interfacial adhesion effect with matrix material. It was found that surface modification and a chemical component ratio of the aramid fibers improved wettability and adhesion characterization. After oxygen plasma, it was indicated that modified the surface roughness of aramid fiber increased mechanical interlocking between the fiber surface and vinylester resin. Consequently the oxygen plasma treatment is able to improve fiber-matrix adhesion through excited functional group and etching effect on fiber surface.

Substrate Effects on the Response of PZT Infrared Detectors (상이한 기판조건에 따른 PZT 적외선 감지소자의 성능 변화)

  • Go, Jong-Su;Gwak, Byeong-Man;Liu, Weiguo;Zhu, Weiguang
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.3
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    • pp.428-435
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    • 2002
  • Pyroelectric $Pb(Zr_{0.3}Ti_{0.7})O_3$ (PZT30/70) thin film IR detectors has been fabricated and characterised. The PZT30/70 thin film was deposited onto $Pt/Ti/Si_3N_4/SiO_2/Si$ substrate by the sol-gel process. Four different substrate conditions were studied for their effects on the pyroelectric responses of the IR detectors. The substrate conditions were the combinations of the Si etching and the Pt/Ti patterning. In the Si etched substrate, the $Si_3N_4/SiO_2$ composite layer was used as silicon etch-stop, and was used as the membrane to support the PZT pyroelectric film element as well. The measured pyroelectric current and voltage responses of detectors fabricated on the micro-machined thin $Si_3N_4/SiO_2$ membrane were two orders higher than those of the detectors on the bulk-silicon. For detectors on the membrane substrate, the Pt/Ti patterned detectors showed a 2-times higher pyroelectric response than that of not-patterned detectors. On the other hand, the pyroelectric response of the detectors on the not-etched Si substrate was almost the same, regardless of the Pt/Ti patterning. It was also found that the rise time strongly depended on the substrate thickness: the thicker the substrate was, the longer the rise-time.

Mechanical Properties and Microstructure of the Leucite-Reinforced Glass-Ceramics for Dental CAD/CAM

  • Byeon, Seon-Mi;Song, Jae-Joo
    • Journal of dental hygiene science
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    • v.18 no.1
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    • pp.42-49
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    • 2018
  • The computer-aided design/computer-aided manufacturing (CAD/CAM) system was introduced to shorten the production time of all-ceramic restorations and the number of patient visits. Among these types of ceramic for dental CAD/CAM, they have been processed into inlay, onlay, and crown shapes using leucite-reinforced glass-ceramics to improve strength. The purpose of this study was to observe the mechanical properties and microstructure of leucite-reinforced glass-ceramics for dental CAD/CAM. Two types of leucite-reinforced glass-ceramic blocks (IPS Empress CAD, Rosetta BM) were prepared with diameter of 13 mm and thickness of 1 mm. Biaxial flexural testing was conducted using a piston-on-three-ball method at a crosshead speed of 0.5 mm/min. Weibull statistics were used for the analysis of biaxial flexural strength. Fracture toughness was obtained using an indentation fracture method. Specimens were observed by field emission scanning electron microscopy to examine the microstructure of the leucite crystalline phase after acid etching with 0.5% hydrofluoric acid aqueous solution for 1 minute. The results of strength testing showed that IPS Empress CAD had a mean value of $158.1{\pm}8.6MPa$ and Rosetta BM of $172.3{\pm}8.3MPa$. The fracture toughness results showed that IPS Empress CAD had a mean value of $1.28{\pm}0.19MPa{\cdot}m^{1/2}$ and Rosetta BM of $1.38{\pm}0.12MPa{\cdot}m^{1/2}$. The Rosetta BM sample exhibited higher strength and fracture toughness. Moreover, the crystalline phase size and ratio were increased in the Rosetta BM sample. The above results are expected to elucidate the basic mechanical properties and crystal structure characteristics of IPS Empress CAD and Rosetta BM. Additionally, they will help develop leucite-reinforced glass-ceramic materials for CAD/CAM.