• 제목/요약/키워드: MIM(Metal-Insulator-Metal)

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금속 박막위에 ALD법으로 형성된 $Al_{2}O_{3}$ 박막의 계면 특성과 MIM capacitor의 제조 (Interface properties of $Al_{2}O_{3}$ thin film using ALD method on metal film and Fabrication of MIM capacitor)

  • 남상완;고성용;정영철;이용현
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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    • pp.1061-1064
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    • 2003
  • In this paper, we deposited A1$_2$O$_3$ thin film using atomic layer deposition(ALD) method on Ti and fabricated metal-insulator-metal(MIM) capacitor. In the result of this study, the typical deposition rate was about 1.12$\AA$/cycle. About 30 nm of Ti was consumed during deposition and TiO$_{x}$ was formed at the interface of A1$_2$O$_3$ and Ti. Its surface roughness was 1.54nm. The leakage current density was 1.5 nA/$\textrm{cm}^2$. The temperature coefficient of capacitance(TCC) of MIM capacitor was 41 ppm/$^{\circ}C$ at 1MHz and 100 ppm/$^{\circ}C$ at 100 kHz.z.

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LB법으로 제작한 MIM 구조 유기 박막의 전자특성 (Electronic Properties of MIM Structure Organic Thin-films that Manufacture by LB method)

  • 최영일;이경섭;임중열;송진원
    • 전자공학회논문지 IE
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    • 제43권4호
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    • pp.99-104
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    • 2006
  • 전기 전자 소자를 제작하는 방법으로 Langmuir-Boldgett(LB)법이 많은 관심을 받고 있다. 수면위에 형성된 단분자막을 압축 또는 확장하면, 분자가 배향하는 과정에서 맥스웰 변위전류(MDC)가 흐른다. MDC는 전속밀도의 변화에 기인해서 흐르므로 MDC를 측정하는 것에 의해 분자의 동적 거동 관찰할 수 있다. 단분자막을 압축하는 속도와 분자면적은 서로 선형적인 관계를 갖고 있다. 본 연구에서는 압축속도를 30, 40, 50mm/min으로 달리하여 단분자막의 동적 거동을 관찰하였으며 LB법을 이용하여 Arachidic acid 단분자를 slide glass 위에 Y-type으로 9$\sim$21층의 다층막을 누적하여 Au/Arachidic acid/Al 소자를 제작하였다. 또한 Metal-Insulator-Metal(MIM) 소자의 I-V 특성을 측정하여 전극간의 거리가 커질수록 절연특성이 좋아짐을 확인하였다.

OTFT용 용액공정의 에틸렌-브리지드 실세스퀴옥산 게이트 절연체 (Solution-Processed Gate Insulator of Ethylene-Bridged Silsesquioxnae for Organic Field-Effect Transistor)

  • 이덕희;정현담
    • 통합자연과학논문집
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    • 제3권1호
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    • pp.7-18
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    • 2010
  • Ethylene-bridged silsesquioxane resins were synthesized from two monomers: 1,2-bis(trimethoxysilyl)ethane and methyltrimethoxysilane. The silsesquioxane thin films were spin-coated from the copolymerized resins on silicon wafer. Metal insulator metal (MIM), metal insulator semiconductor (MIS) devices were utilized to investigate the electrical properties of the copolymerized thin films. As the films were inserted as gate insulator in the OTFT devices, the field effect mobilitites were evaluated by employing Poly(3-hexylthiophene) (P3HT) as organic semiconductor, which shows that their dielectric properties and mobility values are dependent on the molecular structures and Si-OH concentration involving in the films.

Stability Improvement of 60 GHz Narrowband Amplifier Using Microstrip Coupled Lines

  • Chang, Woo-Jin;Lim, Jong-Won;Ahn, Ho-Kyun;Ji, Hong-Gu;Kim, Hae-Choen
    • ETRI Journal
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    • 제31권6호
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    • pp.741-748
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    • 2009
  • We present an analysis of microstrip coupled lines (MCLs) used to improve the stability of a 60 GHz narrowband amplifier. The circuit has a 4-stage structure implementing MCLs instead of metal-insulator-metal (MIM) capacitors for the unconditional stability of the amplifier and yield enhancement. The stability parameter, U, is used to compare the stability of MCLs with that of MIM capacitors. Experimental results show that MCLs are more stable than MIM capacitors with the same capacitances as MCLs because the parasitic parallel resistances of MCLs are lower than those of MIM capacitors. Moreover, the bandwidth of an amplifier using MCLs is narrower than one using MIM capacitors because the parasitic series inductances of MCLs are higher than those of MIM capacitors.

Environment-dependent Broadband Perfect Absorption of Metal-insulator-metal Metamaterial Systems

  • Feng Li;Yulong Tang;Qingsong Peng;Guosheng Hu
    • Current Optics and Photonics
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    • 제7권2호
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    • pp.136-146
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    • 2023
  • Based on calculations using the macroscopic Maxwell's equations with mesoscopic boundary conditions, light absorption by a layered metal-insulator-metal (MIM) metamaterial system embedded in three different environments is investigated. Increasing the top metal thickness shifts the broad absorption band to lower dielectric-constant regions and longer wavelengths, for either TM or TE waves. Boosting the dielectric-layer thickness redshifts the broadband absorption to regions of larger dielectric constant. In air, for the dielectric-constant range of 0.86-3.40, the absorption of the system exceeds 98% across 680-1,033 nm. In seawater with optimized dielectric constant, ≥94% light absorption over 400-1,200 nm can be achieved; particularly in the wavelength range of 480-960 nm and dielectric-constant range of 0.82-3.50, the absorption is greater than 98%. In an environment with even higher refractive index (1.74), ≥98% light absorption over 400-1,200 nm can be achieved, giving better performance. The influence of angle of incidence on light absorption of the MIM system is also analyzed, and the angle tolerance for ≥90% broadband absorption of a TM wave is up to 40° in an environment with large refractive index. While the incident-angle dependence of the absorption of a TE wave is nearly the same for different circumstances, the situation is different for a TM wave.

Fabrication of High Break-down Voltage MIM Capacitors for IPD Applications

  • Wang, Cong;Kim, Nam-Young
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.241-241
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    • 2009
  • For the Radio Frequency Integrated Passive Device (RFIPD) application, we have successfully developed and characterized high break-down voltage metal-insulator-metal (MIM) capacitors with 2,000 ${\AA}$ plasma-enhanced chemical vapor deposition (PECVD) silicon nitride which deposited with $SiH_4/NH_3$ gas mixing rate, working pressure, and RF power of PECVD at $250^{\circ}C$ chamber temperature. At the PECVD process condition of gas mixing rate (0.957), working pressure (0.9 Torr), and RF power (60 W), the AFM RMS value of about 2,000 ${\AA}$ silicon nitride on the bottom metal was the lowest of 0.862 nm and break-down electric field was the highest of about 8.0 MV/cm with the capacitance density of 326.5 $pF/mm^2$.

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Co-firing of PZT/metal foil laminates for MIM structured device fabrication

  • 김백현;배현정;권도균
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.82.2-82.2
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    • 2012
  • 캐패시터, 액추에이터와 같이 MIM (Metal-Insulator-Metal) 구조를 갖는 디바이스는 높은 소결온도를 갖는 세라믹 유전체/압전체와 고온 내산화성이 낮은 금속 전극의 적층 형태로 인하여 동시 열처리 공정에 있어서 많은 제약이 따른다. 본 연구에서는 소결온도를 대폭 낮춘 저온 소결용 PZT 압전체 테이프를 니켈 금속 포일에 적층하여 동시 열처리를 통하여 소결을 시도하였다. 동시 열처리된 MIM 디바이스의 세라믹과 금속 전극 계면의 미세구조 및 성분 분석을 통하여 계면 반응 기구를 확인하였고, 계면 반응층이 디바이스의 특성에 미치는 영향에 대한 정량적 분석을 수행하였다. 또한 열처리 시간에 따른 계면 반응층의 변화를 관찰하고 반응층의 변화가 특성에 미치는 영향을 분석하였다. 니켈 이외에 니켈 합금인 INCONEL 718과 PZT 세라믹과의 동시 소성을 시도하여 니켈, INCONEL 두 금속 기판과 PZT 사이에 생성되는 계면 반응층의 미세구조와 특성의 차이점을 비교하였고 디바이스로서 사용하기 위한 적합성 여부를 확인하였다.

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$alpha-Si$의 contact hole 수의 증가에 따른 MIM antifuse의 전기적 특성 (Electrical characteristics of MIM antifuse with contact hole numbers of $alpha-Si$.)

  • 이상기;김용주;임원택;이동윤;권오경;이창효
    • 한국진공학회지
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    • 제4권1호
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    • pp.46-50
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    • 1995
  • 물성을 달리한 $\alpha$-Si을 사용하여 MIM(Metal-Insulator-Metal)구조의 antifuse들을 제작하고, 물성의 변화에 따른 전기적 특성의 변화를 조사하였다. $\alpha$-Si은 PECVD (Plasma Enhanced Chemical Vapor Deposition)방법으로 증착하였으며, 물성은 RF power를 달리하여 변화시켰다. $\alpha$-Si MIM구조의 antifuse를 프로그램할 때 생기는 failure rate를 줄이기 위해 전극 사이에 삽입되는 $\alpha$-Si의 contact hole 크기와 개수를 변화시켜 보았다. MIM antifuse는 contact hole이 2개 이상일 때 failure rate가 10% 이내로 줄었으며, 프로그래밍 전류는 거의 변화가 없었다. 항복전압은 10-11V범위에 집중적으로 분포하였으며, 5V에서의 누설전류는 contact hole의 수가 증가함에 따라 커짐을 알았다.

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나노스케일 소자제작을 위한 유기초박막의 전기적특성에 관한 연구 (A Study on the Electrical Properties of Organic Ultra Thin Films for Nanoscale Device Manufacture)

  • 송진원;한창수;이경섭
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.384-385
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    • 2005
  • Monolayers of lipids on a water surface have attracted much interest as models of biological membranes, but also as precursors of multilayer systems promising many technical applications. Until now, many methodologies have been developed in order to gain a better understanding of the relationship between the structure and function of the monolayers. Maxwell displacement current (MDC) measurement has been employed to study the dielectric property of Langmuir-films. MDC flowing across monolayers is analyzed using a rod-like molecular model. It is revealed that the dielectric relaxation time $\tau$ of mono layers in the isotropic polar orientational phase is determined using a liner relationship between the monolayer compression speed a and the molecular area $A_m$. Compression speed a was about 30, 40, 50mm/min. also, LB layers of Arachidic acid deposited by LB method were deposited onto slide glass as Y-type film. The structure of manufactured device is Au/Arachidic acid/Al, the number of accumulated layers are 9 ~ 21 and we then examined of the Metal-Insulator-Metal(MIM) device by means of I-V.

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