• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.950-952
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• 2003

This paper have been studied fabrication and characteristics of disposable pH sensor using MEMS technology. The sensor has two open-well structure, the container for the internal electrolyte and electrode were formed by anisotropically etching a silicon substrate. unlike currently used KCI saturated solution, the structure was introduced hydrogel which take an advantage of miniaturization, bulk product, a low price. PU and CA/TP used to measurement ion detection, one is reference membrane and the other is pH. fabricated sensor is encapsulated entirely with epoxy, finally sensor was estimated various ion sorts and pH ranges.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.317-322
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• 2010

This paper reports the fabrication and characterization of surface micromachined poly 3C-SiC capacitive pressure sensors on silicon wafer operable in touch mode and normal mode for high temperature applications. FEM(finite elements method) simulation has been performed to verify the analytical mode. The sensing capacitor of the capacitive pressure sensor is composed of the upper metal and the poly 3C-SiC layer. Measurements have been performed in a temperature range from $25^{\circ}C$ to $500^{\circ}C$. Fabrication process of designed poly 3C-SiC touch mode capacitive pressure sensor was optimized and would be applicable to capacitive pressure sensors that are required high precision and sensitivity at high pressure and temperature.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.511-512
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• 2008

Micro-pads made of PDMS(polydimethylsiloane) can be mechanical shock or vibration absorber because of its contractibility. Fabrication of micro-pads and techniques of separation from substrate and attachment to new substrate are developed. Three micron thick PDMS pads were fabricated by imprinting lithography.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.43-44
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• 2005

SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image is desired. But SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination. Based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factional design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.990-995
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• 2005

This paper reports the fabrication and characterization of $5\;\times\;5$ thermal cantilever array for nano-scaled memory device application. The $5\;\times\;5$ thermal cantilever array with integrated tip heater has been fabricated with MEMS technology on SOI wafer using 7 photo masking steps. All single-level cantilevers have a diode in order to eliminate any electrical cross-talk between adjacent tips. Electrical measurements of fabricated thermal cantilever away show its own thermal heating mechanism. Thermal heating is demonstrated by the reflow of coated photoresist on the cantilever array surface.

• Journal of information and communication convergence engineering
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• v.3 no.4
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• pp.191-194
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• 2005

SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image are desired. However SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination, based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factorial design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.373-374
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• 2007

The amorphous silicon microbolometer array has been developed by the MEMS design and fabrication technology. Before the bolometer array for the image sensor being designed, the structure of unit cel I and 16x16 array of it was simulated, designed and fabricated. The properties of bolometer have been measured as such that the TCR and thermal time constant can be achieved -2 %/K and 1.4 msec respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.376-379
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• 2003

In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.

• KSTLE International Journal
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• v.8 no.2
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• pp.26-28
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• 2007

Si(100) surfaces were topographically modified i.e. the surfaces were patterned at micro-scale using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterned shapes included micro-pillars and microchannels. After the fabrication of the patterns, the patterned surfaces were chemically modified by coating a thin DLC film. The surfaces were then evaluated for their friction behavior at micro-scale in comparison with those of bare Si(100) flat, DLC coated Si(100) flat and uncoated patterned surfaces. Experimental results showed that the chemically treated (DLC coated) patterned surfaces exhibited the lowest values of coefficient of friction when compared to the rest of the surfaces. This indicates that a combination of both the topographical and chemical modification is very effective in reducing the friction property. Combined surface treatments such as these could be useful for tribological applications in miniaturized devices such as Micro-Electro-Mechanical-Systems (MEMS).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.237-240
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• 2005

The demand of micro electrical mechanical system (MEMS) bio/chemical sensor is rapidly increasing. To prevent the contamination of sensing area, a filtration system is required in on-chip total analyzing MEMS bio/chemical sensor. A nano-filter was mainly applied in some application detecting submicron feature size bio/chemical products such as bacteria, fungi and so on. We suggested a simple nano-filter fabrication process based on replication process. The mother pattern was fabricated by holographic lithography and reactive ion etching process, and the replication process was carried out using polymer mold and UV-imprinting process. Finally the nano-filter is obtained after removing the replicated part of metal deposited replica. In this study, as a practical example of the suggested process, a nano-dot array was replicated to fabricate nano-filter fur bacteria sensor application.