• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1468-1469
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• 2008

기상관측 분야에서는 풍속센서의 소형화 요구가 커지고 있어 Air flow sensor를 이용한 MEMS(Micro Electro Mechanical System) 풍향 풍속센서의 응용연구가 활발하다. MEMS 풍향 풍속 센서는 수 mm 크기를 가지면서도 바람의 세기와 함께 방향을 측정하여야 하는데, 센서 칩이 노출되어 있어 외부환경으로부터 영향을 받기 때문에 센서소자의 내오염성과 내구성 확보가 중요하다. 따라서 본 연구에서는 절연막으로 비점착성의 테프론 막을 적용하여 외부환경으로부터 영향을 줄일 수 있는 열감지 방식의 MEMS 풍향 풍속 센서 칩을 제작하였다. 테프론 코팅막을 이용한 풍향 풍속 센서는 0.1m/s의 resolution을 가지며, 최대 15m/s까지 측정이 가능하여, 오염에 강하고 발수성을 센서를 제작하였다.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• International Journal of Air-Conditioning and Refrigeration
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• 제15권2호
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• pp.70-77
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• 2007

As electric and mechanical devices have been miniaturized and highly integrated, heat generation per unit volume has been greatly increased. Therefore, effective cooling methods for micro and miniature systems have emerged as critical issues nowadays and a lot of studies have been carried out to find an optimum cooling strategy. This paper reviews recent researches on the cooling technologies which are mainly based on micro-fabrication processes. Design, development, experiments and numerical analysis of various cooling devices are discussed and their characteristics, problems and advantages are compared.

• 소성∙가공
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• 제13권3호
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• pp.285-289
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• 2004

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권4호
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• pp.280-287
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• 2002

We present technical issues involved in the development of actuators and sensors for applications to high-precision Micro Electro Mechanical System (MEMS). The technical issues include fabrication uncertainty and noise disturbance, causing major difficulties for MEMS to achieve high-precision actuation and detection functions. For nano-precision actuators, we solve the fabrication instability and electrical noise problems using digital actuators coupled with nonlinear mechanical modulators. For the high-precision capacitive sensors, we present a branched finger electrodes using high-amplitude anti-phase sensing signals. We also demonstrate the potential applications of the nanoactuators and nanodetectors to high-precision positioning MEMS.

• 한국의학물리학회지:의학물리
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• 제24권1호
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• pp.61-67
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• 2013

본 연구팀은 호흡 훈련을 통해 호흡의 안정성과 재현성을 증대시킴으로써 환자 적용 범위를 넓히고자 미세전자기계시스템(micro-electro-mechanical system, MEMs) 가속도 센서를 이용한 새로운 호흡훈련시스템을 개발하고자 한다. 본 연구는 호흡동작 모니터링의 선형연구로 MEMS 센서의 성능평가를 Respiratory Gating Platform (RGP)을 이용하여 2.5, 3.0, 3.5 s/cycle의 속도와 4.0, 3.0, 2.0 cm을 진폭으로 하는 1차원 왕복운동에 대한 MEMS 가속도 센서의 순간중력가속도에 대한 반응을 측정하였고 이를 Varian RPM (real time patient monitoring system) 시스템과 비교하였다. RGP의 운동 주기에 대한 MEMS 가속도 센서의 주기 오차는 0.6~6.0%로 측정되었으며 RPM 시스템과 MEMS 가속도 센서에 대한 진폭 감도오차는 1%와 3.6~11.5%로 측정 되었다. 본 연구를 통하여 MEMS 가속도 센서에 대한 환자 호흡 훈련용으로서의 가능성을 확인할 수 있었다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.379-382
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• 2007

The MEMS (Micro Electro Mechanical Systems) process is used in a micro/nano pattern manufacturing method. This method is based on the lithography technology. But the MEMS process has some problems such as complicated process, long processing time and high production costs. Many researchers are doing research in substitute manufacturing method to work out a solution to these problems. In this paper, we apply a dieless incremental forming technology to a substitute method of MEMS process. This dieless forming technology is using in the commercial scale sheet forming such as a prototype of automobile sheet parts. 5-axes CNC (Computerized Numeric Control) method are applied in this system to get a micro-scale dieless forming results. These 5-axes system are composed of precision AC servo motor stages (4-axes) and PZT actuator (1-axis). A PZT actuator is used in a precision actuating axis because it can be operated in the nano scale stroke resolution. This micro dieless incremental forming system has the advantage of minimization in manipulating distance and working space. As equipment and tools become smaller in size, minute inertia force and high natural frequency can be obtained. Therefore, high precision forming performance can be obtained. This allows the factory to quickly provide the customer with goods because the manufacturing system and process are reduced. To construct this micro manufacturing system, many technologies are necessary such as high stiffness frame, high precision actuating part, structural analysis, high precision tools and system control. To achieve the optimal forming quality, the micro dieless forming system is designed and made with high stiffness characteristic.

• E2M - 전기 전자와 첨단 소재
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• 제17권8호
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• pp.25-32
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• 2004

센서는 인간의 오감에 해당하는 감지기로서 온도, 소리, 빛 등의 물리, 화학적 신호를 전기적 신호로 변환시켜주는 일련의 장치를 말한다. 물론 센서에 대한 정의 및 분류 방법은 다양하게 표현될 수 있으나 본 논문에서는 MEMS(Micro Electro-Mechanical System) 기술을 적용하여 Smart화 혹은 Wireless화에 필요한 Micro 센서로 그 범위를 한정하고자 한다. 만일 센서를 아주 작게(Micro Sensor) 만들 수 있고 그것들끼리 무선으로 연결될 수(Wireless Network) 있다면 우리의 삶의 형태는 지금과는 매우 다른 모습으로 전개 될 것이다. 그림 1은 2004년에 정보통신부가 발표한 Ubiquitous Sensor Network의 개념도이다.(중략)

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.75-78
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• 1995

This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.