• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.2
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• pp.149-155
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• 2015

MEMS-based louver and shutter type conventional variable emissivity radiators change their emissivity properties in accordance with a temperature condition to achieve efficient thermal control performance. However, there are some drawbacks such as a structural safety of the mechanical moving parts under sever launch environment and constant power consumption to maintain the intended emissivity. In this study, to overcome above drawbacks, we proposed a MEMS-based variable emissivity radiator, which can change the emissivity property according to the polarity change of electrodes by using electric charge of the bead. The effectiveness of the optimized radiator design has been demonstrated through the comparison of efficiency with the fixed emissivity radiator.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.5
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• pp.532-538
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• 2004

MEMS technology applying to the sensors and micro-electro devices is complete system. These microsystems are made by variable processes. Especially, the mentallization process has very important functions to transfer the power operating the sensor and signal induced from sensor part. But in the structures of MEMS the local stress concentration and deformation are often yielded by an irregular geometrical shape and different constraint. Therefore, this paper studies the effect of supporting type and thickness ratio about thin film of the substrate on the residual stress variation when the thermal loads is applied to the multi-layer thin film fabricated by metallization process. Specimens were made from several materials such as Al, Au and Cu. Then, uniform thermal load was applied, repeatedly. The residual stress was measured by FE Analysis and nano-indentation method using AFM. Generally, the specimen made of Al induced the larger residual stress than that of made of other materials. Specimen made of Cu and Au having the low thermal expansion coefficient induces the minimum residual stress. Similarly, the lowest indentation length was measured by nano-indentation method in the Si/Au/Cu specimen. Particularly, clusters are created in the specimen made of Cu by thermal load and the indentation length became increasingly large by cluster formation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.6
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• pp.445-450
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• 2012

We have developed an implantable wireless sensor for real time pressure monitoring of blood circulation system. MEMS (micro-electro-mechanical system) technology was adopted as a sensor development method. The sensor is composed of photolithographically patterned inductors and a distributed capacitor in gap between the inductors. A resulting LC resonant system produces its resonant frequency in range of 269 to 284 MHz at 740 mmHg. To read the resonant frequency changed by blood pressure variation, we developed a custom readout system based on a network analyzer functionality. The bench-top testing of the pressure sensors showed good mechanical and electrical functionality. A sensor was implanted into tibial artery of farm pig, and interrogated wirelessly with accurate readings of blood pressure. After 45 days, the sensor's electrical response and histopathology were studied with good frequency reading and biocompatibility.

• Advances in nano research
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• v.15 no.2
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• pp.155-163
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• 2023

Exercise is beneficial to the body in some ways. It is vital for people who have heart problems to perform exercise according to their condition. This paper describes how an Android platform can provide early warnings of fatigue during wushu exercise using Photoplethysmography (PPG) signals. Using the data from a micro-electro-mechanical system (MEMS) gyroscope to detect heart rate, this study contributes an algorithm to determine a user's fatigue during wushu exercise. It sends vibration messages to the user's smartphone device when the heart rate exceeds the limit or is too fast during exercise. The heart rate monitoring system in the app records heart rate data in real-time while exercising. A simple pulse sensor and Android app can be used to monitor heart rate. This plug-in sensor measures heart rate based on photoplethysmography (PPG) signals during exercise. Pulse sensors can be easily inserted into the fingertip of the user. An embedded microcontroller detects the heart rate by connecting a pulse sensor transmitted via Bluetooth to the smartphone. In order to measure the impact of physical activity on heart rate, Wushu System tests are conducted using various factors, such as age, exercise speed, and duration. During testing, the Android app was found to detect heart rate with an accuracy of 95.3% and to warn the user when their heart rate rises to an abnormal level.

• The Magazine of the IEIE
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• v.24 no.10
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• pp.23-44
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• 1997

이 글에서는 요즘 신문이나 텔레비전을 통해서 인체 내부를 돌며 검사 및 치료를 하는 마이크로 로보트 등의 차세대 첨단기술로서 일반 국민들에게 소개되기도 하며, MEMS, 마이크로머신, 마이크로시스템, 혹은 초소형 정밀기계 등으로 불리는 기술과 이 기술에 대한 각국 (미국, 일본, 유럽, 한국)의 기술 동향을 소개한다. 이에 이어서, 현재 과기처의 선도기술개발사업 (소위 G7사업) 으로서 진행되고 있는 초소형 정밀기계 기술개발 사업에 대한 소개를 한다. 이 분야에 종사하지 않는 보통 사람들을 위해 가급적 쉬운 말로 풀어 쓰도록 노력하였다. 이 글에서 다루고 있는 크기의 기본 단위는 마이크로미터 (천분의 일 밀리미터) 이며, 사람의 머리카락의 직경이 약 100 마이크로미터 (0.1mm) 내외이다. 초소형 기계나 초소형 부품들은 대개 이 머리카락의 직경정도이며, 머리카락속에 모터나 기어 등이 들어있다고 생각해도 크게 틀리지 않을 것이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05e
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• pp.77-80
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• 2003

MEMS(Micro Electro Mechanical System) 기술에서 실리콘 식각기술의 중요성으로 플라즈마 식각기술의 개발이 꾸준히 진행되고 있다. 이중에서 ICP(Inductive Coupled Plasma)는 기존의 증착장치에 유도결합식 플라즈마를 추가로 발생시켜 증착막의 특성을 획기적으로 개선시키는 가장 최근에 개발된 기술이며, 이용에너지를 증가시키지 않고도 이용밀도를 높이고 이용업자들에 방향성을 가할 수 있는 새로운 플라즈마 기술로, 주로 MEMS 제조공정에 응용되고 있다. 본 연구에서는 STS-ICP $ASE^{HR}$을 이용하여 식각과 증착공정을 반복하여 식각을 하는 Bosch 식각에 관하여 연구하였다 STS-ICP $ASE^{HR}$ 장비의 Platen power, Coil power 및 Process pressure에 다양한 변화를 주어 각 변수에 따른 식각속도를 관찰하였다. 각 공정별 변수를 변화시킨 결과 Platen power 12W, Coil power 500W, 식각/Passivation Cycle 6/7sec 일 경우 식각속도는 $1.2{\mu}m$/min 이었고, Sidewall profile은 $90{\pm}0.7^{\circ}$로 나타나 매우 우수한 결과를 보였다.

• International Journal of Aeronautical and Space Sciences
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• v.11 no.3
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• pp.234-239
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• 2010

The utilization of micro-electro-mechanical system (MEMS) gyros and accelerometers in low-level inertial measurement unit (IMU) influences cost effectiveness in a positive way under the condition that device error characteristics are fully calibrated. The conventional calibration process utilizes a rate table; however, this paper proposes a new method for achieving reference calibration data from the natural motion of pendulum to which the IMU undergoing calibration is attached. This concept was validated with experimental data. The pendulum angle measurements correlate extremely well with the solutions acquired from the pendulum equation of motion. The calibration data were computed using the regression method. The whole process was validated by comparing the measurement from the 6 sensor components with the measurements reconstructed using the identified calibration data.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.12 s.105
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• pp.1355-1360
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• 2005

Periodic structures can be applied as a MEMS(micro-electro-mechanical system) sensor or actuator due to low energy loss and wideband frequency response. The dynamic behavior of a mistuned periodic structure Is dramatically changed from that of a perfectly tuned periodic structure. The effects of mistuning, coupling stiffness, and driving point on the forced vibration responses of a simple periodic structure ate investigate4 through numerical simulations. On the basis of that, one can design effective and reliable MEMS components using periodic structures.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.557-560
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• 2000

Combination of SDB(Si-wafer Direct Bonding) and electrochemical etch-stop in TMAH anisotropic etchant can be used to create a variety of MEMS(Micro Electro Mechanical System). Especially, fabrication of SDB SOI structures using electrochemical etch-stop is accurate method to fabrication of 3D(three-dimensional) microstructures. This paper describes on the fabrication of SDB SOI structures with sealed cavity for MEMS applications and thickness control of active layer on the SDB SOI structure by electrochemical etch-stop. The flatness of fabricated SDB SOI structure is very uniform and can be improved by addition of TMAH to IPA and pyrazine.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.