• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.125-129
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• 2004

[ $BaTi_4O_9$ ] thin film were grown on $Pt/Ti/SiO_2/Si$ substrate using rf magnetron sputter, and the microstructure and dielectric properties of the thin films were investigated. For the film grown at $350^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$, the $BaTi_5O_{11}$ Phase was formed. However, the $BaTi_4O_9$ phase was formed when the growing temperature exceeded $450^{\circ}C$ The dielectric constant of the $BaTi_4O_9$ thin film grown at $550^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$ was about 40 at low frequency range($100kHz{\sim}1MHz$) and 36 at microwave range($1{\sim}10GHz$) which is very close to that of the bulk $BaTi_4O_9$ phase. The dissipation factor was very low, about 0.005 at low frequency as well as microwave range.

• 한국세라믹학회지
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• 제32권7호
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• pp.761-768
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• 1995

Double layered BaTiO3 thin films with high dielectric constant as well as good insulating property were prepared for the application to low voltage driving thin film electroluminescent (TFEL) device. BaTiO3 thin films were formed by rf-magnetron sputtering technique. Amorphous and polycrystalline BaTiO3 thin films were deposited at the substrate temperatures of room temperature and 55$0^{\circ}C$, respectively. Two kinds of films prepared under these conditions showed high resistivity and high dielectric constant. The figure of merit (=$\varepsilon$r$\times$Eb.d) of polycrystalline BaTiO3 thin film was very high (8.43$\mu$C/$\textrm{cm}^2$). The polycrystalline BaTiO3 showed a substantial amount of leakage current (I), under the high electric field above 0.5 MV/cm. The double layered BaTiO3 thin film, i.e., amorphous BaTiO3 layer coated polycrystalline BaTiO3 thin film, was prepared by the new stacking method and showed very good dielectric and insulating properties. It showed a high dielectric constant fo 95 and leakage current density of 25 nA/$\textrm{cm}^2$ (0.3MV/cm) with the figure of merit of 20$\mu$C/$\textrm{cm}^2$. The leakage current density in the double layered BaTiO3 was much smaller than that in polycrystalline BaTiO3 under the high electric field. The saturated brightness of the devices using double layered BaTiO3 was about 220cd/$m^2$. Threshold voltage of TFEL devices fabricated on double layered BaTiO3 decreased by 50V compared to the EL devices fabricated on amorphous BaTiO3.

• Macromolecular Research
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• 제11권1호
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• pp.9-13
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• 2003

Poly (vinylidene fluoride) (PVDF) samples were implanted by using high energy (MeV)F$^{2+}$ and Cl$^{2+}$ ions. We observed that AC dielectric constant of the ion-implanted PVDF samples decreased from 10.5 to 2.5 at 1 kHz as the ion dosage increased from 10$^{11}$ to 3 $\times$ 10$^{14}$ ions/$\textrm{cm}^2$. From differential scanning calorimetry experiments, we observed that PVDF samples become more disordered state through the ion implantation. The decrease of the number of bonding of C-H and C-F and the increase of unsaturated bonding were observed from X-ray photoelectron spectroscopy experiments. The emission of HF and H$_2$ molecules during the ion implantation was detected by residual gas analyzer spectrum. Based upon the results, we analyzed that the low AC dielectric constant of the MeV ion-implanted PVDF samples originated from the reduction of polarization due to the structural change of the CF$_2$ molecules in the MeV ion-implanted PVDF samples.les.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.7-9
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• 2006

$(BaSr)TiO_3$ thick films were prepared by tape casting method using $BaTiO_3$ and $SrTiO_3$ powder slurry in order to investigate dielectric properties and low temperature sintering. Sintering density was $5.7\;g/cm^3$ and the BST sample exhibited the maximum dielectric constant, tunability at temperatures near phase transition point. The dielectric constant was increased and curie temperature was shifted to higher temperature with increasing of annealing temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.290-291
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• 2007

In this study, in order to develop low temperature sintering ceramics for multilayer piezoelectric actuator, sensers, transducers, PMN-PNN-PZT ceramics were manufacrtured with the sintering temperature, and their piezoelectric and dielectric properties were investigated. At the composition ceramics sintered at $900^{\circ}C$, desity, dielectric constant$({\varepsilon}_r)$, electromechanical coupling factor(kp), piezoelectric constant$(d_{33})$ and mechanical quality factor(Qm) showed the optimal value of $7.86g/cm^3$, 1417, 0.634, 410pC/N and 1138, respectively.

• 한국지반환경공학회 논문집
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• 제17권4호
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• pp.33-37
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• 2016

기존 뒤채움재의 대체방안으로 고려되는 유동성 채움재(Controlled Low Strength Material, CLSM)의 경화 특성 및 강도발현은 시공기간을 결정하는 주요 요소이다. 본 연구에서는 시간영역반사법(Time Domain Reflectometry, TDR)을 이용하여 유전상수를 도출함으로써 CSLM의 경화 특성을 모니터링하고, 산정된 유전상수와 일축압축강도간의 관계를 분석해보고자 하였다. CLSM 시료는 시멘트, 비회, 실트, 모래, 급결제 및 물로 배합되었으며 배합된 시료의 플로우, 단위중량, 일축압축강도와 같은 재료 특성을 조사하였다. 양생 기간 동안 CLSM의 유전율 특성을 모니터링하기 위하여 TDR 프로브가 설치된 몰드 및 Reflectometer를 이용하여 측정시스템을 구성하였다. 실험결과 유전상수는 양생 초기에 일정한 값을 유지하다, 시간이 진행됨에 따라 점차 감소하는 것으로 나타났다. 또한, 일축압축강도와 유전상수를 회귀분석한 결과 두 물성 사이에는 반비례적인 거듭제곱함수의 관계가 있음을 보여주었다. 본 연구에서 제안한 시간영역반사법을 이용한 CLSM의 특성 모니터링은 일축압축강도를 추정할 수 있는 현장 비파괴시험기법으로 효과적으로 사용될 수 있을 것으로 기대된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.662-665
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• 2002

The microwave dielectric properties and the microstructures of $Tm_2O_3$-modified $BiNbO_4$ ceramics were investigated. $Bi_{(1-x)}Tm_xNbO_4$ ceramics combined with orthorhombic and triclinic phases were identified at sintering temperatures of $920{\sim}960^{\circ}C$. The apparent density decreased slightly with the increasing Tm content. Regardless of the Tm content the dielectric constant $(\varepsilon_r)$ of all compositions except x=0.1 in $Bi_{(1-x)}Tm_xNbO_4$ ceramics saturated at the range of 42~44. The $Q{\times}f_0$ values of 6,000-12,000(GHz) were obtained for all compositions when the sintering temperatures were in the range of $920{\sim}960^{\circ}C$. The temperature coefficient of the resonant frequency$(\tau_f)$ can be also adjusted with increasing the amount of the doped Tm from a positive value of $+15ppm/^{\circ}C$ to a negative value of $-20ppm/^{\circ}C$. The $Bi_{(1-x)}Tm_xNbO_4$ ceramics can be possibly applied to multilayer microwave devices with low processing temperatures.

• 한국전자통신학회논문지
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• 제9권1호
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• pp.17-24
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• 2014

본 논문에서는 직접결합에 의한 저 위상잡음 유전체 공진기 설계를 위하여, 고유전율의 유전체 공진기와 마이크로스트립선로 사이의 결합계수에 대해 분석하였으며, 고유전율로 인한 Q값의 보완을 위한 병렬궤환 회로 적용한 유전체 공진 발진기의 위상잡음을 분석하였다. 유전체 공진기의 위상잡음 분석과 결합계수의 분석을 통하여 고안정 유전체 공진 발진기를 최적화 설계한 결과 20.25GHz 유전체 공진 발진기의 ${\epsilon}_r$=30인 유전체 공진기를 사용한 경우 결합계수가 약 3.6의 값을 나타낼 때 20.25GHz에서 위상잡음은 -84.3dBc/Hz@1KHz를 나타냄을 확인하였다. 본 연구의 결과로 K-Band 에서도 주파수 체배 방식에 의한 위상잡음 손실을 방지하는 직접결합 설계 방안을 제시하였다.

• 한국전기전자재료학회논문지
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• 제27권12호
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• pp.847-851
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• 2014

The characteristics of dielectric constant and $tan{\delta}$ of low viscosity silicone oils with changing degree of polymerization were investigated. The result shows dipole loss mechanism at low temperature range. The dielectric loss in the range of low frequencies are predominantly of ionic nature with temperature increase. The peak of dielectric loss is the detrapping of the electrons which is were trapped in the localized level of the silicone oils at the frequency of 30 kHz. The increase of ionic conduction is attributed to the presence of ionizable oxidation products and their increased dissociation feature. The activation energy ${\Delta}H$ and dipole moment ${\mu}_d$ were increased whit increasing degree of polymerization.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.71-71
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• 2012

As the critical dimensions of integrated circuits are scaled down, the line width and spacing between the metal interconnects are made smaller. The dielectric film used as insulation between the metal lines contributes to the resistance-capacitance (RC) time constant that governs the device speed. If the RC time delay, cross talk and lowering the power dissipation are to be reduced, the intermetal dielectric (IMD) films should have a low dielectric constant. The introduction of Cu and low-k dielectrics has incrementally improved the situation as compared to the conventional $Al/SiO_2$ technology by reducing both the resistivity and the capacitance between interconnects. Some of the potential candidate materials to be used as an ILD are organic and inorganic precursors such as hydrogensilsequioxane (HSQ), silsesquioxane (SSQ), methylsilsisequioxane (MSQ) and carbon doped silicon oxide (SiOCH), It has been shown that organic functional groups can dramatically decrease dielectric constant by increasing the free volume of films. Recently, various inorganic precursors have been used to prepare the SiOCH films. The k value of the material depends on the number of $CH_3$ groups built into the structure since they lower both polarity and density of the material by steric hindrance, which the replacement of Si-O bonds with Si-$CH_3$ (methyl group) bonds causes bulk porosity due to the formation of nano-sized voids within the silicon oxide matrix. In this talk, we will be introduce some properties of SiOC(-H) thin films deposited with the dimethyldimethoxysilane (DMDMS: $C_4H_{12}O_2Si$) and oxygen as precursors by using plasma-enhanced chemical vapor deposition with and without ultraviolet (UV) irradiation.