• 제목/요약/키워드: Linear Annealing Method

검색결과 37건 처리시간 0.028초

의사우도추정법에 의한 분산함수를 고려한 수위-유량 관계 곡선 산정법 개선 (Improvement of Rating Curve Fitting Considering Variance Function with Pseudo-likelihood Estimation)

  • 이우석;김상욱;정은성;이길성
    • 한국수자원학회논문집
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    • 제41권8호
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    • pp.807-823
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    • 2008
  • 수위-유량 관계 곡선을 나타내는 곡선식에 포함되어 있는 매개변수의 추정을 위해 많이 사용되는 로그선형 회귀분석은 잔차의 비등분산성(heteroscedasticity)을 고려하지 못하므로 본 연구에서는 의사우도추정법(pseudolikelihood estimation, P-LE)에 의해 분산함수를 추정하고 이와 함께 회귀계수를 추정할 수 있는 방법을 제시하였다. 이 과정에서 제시된 회귀잔차를 최소화하기 위하여 SA(simulated annealing)이라는 전역 최적화 알고리즘을 적용하였다. 또한 수위-유량 관계 곡선은 단면 등의 영향으로 인해 구간에 따라 각각 다르게 구축되어져야 하므로 이를 보다 객관적으로 판단하고 분리 위치를 추정하기 위하여 Heaviside 함수를 의사우도함수에 포함시켜 결과를 추정하도록 하였으며, 2개의 구간을 가지는 유량자료를 이용하여 제시된 방법의 합리성을 통계적으로 실험하였다. 이와 같이 통계적 실험을 통해 제시된 방법들이 기존 방법과 비교하여 가질 수 있는 장점을 파악하였으며, 제시된 방법들을 금강유역 5개 지점에서 대해 수행하여 효율성을 검증하였다.

선형가열기를 이용한 SillSiO2/Si3N4llSi 이종기판쌍의 직접접합 (Direct Bonding of SillSiO2/Si3N4llSi Wafer Fairs with a Fast Linear Annealing)

  • 이상현;이상돈;송오성
    • 한국전기전자재료학회논문지
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    • 제15권4호
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    • pp.301-307
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    • 2002
  • Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

유리재단 문제에 대한 분산 합성 알고리즘 (A Distributed Hybrid Algorithm for Glass Cutting)

  • 홍철의
    • 디지털콘텐츠학회 논문지
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    • 제19권2호
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    • pp.343-349
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    • 2018
  • 본 논문에서는 유리재단 문제에 평균장 어닐링과 시뮬레이션된 어닐링 형태의 유전자 알고리즘을 결합한 합성 알고리즘을 분산 처리하여 적용한다. 유리재단 문제는 2차원 2진 패킹 문제로 주어진 원판에 요구되는 사각형 모양의 패턴들을 버려지는 부분이 최소가 되게 배치하는 조합 최적화 문제이다. 제안된 합성 알고리즘은 유전자 알고리즘의 다양한 연산자에 시뮬레이션된 어닐링의 온도개념을 추가하여 평균장 알고리즘에 의한 빠른 평형상태 도달을 유지하게 하였다. MPI를 이용한 분산 합성 알고리즘을 유리재단 문제에 적용하여 실험한 결과 기존의 평균장 어닐링 또는 유전자 알고리즘을 단독으로 사용하였을 때보다 최적의 배치 상태를 나타내었으며 최적해 접근 특성을 유지하면서 문제의 크기에 대하여 선형적인 수행시간 단축을 보여 주었다.

Subset selection in multiple linear regression: An improved Tabu search

  • Bae, Jaegug;Kim, Jung-Tae;Kim, Jae-Hwan
    • Journal of Advanced Marine Engineering and Technology
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    • 제40권2호
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    • pp.138-145
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    • 2016
  • This paper proposes an improved tabu search method for subset selection in multiple linear regression models. Variable selection is a vital combinatorial optimization problem in multivariate statistics. The selection of the optimal subset of variables is necessary in order to reliably construct a multiple linear regression model. Its applications widely range from machine learning, timeseries prediction, and multi-class classification to noise detection. Since this problem has NP-complete nature, it becomes more difficult to find the optimal solution as the number of variables increases. Two typical metaheuristic methods have been developed to tackle the problem: the tabu search algorithm and hybrid genetic and simulated annealing algorithm. However, these two methods have shortcomings. The tabu search method requires a large amount of computing time, and the hybrid algorithm produces a less accurate solution. To overcome the shortcomings of these methods, we propose an improved tabu search algorithm to reduce moves of the neighborhood and to adopt an effective move search strategy. To evaluate the performance of the proposed method, comparative studies are performed on small literature data sets and on large simulation data sets. Computational results show that the proposed method outperforms two metaheuristic methods in terms of the computing time and solution quality.

Evolution Strategy를 이용한 선형 동기 전동기의 최적 형상 설계 (Optimum pole shape design of linear synchronous motor by Evolution Strategy)

  • 전대영;김동수;차귀수;한송엽
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1993년도 하계학술대회 논문집 B
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    • pp.932-934
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    • 1993
  • Optimum pole shape is designed to increase the levitation and propulsion force of magnetic levitation systems. Evolution Strategy is introduced as optimization method. Evolution Strategy is random based non-deterministic method, developed by combining Genetic Algorithm with Simulated Annealing. Trasnsrapid-06, which was developed in Germany, is referenced model to be analyze. Design variables are nodes which determine fields pole shape of a linear synchronous motor, and the model analyzed by F.E.M.

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A Novel RGB Image Steganography Using Simulated Annealing and LCG via LSB

  • Bawaneh, Mohammed J.;Al-Shalabi, Emad Fawzi;Al-Hazaimeh, Obaida M.
    • International Journal of Computer Science & Network Security
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    • 제21권1호
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    • pp.143-151
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    • 2021
  • The enormous prevalence of transferring official confidential digital documents via the Internet shows the urgent need to deliver confidential messages to the recipient without letting any unauthorized person to know contents of the secret messages or detect there existence . Several Steganography techniques such as the least significant Bit (LSB), Secure Cover Selection (SCS), Discrete Cosine Transform (DCT) and Palette Based (PB) were applied to prevent any intruder from analyzing and getting the secret transferred message. The utilized steganography methods should defiance the challenges of Steganalysis techniques in term of analysis and detection. This paper presents a novel and robust framework for color image steganography that combines Linear Congruential Generator (LCG), simulated annealing (SA), Cesar cryptography and LSB substitution method in one system in order to reduce the objection of Steganalysis and deliver data securely to their destination. SA with the support of LCG finds out the optimal minimum sniffing path inside a cover color image (RGB) then the confidential message will be encrypt and embedded within the RGB image path as a host medium by using Cesar and LSB procedures. Embedding and extraction processes of secret message require a common knowledge between sender and receiver; that knowledge are represented by SA initialization parameters, LCG seed, Cesar key agreement and secret message length. Steganalysis intruder will not understand or detect the secret message inside the host image without the correct knowledge about the manipulation process. The constructed system satisfies the main requirements of image steganography in term of robustness against confidential message extraction, high quality visual appearance, little mean square error (MSE) and high peak signal noise ratio (PSNR).

반도체 소자용 SBT 박막의 전기적특성 (The Electrical Properties of SBT Thin Film for Semiconductor Device)

  • 오용철;조춘남;김진사;신철기;홍진웅
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 제5회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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    • pp.86-89
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    • 2003
  • SBT thin film for semiconductor device that is made by RF magnetron sputtering method studied electrical properties under various temperature condition. Dielectric constant who differ annealing condition appears highest in $750[^{\circ}C]$ and it is 213. Also, C-V properties by annealing temperature of SBT thin film for semiconductor device is no change almost to $600[^{\circ}C]$ and shows non-linear butterfly shape more than $650[^{\circ}C]$ Maximum capacitance and difference of smallest capacitance show the biggest difference in $750[^{\circ}C]$ as degree that domain wall motion contributes in ferrelectric polarization value in C-V characteristic curve of ferroelectric that this shows typical ferroelectric properties. Therefore, SBT thin film for semiconductor device that is annealing in $750[^{\circ}C]$ expressed the most superior electrical and ferroelectric properties.

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패턴 주변의 소성변형현상을 제거한 고품위 불연속패턴 가공기술 개발 (Development of machining technology for non-continuous pattern removing plastic deformation around pattern)

  • 전은채;제태진;장성환
    • 한국기계가공학회지
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    • 제9권6호
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    • pp.1-6
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    • 2010
  • Patterned optical components are widely used for optical products such as LCD and lighting. Since CCFL was used as a light source in the products, prism films having linear continuous optical patterns were widely used. However, LED which is a dot light source is popular recently, therefore, the optical products need new optical components having non-continuous optical patterns. Indentation machining method is a powerful method for machining of non-continuous pattern. When a copper mold and a brass mold were machined by this method, severe plastic deformation called pile-up was observed around the patterns. Since pile-up has negative relationship to ductility, this deformation can be eliminated by annealing treatment which makes the materials ductile. No plastic deformation occurred when machined after annealing at $600{^{\circ}C}$ and $575{^{\circ}C}$ for copper and brass, respectively. Finally, non-continuous optical patterns with high quality were machined on a copper mold and a brass mold successively.

분산 시뮬레이티드 어닐링을 이용한 복합 재료 재단 (Composite Stock Cutting using Distributed Simulated Annealing)

  • 홍철의
    • 한국정보과학회논문지:소프트웨어및응용
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    • 제29권1_2호
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    • pp.20-29
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    • 2002
  • 복합 재료로 구성된 원판으로부터 여러 가지 패턴을 버려지는 부분이 최소화되게 배치시킨 후 절단하는 문제를 복합 재료 재단 문제라 부른다. 본 논문은 목적 함수의 비용 오류를 감내하는 영역 분할 분산 시뮬레이티드 어닐링 알고리즘을 MPI 환경하에서 복합 재료 재단 문제에 적용한다. 비용 오류 감내기법은 최적해 접근 특성을 유지하기 위하여 스트림 길이를 동적으로 변화하며 상태변환을 비동기적으로 수행한다. 또한 복합 재료 재단 도구 개발을 위한 여러 가지 모양을 가진 패턴의 정보 및 친화도 생성, 목적함수, 상태변환 방법, 어닐링 스케줄 및 이를 위한 효율적인 자료 구조에 대하여 정의한다. 배치될 패턴은 정형이나 convex 다각형으로 제한되어 있지 않고 어떠한 모양도 가능하며 원판은 복합 재료의 성격상 2 또는 4 방향으로 고정되어 있다.