Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)
- 2000.11a
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- Pages.43-44
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- 2000
Direct bonding of $Si(100)/Si_3N_4{\parallel}Si(100)$ wafers using fast linear annealing method
선형열처리를 이용한 $Si(100)/Si_3N_4{\parallel}Si(100)$ 기판쌍의 직접접합
Abstract
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