• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.361-367
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• 2001

Recently, Chemical Mechanical Polishing(CMP) has become a leading planarization technique as a method for silicon wafer planarization that can meet the more stringent lithographic requirement of planarity for the future submicron device manufacturing. The SOI(Silicon On Insulator) wafer has received considerable attention as bulk-alternative wafer to improve the performance of semiconductor devices. In this paper, the objective of study is to investigate Material Removal Rate(MRR) and surface micro-roughness effects of slurry and pad in the CMP process. When particle size of slurry is increased, Material Removal rate increase. Surface micro-roughness is greater influenced by pad than by particle size of slurry. As a result of AM measurement, surface micro-roughness was improved from 27 $\AA$ Rms to 0.64 $\AA$Rms.

• Smart Structures and Systems
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• v.32 no.3
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• pp.135-151
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• 2023

Using 3D asphalt pavement surface data, a deep and multiscale network named CrackNet-M is proposed in this paper for pixel-level crack detection for improvements in both accuracy and robustness. The CrackNet-M consists of four function-specific architectural modules: a central branch net (CBN), a crack map enhancement (CME) module, three pooling feature pyramids (PFP), and an output layer. The CBN maintains crack boundaries using no pooling reductions throughout all convolutional layers. The CME applies a pooling layer to enhance potential thin cracks for better continuity, consuming no data loss and attenuation when working jointly with CBN. The PFP modules implement direct down-sampling and pyramidal up-sampling with multiscale contexts specifically for the detection of thick cracks and exclusion of non-crack patterns. Finally, the output layer is optimized with a skip layer supervision technique proposed to further improve the network performance. Compared with traditional supervisions, the skip layer supervision brings about not only significant performance gains with respect to both accuracy and robustness but a faster convergence rate. CrackNet-M was trained on a total of 2,500 pixel-wise annotated 3D pavement images and finely scaled with another 200 images with full considerations on accuracy and efficiency. CrackNet-M can potentially achieve crack detection in real-time with a processing speed of 40 ms/image. The experimental results on 500 testing images demonstrate that CrackNet-M can effectively detect both thick and thin cracks from various pavement surfaces with a high level of Precision (94.28%), Recall (93.89%), and F-measure (94.04%). In addition, the proposed CrackNet-M compares favorably to other well-developed networks with respect to the detection of thin cracks as well as the removal of shoulder drop-offs.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.175-175
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• 1999

Circumventing problems lying in the conventional lithographic techniques, we devised a new method for the fabrication of nanometer scale metal wires inspired by the unique characteristics of carbon nanotubes (CNTs). Since carbon nanotubes could act as masks when CNT-coated thin Au/Ti layer on a SiO2 surface was physically etched by low energy argon ion bombardment 9ion milling), Au/Ti nano-wires were successfully formed just below the CNTs exactly duplicating their lateral shapes. Cross-sectional analysis by transmission electron microscopy revealed that the edge of the metal wire was very sharply developed indicating the great difference in the milling rates between the CNTs and the metal layer as well as the good directionality of the ion milling. We could easily find a few nanometer-wide Au/Ti wires among the wires of various width. After the formation of nano-wires, the CNTs could be pushed away from the metal nano-wire by atomic force microscopy, The lateral force for the removal of the CNTs are dependent upon the width and shape of the wires. Resistance of the metal nano-wires without the CNTs was also measured through the micro-contacts definted by electron beam lithography. since this CNT-based lithographic technique is, in principle, applicable to any kinds of materials, it can be very useful in exploring the fields of nano-science and technology, especially when it is combines with the CNT manipulation techniques.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.11
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• pp.899-904
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• 2016

ELID grinding is an excellent technique for the mirror grinding of the variety of the advanced metallic or nonmetallic materials. The focus of this study is the development of an automatic-control electrolysis-speed device for the automation of the ELID-grinding process. For the development of the automatic-control electrolysis-speed device, analysis experiments regarding the ELID cycle and oxide-layer removal and creation were conducted according to a truing and dressing process. Also, a comparative experiment was conducted to confirm the variance of the electrolysis speed in accordance with changes of the voltage. The experiment results for the developed automatic-control electrolysis-speed device show that the developed device could control the electrolysis speed according to voltage changes through the use of the data that are monitored during the ELID-grinding process.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1043-1047
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• 2003

With the advancement of micro-systems and nanotechnology, the need for ultra-precision fabrication techniques has been steadily increasing. In this paper, a novel nano-structure fabrication process that is based on the fundamental understanding of nano-scale tribological interaction is introduced. The process, which is called Mechano-Chemical Scanning Probe Lithography (MC-SPL), has two steps, namely, mechanical scribing for the removal of a resist layer and selective chemical etching on the scribed regions. Organic monolayers are used as a resist material, since it is essential for the resist to be as thin as possible in order to fabricate more precise patterns and surface structures. The results show that high resolution patterns with sub-micrometer scale width can be fabricated on both silicon and various metal surfaces by using this technique.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.600-602
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• 1995

Using the $O_2$ RIE process, 20{\mu}m$-height polyimide microstructures are fabricated. In LIGA-like process, metal microstructure can be formed by the electroplating using these polyimide microstructures as a plating mould. Reactive ion Etching technique using oxygen gas is used for the patterning of polyimide. The etching rate of the polyimide is increased with increased pressure and RF power. The anisotropic vertical sidewall can be obtained at low pressure, but the etched surface state is not so good yet. "Micrograss", which is formed during the RIE and disturbs uniform electroplating, can be removed effectively by the wet itching of the chromium sacrificial layer. More studies about the improvement of an etched surface state and the removal of microsgrass are needed.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.566-567
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• 2006

The characteristics of residual stresses occurring in PM steel based nickel (FLN2-4405) was investigated. The measurements of residual stresses were carried out by electrochemical layer removal technique. The values and distributions of residual stresses occurring in PM steel processed under various densities and heat treatment conditions were determined. In most of the experiments, tensile residual stresses were recorded in surface of samples. The residual stress distribution on the surface of the PM steels is affected by the heat treatment conditions and density. Maximum values of residual stresses on the surface were observed sinter hardened condition and $7.4\;g/cm^3$ density. Minimum level of recorded tensile residual stresses are150 MPa and its maximum level is 370 MPa.

• Journal of Powder Materials
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• v.30 no.1
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• pp.53-64
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• 2023

Atomic layer etching (ALE) is a promising technique with atomic-level thickness controllability and high selectivity based on self-limiting surface reactions. ALE is performed by sequential exposure of the film surface to reactants, which results in surface modification and release of volatile species. Among the various ALE methods, thermal ALE involves a thermally activated reaction by employing gas species to release the modified surface without using energetic species, such as accelerated ions and neutral beams. In this study, the basic principle and surface reaction mechanisms of thermal ALE?processes, including "fluorination-ligand exchange reaction", "conversion-etch reaction", "conversion-fluorination reaction", "oxidation-fluorination reaction", "oxidation-ligand exchange reaction", and "oxidation-conversion-fluorination reaction" are described. In addition, the reported thermal ALE processes for the removal of various oxides, metals, and nitrides are presented.

• Journal of the Korean Society of Marine Environment & Safety
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• v.25 no.6
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• pp.809-818
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• 2019

Since January 1, 2020, the International Maritime Organization (IMO) has put in place strong regulations to reduce air pollution caused by ships by lowing the upper limit of ship fuel oil sulfur content from 3.5% to 0.5% for ships passing through all sea areas around the world. Although it is important to reduce air pollutants by using fuel oil with low sulfur content, reducing the amount of energy waste through the economic operation of a ship can also help reduce air pollutants. Ships can follow designated routes accurately even under the influence of noise using autopilot systems. However, regardless of their quality, the performance of these systems is af ected by noise; heading angles with added measurement noise from the gyroscope are input into the autopilot system and degrade its performance. A technique to solve these problems reduces noise effects through the application of a Kalman filter, which is widely used in condition estimation. This method, however, cannot completely eliminate the effects of noise. Therefore, to further improve noise removal performances, in this study we propose a better denoising method than the Kalman filter technique by applying a multi-layer perceptron (MLP) in forward direction motion and a Kalman Filter in rotation motion. Simulations show that the proposed method improves forward direction motion by preventing the malfunction of a rudder more so than merely using a Kalman Filter.

• Economic and Environmental Geology
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• v.43 no.6
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• pp.565-571
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• 2010

An innovative application of surfactant-enhanced air sparging(SEAS) technique was developed in this study. Using a laboratory-scale physical model packed with water-saturated sand, air sparging was implemented to remove water-dissolved toluene that was introduced into a specific depth of the system with finite vertical width prior to sparging. An anionic surfactant(Sodium dodecylbenzene sulfonate) was introduced into the contaminated layer as in dissolved form in the toluene-contaminated solution for SEAS, whereas no surfactant was applied in the control experiment. Due to the suppressed surface tension of water in the surfactant(and toluene)-containing region, the toluene removal rate increased significantly compared to those without surfactant. More than 70% of the dissolved toluene was removed from the contaminated layer for SEAS application while less than 20% of toluene was removed for the experiment without surfactant. Air intrusion into the contaminated layer during sparging was found to be more effective than that without surfactant, enhancing air contact with toluene-contaminated water, which resulted in improved volatilization of contaminant. This new method is expected to open a new option for remediation of VOC(volatile organic compound)-contaminated aquifer.