• 제목/요약/키워드: Laser via

검색결과 345건 처리시간 0.026초

High-power SESAM Mode-locked Yb:KGW Laser with Different Group-velocity Dispersions

  • Park, Byeong-Jun;Song, Ji-Yeon;Lee, Seong-Yeon;Yee, Ki-Ju
    • Current Optics and Photonics
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    • 제6권4호
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    • pp.407-412
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    • 2022
  • We report on a diode-laser-pumped mode-locked Yb:KGW laser system, which delivers ultrashort pulses down to 89 fs at a repetition rate of 63 MHz, with an average power of up to 5.6 W. A fiber-coupled diode laser at 981 nm, operated with a compact driver, is used to optically pump the gain crystal via an off-axis parabolic mirror. A semiconductor saturable-absorber mirror is used to initiate the pulsed operation. Laser characteristics such as the pulse duration, spectrum bandwidth, and output power are investigated by varying the intracavity dispersions via changing the number of bounces between negative-dispersive mirrors within the cavity. Short pulses with a duration of 89 fs, a center wavelength of 1,027 nm, and 3.6 W of output power are produced at a group-velocity dispersion (GVD) of -3,300 fs2. As the negative GVD increases, the pulse duration lengthens but the output power at the single-pulse condition can be enhanced, reaching 5.6 W at a GVD of -6,600 fs2. Because of pulse broadening at high negative GVDs, the highest peak intensity is achievable at a moderate GVD with our system.

세라믹 패키지 내에서 비아에 따른 열적 거동에 관한 연구

  • 이우성;고영우;유찬세;김경철;박종철
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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    • pp.153-157
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    • 2002
  • Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

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펄스 에너지 기반의 소형 추력 장치 개발 (Small Thruster Development Based on Pulse Energy)

  • 최수진;;여재익
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2009년도 춘계학술대회 논문집
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    • pp.365-368
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    • 2009
  • 마이크로 나노 급 위성의 자세제어를 위한 소형 추력 장치로써, 펄스 에너지를 활용한 새로운 추력기의 개발 연구를 진행 중이다. 레이저 추진은 연료를 탑재하지 않기 때문에 경량화 및 비용 절감이 가능하고 펄스 에너지 레벨을 조절하여 목적에 적합한 추력을 발생시킬 수 있다. 본 논문에서는 높은 추력 발생을 위하여 플라즈마 팽창 제한의 물질로 젤 형태의 물질을 적용하였다. 또한 pendulum system으로 속도를 측정하여 momentum coupling coefficient($C_m$)를 도출함으로써 추력 성능이 크게 향상되었음을 확인하였다.

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레이저 트래커를 이용한 소형 공작기계의 서보 불일치 추정 (Servo Mismatch Estimation of Miniaturized Machine Tools Using Laser Tracker)

  • 이훈희;권성환;손진관;양승한
    • 한국정밀공학회지
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    • 제33권8호
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    • pp.683-689
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    • 2016
  • Servo mismatch, which affects positioning accuracy of multi-axis machine tools, is usually estimated via the circular test. However, due to mechanical restrictions in measuring instruments, the circular test using a double ball-bar is difficult to apply in miniaturized or super-large sized machine tools. Laser trackers are widely used to measure the form accuracy of parts and the positioning accuracy of driving systems. In this paper, a technique for the servo mismatch estimation of multi-axis machine tools is proposed via the circular test using a laser tracker. To verify the proposed technique, experiments using a double ball-bar and laser tracker are conducted in a 3-axis machine tool. The difference in the evaluation results is 0.05 msec. The servo mismatch for the miniaturized machine tool is also evaluated using the proposed technique.

레이저 도플러 간섭계를 이용한 원거리 소리 추출 (Remote Sound Extraction Using Laser Doppler Interferometer)

  • 황정환
    • 한국광학회지
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    • 제32권3호
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    • pp.108-113
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    • 2021
  • 본 논문에서는 어떤 음원에 의하여 진동하는 물체로부터 그 음원의 소리를 레이저 도플러 간섭계를 이용하여 원거리에서 복원하는 방법을 고안하고 실험적으로 시연하였다. 어떤 음파에 의하여 진동하는 물체를 간섭계를 통하여 측정할 경우, 측정되는 간섭계의 주파수는 도플러 효과에 의하여 그 소리의 주파수와 동일하게 변한다. 이 현상을 이용하여 어떤 소리에 영향을 받는 대상의 진동 주파수를 레이저 도플러 간섭계를 통해 원거리에서 실시간으로 측정하고, 간섭계 출력의 최대 주파수를 추적하는 신호처리를 통하여 얻은 결과가 음원의 소리와 같은 주파수 특성을 갖는다는 것을 실험적으로 확인하였다. 또한, 각각의 단일 톤 음원뿐만 아니라 여러 가지 주파수가 혼합된 음원의 복원도 가능함을 확인하였다.

레이저 다이싱에 의한 die strength 분석 (Analysis of die strength for laser dicing)

  • 이용현;최경진;배성창
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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    • pp.327-329
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    • 2006
  • In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

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Improved Field Emission Currents of Carbon Nanotubes after Laser Irradiation

  • Lee, Jung-Woo;Park, Jae-Hong;Yi, Whi-Kun
    • Bulletin of the Korean Chemical Society
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    • 제27권10호
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    • pp.1651-1654
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    • 2006
  • Field emission (FE) currents were measured for silver-pasted and glass-pasted single-walled carbon nanotubes (SWNTs) after illuminating the tubes with a pulsed 532 nm laser. A very low turn-on field of approximately 0.4 V/m m and a high current density ~1700 $\mu A/cm^2$ at 3.5 V/m m was obtained for the silver-pasted SWNTs after laser irradiation but on the whole, no improvements were found for the glass-pasted SWNTs. Two roles of laser irradiation for the silver-pasted SWNTs were proposed. First, the embedded SWNTs and SWNT bundles inside the silver paste were immerged on the outer surface due to an instantaneous melting or annealing of the silver metals by the laser resulting in an increase of the field emission sites. Second, the laser irradiation was thought to improve the electrical contact between SWNTs and the silver metal by reducing the contact resistance via laser-induced thermal annealing, which was responsible for increasing the FE currents.

FDTD방법을 이용한 엑시머 레이저 어블레이션 해석 (Analysis of Excimer laser ablation via FDTD method)

  • 최경현;배창현;김동수;이석희
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.163-164
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    • 2006
  • In this paper, an analytical laser ablation model with Maxwell equation will be addressed by considering relationship between laser ablation and material. The Maxwell equation consists of four equations: two Gauss laws for electric and magnetic fields, Faraday's law, and Ampere's law. This analytical model will be calculated by employing Finite Difference Time Domain (FDTD). This method also makes it possible to simulate the laser beam propagation in a wide range of materials, such as metals, semiconductors, and dielectrics. Therefore, in this study, a numerical model for short pulse laser interaction with materials is developed, focusing on the accurate description of laser beam propagation and ablation process into the material with each pulse.

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레이저 스크라이빙 공정을 이용한 실리콘 태양전지의 측면분리 효과 (Edge Isolation Effects on Silicon Solar Cells using a Laser Scribing Process)

  • 주재홍;정순원;김광호
    • 전기학회논문지
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    • 제66권5호
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    • pp.851-856
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    • 2017
  • Research on the edge isolation process of typical polycrystalline silicon solar cells was carried out using laser scribing equipment. The voltage-current characteristics of the solar cell before and after laser scribing were analyzed using a solar simulator. Current density and efficiency increased as the fill factor of the solar cell remained constant after the laser scribing process. The efficiency of the solar cell can be increased in a short time by the edge isolation process performed via a laser scribing process. The polycrystalline silicon solar cell was made into a series electrode, and the efficiency of the solar cell increased because the width of the solar cell was narrowed and the active region was widened by the laser scribing process.

5축 CO2 레이저 컷팅 머신 및 CAM 시스템 개발 (Development of 5-axis $CO_2$ Laser Cutting Machine and CAM)

  • 강재관;염경섭;강병수;이홍주
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.245-246
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    • 2006
  • For developing 5-axis laser cutting systems, many problems such as rotating of laser head or table, 5-axis tool path generation and collision avoidance between laser head and product should be solved. In this paper, a five-axis laser cutting machine with table swivel and rotary type configuration is developed. The five axes (X,Y,Z,A,B) are controlled and interfaced to PC via MMC board. Two kinds of CAM S/W such as commercial 5-axis CAM S/W(Euclid) and UG-API are engaged to generate NC code for the developed 5-axis laser cutting machine.

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