• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.184-189
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• 2005

An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.7
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• pp.557-563
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• 2003

SiC has been an useful material for the high voltage, high temperature, and high frequency devices, however, the required high process temperature to activate the implanted p-type dopants has hindered further developments. In this study, we report, for the first time, on the laser activation of implanted Al and non-alloyed Mo ohmic contacts and its application to MOSFET fabrication. The contact and sheet resistance measured from CTLM patterns have decreased by increasing laser power, and the lowest values are 3.9 $K\Omega$/$\square$ and 1.3 $\times$ 10$^{-3}$ $\Omega$-cm$^2$, respectively, at the power density of 1.45 J/cm$^2$ The n-MOSFETs fabricated on laser activated p-well exhibit well-behaved I-V characteristics and threshold voltage reduction by reverse body voltage. These results prove that the laser process for implant activation is an alternative low temperature technology applicable to SiC devices.

• Journal of the Korean institute of surface engineering
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• v.49 no.1
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• pp.20-25
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• 2016

Femtosecond laser ablation of ultrathin polymer films on quartz glass using laser pulses of 100 fs and centered at ${\lambda}=400nm$ wavelength has been investigated for nanometer precision thin film patterning. Single-shot ablation craters on films of various thicknesses have been examined by atomic force microscopy, and beam spot diameters and ablation threshold fluences have been determined by square diameter-regression technique. The ablation thresholds of polymer film are about 1.5 times smaller than that of quartz substrate, which results in patterning crater arrays without damaging the substrate. In particular, at a $1/e^2$ laser spot diameter of $0.86{\mu}m$, the smallest craters of 150-nm diameter are fabricated on 15-nm thick film. The ablation thresholds are not influenced by the film thickness, but diameters of the ablated crater are bigger on thicker films than on thinner films. The ablation efficiency is also influenced by the laser beam spot size, following a $w_{0q}{^{-0.45}}$ dependence.

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.1-4
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• 2013

For the conventionally polished fused silica substrate, an around 100 nm depth redeposition polishing layer was formed on the top of surface. Polishing compounds, densely embedded in the redeposition polishing layer were the dominant factor that limited the laser induced damage threshold (LIDT) of transmission elements in nanosecond laser systems. Chemical etching, super-precise polishing and ion beam etching were employed in different ways to eliminate these absorbers from the substrate. After that, Antireflection (AR) coatings were deposited on these substrates in the same batch and then tested by 1064 nm nano-pulse laser. It was found that among these techniques only the ion beam etching method, which can effectively remove the polishing compound and did not induce extra absorbers during the disposal process, can successfully improve the LIDT of AR coatings.

• Transactions on Electrical and Electronic Materials
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• v.14 no.3
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• pp.156-159
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• 2013

The electrical properties of ZnO nanowire field effect transistors (FETs) have been investigated depending on various diameters of nanowires. The ZnO nanowires were synthesized with an Au catalyst on c-plane $Al_2O_3$ substrates using hot-walled pulsed laser deposition (HW-PLD). The nanowire FETs are fabricated by conventional photo-lithography. The diameter of ZnO nanowires is simply controlled by changing the thickness of the Au catalyst metal, which is confirmed by FE-SEM. It has been clearly observed that the ZnO nanowires showed different diameters simply depending on the thickness of the Au catalyst. As the diameter of ZnO nanowires increased, the threshold voltage of ZnO nanowires shifted to the negative direction systematically. The results are attributed to the difference of conductive layer in the nanowires with different diameters of nanowires, which is simply controlled by changing the catalyst thickness. The results show the possibility for the simple method of the fabrication of nanowire logic circuits using enhanced and depleted mode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.1
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• pp.93-97
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• 2009

We analyzed voltage characteristics of toner particle type display according to particle layers and cell gap between two electrodes and ascertained the aging effects by measuring the response time of particles with and without aging process. The threshold/driving/breakdown voltage is proportional to layers of toner particles and cell gap and the response time at driving voltage is faster than that of threshold and breakdown voltage because of different q/m of color and black particles. The analysis of response time is a method of estimation of optical characteristics, driving voltage and particle lumping and these results are promoted by aging process. We use the laser and photodiode to measure response time and optical properties. It has not been studied and reported to analyze the relationship of response time, threshold/driving/breakdown voltage, lumping phenomena, cell gap, and aging process for toner particle type display.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.526-532
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• 2000

The paste on the glass or fabrication of the PDP(Plasma Display Panel) barrier rib was selectively etched using focused A $r_{+}$ laser(λ=514 nm) and Nd:YAG(λ=532, 266 nm) laser irradiation. The depth of the etched grooves increase with increasing a laser fluence and decreasing a laser beam scan speed. Using second harmonic of Nd:YAG laser(532 nm) the etching threshold laser fluence was 6.5 mJ/c $m^2$ for the sample of PDP barrier rib. The thickness of 180 ${\mu}{\textrm}{m}$ of the sample on the glass was clearly removed without any damage on the glass substrate by fluence of 19.5J/c $m^2$beam scan speed of 20${\mu}{\textrm}{m}$ /s. In order to increase the etch rate of the barrier rib material barrier rib samples heated by a resistive heater during laser irradiation. The heated sample has many defects and becomes to be fragile. This imperfection of the structure compared to the sample without heat treatment allows the effective etching by the focused laser beam. The etch rates were 65${\mu}{\textrm}{m}$/s and 270 ${\mu}{\textrm}{m}$/s at room temperature and 20$0^{\circ}C$, respectively.y.

• Proceedings of the Korea Water Resources Association Conference
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• 2005.09b
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• pp.895-897
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• 2005

• Proceedings of the Optical Society of Korea Conference
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• 2005.02a
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• pp.216-217
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• 2005

• Proceedings of the Optical Society of Korea Conference
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• 2004.02a
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• pp.336-337
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• 2004