• Journal of the Semiconductor & Display Technology
• /
• v.11 no.4
• /
• pp.43-48
• /
• 2012

The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc. for forming the high precision micro-pattern. Also A number of studies of screen printing method has been conducted as the method for the cost down through the improvement of productivity. Because of being the dot printing method of the cylindrical shape not being the line printing method like the existing PDP barrier rib and phosphor, the pillar arrays using the screen printing method is deposited in the hemispherical type not being cylindrical shape in the existing printing process conditions. In this paper, the parameters were set on the screen printing device in order to deposit the cross-sectional shape with the cone or trapezoid shape of the pillar in depositing the pillars used the screen printing device for vacuum glazing. The cross-sectional shape slope of the pillar according to the parameters was measured. And analysis the effect of the screen printing process conditions on the cross-sectional shape slope of pillars based upon the result of being measured. The processing conditions were drawn to minimize the cross-sectional shape slope of pillar.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.53-59
• /
• 2011

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

• Journal of Institute of Control, Robotics and Systems
• /
• v.14 no.6
• /
• pp.519-522
• /
• 2008

As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2009.05a
• /
• pp.15.2-15.2
• /
• 2009

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.

• Proceedings of the KIEE Conference
• /
• 2005.07c
• /
• pp.2052-2054
• /
• 2005

TFT-LCD requires to use poly silicon for High resolution and High integration. Thin film make of Poly silicon on the excimer laser-induced crystallization of PECVD(plasma-enhanced chemical vapor deposition)-grown amorphous silicon. In the thin film hydrogen affects to a device performance from bad elements like eruption, void and etc. So dehydrogenation prior to laser exposure was necessary. In this study, use RTP(Rapid Thermal Process) at various temperature from $670^{\circ}C$ to $750^{\circ}C$ and fabricate poly-silicon. it propose optimized RTP window to compare grain size to use poly silicon's SEM pictures and crystallization to analyze Raman curved lines.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.413-413
• /
• 2007

In recent years, flexible display devices such as liquid crystal display (LCD), organic light emitting diode (OLED), etc. have attracted considerable interest in a wide variety of applications. Polymer substrate is absolutely necessary to realize this kind of flexible display devices. Using the polymer as a substrate, there are lots of advantages including not only mechanical flexibility such as rolling and bending characteristics but also light weights, low cost and so on. In detail, thickness and weights is only one forth and one second of glass substrate, respectively. However, it needs low temperature below $150^{\circ}C$ in the fabrication process comparing to conventional deposition process. The polymer substrate is not thermally stable as much as the glass substrate so that some deformation can be occurred according to variation of temperature. In particular, performance of devices can be easily deteriorated by shrinkage of substrate when heating it. In this paper, pre-annealing and deposition of buffer layer was introduced and studied to solve previously mentioned problems of the shrinkage and followed shear stress.

• International Journal of Precision Engineering and Manufacturing
• /
• v.7 no.1
• /
• pp.51-56
• /
• 2006

A computer code was developed to simulate both the thermal stresses introduced during the post-filling stage and the in-plane deformation after ejection process by finite element method based on the plane stress theory. The computer simulation was applied to the mold design of a 2 inch light guide plate (LGP) for thin film transistor (TFT)-liquid crystal displays (LCD). With injection molding experiments based on the design of experiments (DOE) technique, the influences of the processing conditions in injection molding on brightness and uniformity of the LGP were investigated, and the optimal processing parameters were selected to increase the brightness and uniformity. The verification experiment showed that the brightness and uniformity of the LGP were increased dramatically under the selected optimal processing conditions.

• Information Display
• /
• v.5 no.1
• /
• pp.25-30
• /
• 2004

Poly-Si TFT(Thin Film Transistor) technology are reviewed and discussed. Poly-Si TFTs fabricated on glass using low-temperature process were studied extensively for the application to LCD (Liquid Crystal Display) as well as to OLED(Organic Light Emitting Diode) Display. Currently, one of the application targets of the poly-Si TFT is emphasized on the highly functional SOG(System on Glass). Improvement of device characteristics such as an enhancement of carrier mobility has been studied intensively by enlarging the grain size. Reduction of the voltage and shrinkage of the device size are the trend of AM FPD(Active Matrix Flat Panel Display) as well as of Si LSI, which will arise a peculiar issue of uniformity for the device performance. Some approaches such as nucleation control of the grain seed or lateral grain growth have been tried, so far.

• Proceedings of the KIEE Conference
• /
• 2001.11a
• /
• pp.174-177
• /
• 2001

The voltage holding ratio (VHR) and Residual DC property in the in-plane switching (IPS) cell was studied Several IPS cells which have different concentrations of cynao liquid crystals (LCs) and different resistivities of fluorine LCs were fabricated VHR and residual DC voltage in the IPS cells using the capacitance-voltage (C-V) hysteresis method was measured. We found that the VHR of the IPS cell was decreasing with increasing concentration of cyano LC. The residual DC voltage of the IPS cell was decreasing with increasing concentration of cyano LCs. We suggest that the high polarity of cyano LC helps reducing the residual DC voltage.

• Journal of the Korea Safety Management & Science
• /
• v.15 no.4
• /
• pp.317-321
• /
• 2013

Due to growth of electronics and control devices, automation and situational awareness systems have been applied by automobile. Vision systems with the introduction of unmanned system were being actively developed. In this paper, the distortion in the 7-inch LCD screen for the treatment process are divided into Online and Offline processing. Offline processing based on the image signal processing and for generating LUT Online to Offline generated by processing the distortion is applied to the LUT. LUT is applied to distort the image processing in real time, so that distortion correction is made for the purpose of setting.