Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Soft Mold Deformation of Large-area UV Impring Process

대면적 UV 임프린팅 공정에서 유연 몰드의 변형

  • Kim, Nam-Woong (School of Mechanical Engineering, Dongyang Mirae University) ;
  • Kim, Kug-Weon (Dept. of Mechanical Engineering, Soonchunhyang University)
  • 김남웅 (동양미래대학 기계공학부) ;
  • 김국원 (순천향대학교 공과대학 기계공학과)
  • Received : 2011.11.08
  • Accepted : 2011.12.15
  • Published : 2011.12.31
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Abstract

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

Keywords

References

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