• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.250-253
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• 2008

A touch screen panel embedded 12.1-inch TFT LCD employing a standard a-Si:H TFT process has been successfully developed. Compared with conventional external touch screen panels, the new internal TSP exhibits a clearer image and improved touch feeling. Our new internal proposed TSP can be fabricated with low cost.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.162-165
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• 2007

TFT-LCD process has two advantages as compared with the semiconductor-process. It is that cycle time is short and number of the final products are small. But it needs complicated inspection / assembly line to be treated manually and much higher labor costs in the TFT-LCD process. Also, It is necessary to build PICS(Production Information and Control System) which is automated and intelligent. In this paper, an automated process of LCD module assembly line that can increase productivity and reduce the cost of production to strengthen the competitiveness corresponding with global market is planned in comparison with its manual/semi-auto. It is noted that The automated line for COG$\sim$FOG process replacing with the existing facilities had the following effects; the productivity is increased to about 1.5 times and labor cost reduced 85%. In addition, whole assembly line can be short and simple.

• 동굴
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• 제77호
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• pp.21-30
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• 2007

Photo-lithography lies in the middle of the wafer fabrication process. It is often considered as the most critical step in the IC process. We use a mask in exposure steps of the photo-lithography. Typically, 20 to 25 different levels of masks are required to complete an IC device. That means, if a photo process can be developed with the use of only one photo mask, we can reduce more process cost. To satisfy this, we plan to develop an alternative photo mask. For this reason, we chose to use a LCD. We expect to develop a LCD panel that can be changed by electrical control. This is the main idea about the adjustive photo mask. The Photo mask made of LCD panel will replace the former one.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.9-12
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• 2008

For the large-sized and post-ultra definition TFT-LCD, improved drivability is prerequisite not only for the integration of driving circuit on glass but also for the chargeability of each pixel. In order to meet required drivability, currently adopted process architecture and materials are modified for the RC delay reduction, including the drastic increase of gate bus thickness and its related solution for step coverage. We present new process architecture and material selection for the next generation TFT-LCD devices.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1626-1631
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• 2007

The purpose of the study is to simulate the displacement of the LCD glass during process of a large size imprint. During this process, a small temperature variation makes thermal stress, which causes the horizontal variation of mold and glass. During alignment process to fix the LCD glass on a alignment stage, the vertical displacement is made by the absorption pressure and the shear stress. This study simulates the horizontal displacement of mold and glass due to temperature variation, the vertical displacement depending on the shape of absorption surface fixing the LCD glass in the alignment process, and the horizontal and vertical displacement which occurs in the LCD glass at the alignment process. Algor which is a FEM code for a framework simulation was applied. Temperature variation above ${\pm}$ $0.1^{\circ}C$ on mold and glass causes the horizontal displacement of 150nm due to thermal expansion. The vertical displacement due to the circular is ten times of the case of rectangular absorption nozzle. The displacement of the LCD glass in the alignment process is about 49nm.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1071-1074
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• 2007

6Mask CMOS process in low temperature polycrystalline silicon thin film transistors (poly-Si TFTs) has been developed and verified by manufacturing a 6Mask CMOS AMLCD panel. The novel 6Mask CMOS process is realized by eliminating the storage mask, gate mask and via open mask of conventional structure.

• 청정기술
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• 제14권4호
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• pp.275-280
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• 2008

연구에서는 LCD 제조 공정에서 배출되는 스트리퍼와 디벨로퍼 혼합 폐액(SD폐액)과 스트리퍼 폐수의 효과적 분리 및 처리를 위한 가능한 기술로서 추출공정과 증류공정의 기술적/경제적 타당성을 검토하였다. SD폐액과 스트리퍼 폐수의 추출분리를 위한 용매로 $CHCl_3$가 여러 가지 관점에서 가장 적절한 용매로 확인되었다. 또한 SD폐액 분리 회수를 위한 공정으로서 추출공정과 증류공정의 두 가지 공정에 대하여 정밀 전산모사를 수행한 결과 $CHCl_3$를 이용한 추출분리공정이 단순증류공정보다 6배 정도 에너지 소요비용이 적게 소요됨을 확인할 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.401-404
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• 2004

Transfer characteristics of poly-Si TFTs within process window of laser energy are investigated. In terms of surface morphology and transfer characteristics, process window of laser crystallization is evaluated. While maximum mobility exists in lower edge of process window in n-channel TFTs, maximum mobility exists in higher edge of process window in p-channel TFTs.

• 한국산학기술학회논문지
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• 제11권10호
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• pp.3654-3657
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• 2010

본 연구에서는 LCD 디스플레이 프레임의 제품 원가를 절감하기 위해 조립공정의 최적화에 대해 연구하였다. 첫째로 OTRS를 이용하여 조립공정의 효율성을 분석하였고, 둘째로 낮은 가격의 원자재 코일을 대상으로 정해진 신뢰성 기준에 합격할 수 있는 프레임을 생산할 수 있는지 평가하였다. 연구 결과, 프레임 조립공정은 자동화가 상당 수준 진척되었기 때문에 높은 생산성이 유지되고 있다는 것을 알 수 있었고, 동시에 정해진 기준에 합격할 수 있는 프레임을 확보할 수 있는 가능성이 제시되었다.

• Journal of Information Display
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• 제10권2호
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• pp.54-61
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• 2009

The results of the optimization of the organic passivation process for fabricating thin-film transistors (TFTs) with a high aperture ratio on a seventh-generation glass (2200${\times}$1870 mm) substrate for LCD-TV panels are reported herein. The optimization of the organic passivation process has been verified by checking various factors, including the material properties (e.g., thickness, stain, etching, thermal reflow) and the effects on the TFT operation (e.g., gate/data line delay and display-driving properties). The two main factors influencing the organic passivation process are the optimization of the final thickness of the organic passivation layer, and the gate electrode. In conclusion, the minimum possible final thickness was found to be $2.42{\um}m$ via simulation and pilot testing, using the full-factorial design. The optimization of the organic passivation layer was accomplished by improving its brightness by over 10 cd/$m^2$ (ca. 2% luminance) compared to that of the conventional organic passivation process. The results of this research also help reduce the reddish stain on display panels.