• Information Display
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• v.4 no.2
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• pp.7-10
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• 2003

현대는 디스플레이 산업과 같은 표시 소자 산업이 관심의 대상이 되고 있는 시대이다. 이러한 디스플레이 산업의 분야에는 CRT, LCD, PDP가 현재의 산업을 주도해왔고, OLED가 차세대 디스플레이로 주목을 받고 있다. 그래서 에이엔에스는 새로운 SMOLED(Small Molecule Organic Light Emitting Diode)를 제작할 수 있는 장비 및 공정기술을 개발하였다. 현재의 SMOLED 제작공정 및 장비와, 대면적 기판을 사용할 수 있고, 물질의 사용효율 및 공정시간을 단축시킬 수 있는 새로운 에이엔에스 증착장비의 장비 및 공정에서의 장단점을 비교하고 디바이스에서의 기본적인 특성을 비교하여 보겠다.

• Proceedings of the Korean Information Science Society Conference
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• 2004.10a
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• pp.676-678
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• 2004

최근 계측장비 기술의 발전으로 계측장비의 정보를 공유하기 위한 제어기술은 매우 중요해지고 있다. 이와 관련하여 임베디드 시스템을 이용한 다양한 디바이스 설계 기술들이 연구되고 있다. 본 논문은 계측장비 제어를 위해 Text LCD 및 Keypad와 같은 임베디드 디바이스를 장착한 시스템을 설계하였고, 임베디드 시스템의 분석을 통하여 계측장비 설계에 최적화된 시스템을 연구한다. 또한 Ethernet상의 다른 시스템에서 클라이언트 프로그램을 통해 계측장비로부터 측정된 간을 확인할 수 있다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.154-158
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• 2004

Power inductor is usually used in the field of the power circuit of a cellular phone, TFT LCD module etc.. This paper presents the development process of Power Inductor Full Automation Winding/Welding System for TFT LCD. This process, the process algorithm, high precision welding current control, design of welding head, high speed, high precision feeding mechanism, and user interface process control program technologies are included.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.523-529
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• 2008

In this paper, we proposed mobile LCD module test device on embedded based, when operating the existing LCD, divide flicker clearly in full frame, and configuration so as to support between other CPU interface, MDDI, SPI, 24Bit RGB interface, etc. that is based on a high-speed CPU. In addition, when demand to test about each pixel of LCD, it is possible to change IP design of H/W, FPGA, but proposed system is application possible without other design changing. Proposed system is made smaller and equipped with battery, so secure with mobility for effective test the LCD/OLED module and it is able to test the pattern by the client program, for example exiting picture, mpeg, simple pattern test and test per pixel, scale, rotation, Odd/Even pixel per video, etc. From now on, if integrating with independent test system and it is configured that is able to mutual communication and test, it is expected to reduce consumption of human resources and improve productivity for LCD module test.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1626-1631
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• 2007

The purpose of the study is to simulate the displacement of the LCD glass during process of a large size imprint. During this process, a small temperature variation makes thermal stress, which causes the horizontal variation of mold and glass. During alignment process to fix the LCD glass on a alignment stage, the vertical displacement is made by the absorption pressure and the shear stress. This study simulates the horizontal displacement of mold and glass due to temperature variation, the vertical displacement depending on the shape of absorption surface fixing the LCD glass in the alignment process, and the horizontal and vertical displacement which occurs in the LCD glass at the alignment process. Algor which is a FEM code for a framework simulation was applied. Temperature variation above ${\pm}$ $0.1^{\circ}C$ on mold and glass causes the horizontal displacement of 150nm due to thermal expansion. The vertical displacement due to the circular is ten times of the case of rectangular absorption nozzle. The displacement of the LCD glass in the alignment process is about 49nm.

• Journal of Korean Electronics
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• v.11 no.3
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• pp.61-64
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• 1991

• Journal of Korean Electronics
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• v.11 no.4
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• pp.49-58
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• 1991

• Proceedings of the Korean Vacuum Society Conference
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• 2006.02a
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• pp.101-101
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• 2006

• Journal of Korean Electronics
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• v.26 no.12
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• pp.21-23
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• 2006

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.53-76
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• 2006