• Title/Summary/Keyword: Interfacial Layer

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Effects of Dielectric Curing Temperature and T/H Treatment on the Interfacial Adhesion Energies of Ti/PBO for Cu RDL Applications of FOWLP (FOWLP Cu 재배선 적용을 위한 절연층 경화 온도 및 고온/고습 처리가 Ti/PBO 계면접착에너지에 미치는 영향)

  • Kirak Son;Gahui Kim;Young-Bae Park
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.2
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    • pp.52-59
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    • 2023
  • The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m2 for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m2 after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

A stress-function variational approach toward CFRP -concrete interfacial stresses in bonded joints

  • Samadvand, Hojjat;Dehestani, Mehdi
    • Advances in concrete construction
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    • v.9 no.1
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    • pp.43-54
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    • 2020
  • This paper presents an innovative stress-function variational approach in formulating the interfacial shear and normal stresses in an externally bonded concrete joint using carbon fiber-reinforced plastic (CFRP) plies. The joint is subjected to surface traction loadings applied at both ends of the concrete substrate layer. By introducing two interfacial shear and normal stress functions on the CFRP-concrete interface, based on Euler-Bernoulli beam idea and static stress equations of equilibrium, the entire stress fields of the joint were determined. The complementary strain energy was minimized in order to solve the governing equation of the joint. This yields an ordinary differential equation from which the interfacial normal and shear stresses were proposed explicitly, satisfying all the multiple traction boundary conditions. Lamination theory for composite materials was also employed to obtain the interfacial stresses. The proposed approach was validated by the analytic models in the literature as well as through a comprehensive computational code generated by the authors. Furthermore, a numerical verification was carried out via the finite element software ABAQUS. In the end, a scaling analysis was conducted to analyze the interfacial stress field dependence of the joint upon effective issues using the devised code.

Theoretical Study on Interfacial Stresses at RC Beam Repair-Purpose Overlayed by Latex Modified Concrete (LMC로 덧씌우기 보수된 RC보의 계면응력에 관한 연구)

  • Kim, Hyun-Oh;Kim, Seong-Hwan;Kim, Dong-Ho;Lee, Bong-Hak
    • Journal of Industrial Technology
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    • v.24 no.A
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    • pp.179-184
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    • 2004
  • Each year, new technological advancements for repair-purpose are being introduced to overlay the old deterioration of RC bridge deck at highway by latex-modified concrete. The days may come when this old problem will be successfully resolved. While the experimental works and researches are very active at both laboratory and field, only a few theoretical studies were performed on interfacial problems, especially on stress distribution and concentration of RC beam overlayed by latex-modified concrete. The repaired and strengthened structures would induce a premature failure due to the stress concentration at the adhesive layer of different material before the design expected failure. This paper investigated and proposed an analytical model for predicting interfacial shear and normal stresses of RC beam repair-purpose overlayed by latex-modified concrete. This would be used for predicting interfacial stresses and preventing premature failure at interfaces. This study modified Smith-Teng method for applying to cementitious repairing material, which was based on a direct governing equation and linear-elastic approach for interfacial normal and shear stresses. The proposed theoretical model was verified using commercial FEA program, LUSAS, in terms of interfacial stresses predicted by the proposed model and calculated by LUSAS.

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A Study on the Direct Synthesis of TaC by Cast-bonding (주조접합법에 의한 TaC 직접합성에 관한 연구)

  • Park, Heung-Il;Lee, Sung-Youl
    • Journal of Korea Foundry Society
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    • v.17 no.4
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    • pp.371-378
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    • 1997
  • The study for direct synthesis of TaC carbide which was a reaction product of tantalum and carbon in the cast iron was performed. Cast iron which has hypo-eutectic composition was cast bonded in the metal mold with tantalum thin sheet of thickness of $100{\mu}m$. The contents of carbon and silicon of cast iron matrix was controlled to have constant carbon equivalent of 3.6. The chracteristics of microstructure and the formation mechanism of TaC carbide in the interfacial reaction layer in the cast iron/tantalum thin sheet heat treated isothermally at $950^{\circ}C$ for various time were examined. TaC carbide reaction layer was grown to the dendritic morphology in the cast iron/tantalum thin sheet interface by the isothermal heat treatment. The composition of TaC carbide was 48.5 at.% $Ti{\sim}48.6$ at.% C-2.8 at.% Fe. The hardness of reaction layer was MHV $1100{\sim}1200$. The thickness of reaction layer linearly increased with increasing the total content of carbon in the cast iron matrix and isothermal heat treating time. The growth constant for TaC reaction layer was proportional to the log[C] of the matrix. The formation mechanism of TaC reaction layer at the interface of cast iron/tantalum thin sheet was proved to be the interfacial reaction.

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Efficiency Analysis of Buffer Layer Using UF on the Electrical Characteristics of OLED (불화리튬 버퍼층에 의한 유기 발광 소자의 전기적인 특성 및 효율 분석)

  • Bae, Sang-Ho;Park, Hyung-Jun;Nam, Eun-Kyoung;Jung, Dong-Geun;Yi, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.422-423
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    • 2007
  • In this work, Organic Light Emitting Diodes using LiF as a electron-injecting interfacial have been fabricated for efficiency enhancements. This interfacial layer is interposed between Al/$Alq_3$ layer. The brightness and specific character as current density are higher than those of the device without it. To find best thickness of LiF layer, we used some samples with various thickness. The LiF interposition at the Al/$Alq_3$ interface encouraged the electrons injection and balances the injection numbers of hole and electron in the emission layer.

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Behaviour of interfacial layer along granular soil-structure interfaces

  • Huang, Wenxiong;Bauer, Erich;Sloan, Scott W.
    • Structural Engineering and Mechanics
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    • v.15 no.3
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    • pp.315-329
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    • 2003
  • As shear occurs along a soil-structure interface, a localized zone with a thickness of several grain diameters will develop in soil along the interface, forming an interfacial layer. In this paper, the behaviour of a soil-structure interface is studied numerically by modelling the plane shear of a granular layer bounded by rigid plates. The mechanical behaviour of the granular material is described with a micro-polar hypoplastic continuum model. Numerical results are presented to show the development of shear localization along the interface for shearing under conditions of constant normal pressure and constant volume, respectively. Evolution of the resistance on the surface of the bounding plate is considered with respect to the influences of grain rotation.

EXPERIMENTAL STUDY ON LASER AND HOT AIR REFLOW SOLDERING OF

  • Tian, Yanhong;Wang, Chunqing
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.469-474
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    • 2002
  • Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.

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A linear analysis of interfacial instabilities of ferrofluids (자기성 유체 계면의 선형안정성에 관한 연구)

  • Park, Chang-Ho;Ju, Sang-U;Lee, Sang-Chun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.7
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    • pp.899-904
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    • 1998
  • Surface motion of a magnetic fluid is studied by a linear stability analysis. When a thin horizontal magnetic-fluid layer is placed on a nonmagnetic substrate, with a vertical magnetic field applied, the surface of the ferrofluid layer can be severely corrugated, due to the normal-field instability. Based on conservation laws, it is shown that the normal-field instability of thin ferrofluid layers is a long-wave instability and that it is analogous to the interfacial mode of the thermocapillary instability in a thin horizontal layer heated from below.

A Study on the Shape and Microstructural Change of Explosion-Welding Al/Steel Interface with Explosive Thickness (폭약살포 높이에 따른 Al/steel 폭발 접합계면의 형상 및 조직 변화에 관한 연구)

  • 김희진;강봉용
    • Journal of Welding and Joining
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    • v.14 no.4
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    • pp.62-70
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    • 1996
  • Al or Al-alloy have been known to be able to be claded on various materials by using explosive welding process, however, the intermetallic layer frequently formed along the interface have made this process very complicated. In this study, it was focussed to select the process variables, which can get rid of interfacial layer in the Al-claded steel plate. As a result, it was demonstrated that there was a certain range of explosive thickness which did not form the intermetallic phase as well as the non-bonded area. On the other hand, ultasonic tests performed for identifying the presence of interfacial layer nondestructively showed that it could be applied for the intended purpose but its result was weakly related with the microstructural quality of interface.

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Introduction of a Buffering Layer for the Interfacial Stability of LSGM-Based SOFCs (LSGM계 고체산화물 연료전지의 계면안정성을 위한 완층층의 도입)

  • Kim, Kwang-Nyeon;Moon, Jooho;Son, Ji-Won;Kim, Joosun;Lee, Hae-Weon;Lee, Jong-Ho;Kim, Byung-Kook
    • Journal of the Korean Ceramic Society
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    • v.42 no.9 s.280
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    • pp.637-644
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    • 2005
  • In order to find a proper buffering material which can prohibit an unwanted interfacial reaction between anode and electrolyte of LSGM-based SOFC, we examined a gadolinium doped ceria and scandium doped zirconia as a candidate. For this examination, we investigated the microstructural and phase stability of the interface under different buffering layer conditions. According to the investigation, ceria based material induced a serious La diffusion out of the LSGM electrolyte resulted in the formation of very resistive $LaSrGa_3O_7$ phase at the interface. On the other hand zirconia based material was directly reacted with LSGM electrolyte and thus produced very resistive reaction products such as $La_2Zr_2O_7,\;Sr_2ZrO_4,\;LaSrGaO_4\;and\;LaSrGa_3O_7$. From this study we found that an improper buffering material induced the higher internal cell resistance rather than an interfacial stability.