• E2M - 전기 전자와 첨단 소재
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• 제16권9호
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• pp.62.2-62
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• 2003

Material Characteristics of zirconium oxide thin films obtained by plasma enhanced chemical vapor deposition on p-type Si(100) substrates were investigated to explain their unable electrical properties. The films obtained without heating had polycrystalline nanograins that are mostly of a tetragonal phase under oxygen-deficient plasma conditions but transformed into a monoclinic phase with increasing $O_2$ addition in the plasma. Mostly amorphous bulk $ZrO_2$ with a relatively thicker and smoother interfacial layer was obtained from oxygen-rich plasmas, resulting in a decrease in both the overall dielectric constant and the leakage current density. the interfacial layer formed between the bulk $ZrO_2$ and Si substrate was analyzed to be zirconium silicate, which approached $SiO_2$ as its zirconium content decreased with the increasing gas phase $O_2$ content.

• 대한기계학회논문집A
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• 제24권8호
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• pp.2022-2031
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• 2000

Since the surface roughness of adherends affects much the strength of adhesivelybonded joints, the effect of surface roughness on the fatigue life of adhesively bonded tubular single lap joints was investigated analytically and experimentally by fatigue torsion test. The stiffness of the interfacial layer between adherends and adhesive was modeled as a normal statistical distribution function of surface roughness of adherends. From the investigation, it was found that the optimum surface roughness of adherends for the fatigue strength of tubular single lap joints was dependent on bondthickness and applied load.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.230-232
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• 2006

Eutectic Au-20Sn solder has been widely used for optoelectronic packages because of fluxless soldering process and thus are particularly valuable for many applications such as biomedical, photonic, and MEMS devices that can not use any flux. Also when good joint strength, superior resistance to corrosion, whisker-free, and good thermal conductivity are demanded, eutectic Au-20Sn solder can be satisfied with above-mentions best. In this study, we tried to know the interfacial reactions between Au-20Sn solder and Cu substrate with or without ENIG plating layer In the results, Au-Cu-Sn ternary phases were formed at the Au-20Sn/Cu substrate, and Au-Ni-Sn, Au-Ni-Cu-Sn phases were formed at the Au-20Sn/ENIG substrate.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.59-63
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• 2010

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

• Restorative Dentistry and Endodontics
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• 제20권1호
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• pp.183-192
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• 1995

The purpose of this study was to evaluate the effect of smear layer management on the interfacial morphology between dentin bonding system and dentin. Clearfil New Bond, Scotchbond Multipurpose, Prisma Universal Bond 3 and X-R Bond were used on the cervical dentinal surfaces of bovine incisor teeth. All of the dentin bonding systems were labeled with fluorescene in primer and rhodamine B in adhesive. Specimens of 2~3mm thichness were prepared by longitudinal and labiolingual sectioning. The interface between dentin bonding system and dentin was observed by flouresence imaging with a confocal laser scanning microscope. Following results were obtained. 1. In the specimen of Clearfil New Bond, dentinal tubules were widened by destruction of peritubular dentin in the course of treatment with phosphoric acid of high concentration. 2. Hybrid layer was observed in the specimen of Scotchbond Multipurpose and X-R Bond. 3. In the specimen of Prisma Universal Bond 3, the penetraton of adhesive was not observed clearly.

• Transactions on Electrical and Electronic Materials
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• 제3권4호
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• pp.27-31
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• 2002

Thin film diode with reliable interfacial structure was fabricated by using multi-step anodic oxidation. The thickness of the oxide layer was preciously controlled with anodic voltage. Also, interfacial structure between oxide layer and top electrode was improved by applying post heat-treatment. The thin film diode showed symmetric and stable I-V characteristics after the post heat-treatment.

• 한국생산제조학회지
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• 제20권3호
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• pp.284-291
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• 2011

Numerical experiments on biological interfacial layer, DEJ by finite element software ABAQUS have been conducted to study its fracture behavior including crack bridging / arresting characteristics in the model. Crack growth simulation has been carried out by numerical tool, XFEM, devoted to study cracks and discontinuities. The fracture toughness of DEJ has been estimated before and after crack bridging. The implications of bridging in numerical study of fracture behavior of DEJ-like biological interface have been discussed. It has been observed that the results provided by the numerical studies without proper accommodation of bridging phenomenon can mislead. This study can be helpful for understanding the DEJ-like biological interface in terms of its fracture toughness, an important material characteristics. This property of the material is an important measure that has to be taken care during design and manufacturing processes.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.36-36
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• 2003

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제36회 동계학술대회 초록집
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• pp.181.2-181.2
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• 2009

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.77-79
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• 2003