• Journal of information and communication convergence engineering
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• v.19 no.2
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• pp.114-119
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• 2021

This paper proposes a method to find an optimal T' with the most terminal of the subset of T' trees that can be connected by a given length by improving a memetic genetic algorithm within several constraints, when the set of terminal T is given to the Euclidean plane R². Constraint (1) is that a given length cannot connect all terminals of T, and (2) considers only the rectilinear layout of the edge connecting each terminal. The construction of interconnections has been used in various design-related areas, from network to architecture. Among these areas, there are cases where only the rectilinear layout is considered, such as wiring paths in the computer network and VLSI design, network design, and circuit connection length estimation in standard cell deployment. Therefore, the heuristics proposed in this paper are expected to provide various cost savings in the rectilinear layout.

• Journal of IKEEE
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• v.25 no.4
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• pp.703-709
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• 2021

As drone technology advances, the risks of drones are increasing, then technology to detect drones is becoming important. In this thesis, it was verified that miniaturized and lightweighted active array antenna could be used for radar system to detect drones in reality. The transmit-receive module was designed in the form of tile-type to simplify interconnections between devices. The waveform generation module and the down conversion module were miniaturized to include in one body too. As a result of verifing the detection performance through test, it was confirmed that the detection range was over 3.7Km.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.261-278
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• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

• The Journal of Korean Physical Therapy
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• v.34 no.6
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• pp.321-325
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• 2022

Purpose: Temporomandibular disorder (TMD) is a condition defined as pain and dysfunction of temporomandibular joints and masticatory muscles. Abnormal interconnections between temporomandibular muscles and cervical spine structures can cause the changes of postural alignment and balance ability. The aim of this study was to investigate changes in static balance ability in subjects with painrelated TMD. Methods: This study conducted on 25 subjects with TMD and 25 control subjects with no TMD. Pressure pain thresholds (PPTs) of the masseter and temporalis muscles were measured using a pressure algometer. Static balance ability was assessed during one leg standing using an Inertial Measurement Unit (IMU) sensor. During balance task, the IMU sensors measured motion and transfer movement data for center of mass (COM) motion, ankle sway and hip sway. Results: PPTs of masseter and temporalis muscles were significantly lower in the TMD group than in the control group (p<0.05). One leg standing, hip sway, and COM sway results were significantly greater in the TMD group (p<0.05), but ankle sways were not different between group. Conclusion: We suggest pain-related TMD is positively related to reduced PPTs of masticatory muscles and to static balance ability. These results should be considered together with global body posture when evaluating or treating pain-related TMD.

• ETRI Journal
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• v.46 no.1
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• pp.82-95
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• 2024

As automated essay scoring (AES) has progressed from handcrafted techniques to deep learning, holistic scoring capabilities have merged. However, specific trait assessment remains a challenge because of the limited depth of earlier methods in modeling dual assessments for holistic and multi-trait tasks. To overcome this challenge, we explore providing comprehensive feedback while modeling the interconnections between holistic and trait representations. We introduce the DualBERT-Trans-CNN model, which combines transformer-based representations with a novel dual-scale bidirectional encoder representations from transformers (BERT) encoding approach at the document-level. By explicitly leveraging multi-trait representations in a multi-task learning (MTL) framework, our DualBERT-Trans-CNN emphasizes the interrelation between holistic and trait-based score predictions, aiming for improved accuracy. For validation, we conducted extensive tests on the ASAP++ and TOEFL11 datasets. Against models of the same MTL setting, ours showed a 2.0% increase in its holistic score. Additionally, compared with single-task learning (STL) models, ours demonstrated a 3.6% enhancement in average multi-trait performance on the ASAP++ dataset.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.48 no.2
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• pp.6-13
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• 2011

This paper deals with the interconnection problem in ad-hoc networks or sensor networks, where relay nodes are deployed additionally to form connections between given nodes. This problem can be reduced to a NP-hard problem. The nodes of the networks, by applications or geographic factors, can be deployed densely in some areas while sparsely in others. For such a case one can make an approximation scheme, which gives shorter execution time, for the additional node deployments by ignoring the interconnections inside the dense area of nodes. However, the case is still a NP-hard, so it is proper to establish a polynomial time approximation scheme (PTAS) by implementing a dynamic programming. The analysis can be made possible by an elaboration on making the definition of the objective function. The objective function should be defined to be able to deal with the requirement incurred by the substitution of the dense area with its abstraction.

• Current Photovoltaic Research
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• v.7 no.4
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• pp.111-120
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• 2019

The output power of a crystalline silicon (c-Si) photovoltaic (PV) module is not directly the sum of the powers of its unit cells. There are several losses and gain mechanisms that reduce the total output power when solar cells are encapsulated into solar modules. Theses factors are getting high attention as the high cell efficiency achievement become more complex and expensive. More research works are involved to minimize the "cell-to-module" (CTM) loss. Our paper is aimed to focus on electrical losses due to interconnection and mismatch loss at PV modules. Research study shows that among all reasons of PV module failure 40.7% fails at interconnection. The mismatch loss in modern PV modules is very low (nearly 0.1%) but still lacks in the approach that determines all the contributing factors in mismatch loss. This review paper is related to study of interconnection loss technologies and key factors contributing to mismatch loss during module fabrication. Also, the improved interconnection technologies, understanding the approaches to mitigate the mismatch loss factors are precisely described here. This research study will give the approach of mitigating the loss and enable improvement in reliability of PV modules.

• International Journal of Oral Biology
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• v.37 no.1
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• pp.9-16
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• 2012

The aim of this study was to evaluate surface characteristics and biological properties of the dentin -derived hydroxyapatite (HA) coating on titanium substrate. Dentinderived HA was obtained from extracted human teeth using a calcination method at $850^{\circ}C$. The commercially pure titanium (cp-Ti, ASTM Grade II) was used as a metallic substrate and a radio frequency magnetron sputtering method was employed as a coating method. Scanning electron microscopy (SEM) and energy dispersive X-ray analysis (EDX) were utilized to investigate the coating aspects and composition. Atomic forced microscopy (AFM) and a surface profiler were used to assess the surface morphology and roughness. Corrosion tests were performed in phosphate-buffered saline at a $36.5{\pm}1^{\circ}C$ in order to determine the corrosion behavior of the uncoated and coated specimens. The biocompatibility of dentin-derived HA coated specimens with fetal rat calvarial cells and human gingival fibroblasts was assessed by SEM and cell proliferation analysis. The results showed that the dentin-derived HA coatings appeared to cover thinly and homogeneously the surfaces without changing of the titanium substrate. The EDX analysis of this the coating surface indicated the presence of Ca and P elements. The mean surface roughness of cp-Ti and dentin-derived coating specimens was $0.27{\mu}m$ and, $1.7{\mu}m$, respectively. Corrosion tests indicated a stable passive film of the dentin-derived HA coating specimens. SEM observations of fetal rat calvarial cells and human fibroblast cells on coated surfaces showed that the cells proliferated and developed a network of dense interconnections. The cells on all specimens proliferated actively within the culture period, showing good cell viability. At day 1 and 3, dentin-derived coating specimens showed 89% and 93% cell viability, respectively, when normalized to cp-Ti specimens. These results suggest that dentin-derived HA coating using the RF magnetron sputtering method has good surface characteristics and biocompatibility.