• 제목/요약/키워드: Inductively coupled sensor

검색결과 16건 처리시간 0.026초

Implementation of an Inductively Coupled EM Probe System for PD Diagnosis

  • Kim, Hee-Dong;Park, Noh-Joon;Park, Dae-Hee
    • Journal of Electrical Engineering and Technology
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    • 제6권1호
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    • pp.111-118
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    • 2011
  • In recent years, various types of partial discharge (PD) methods such as capacitive, inductive, electromagnetic, and acoustic coupling techniques have been developed for diagnosing rotating machines. An electromagnetic (EM) probe, which is an inductively coupled type of sensor, is required for detecting corona and internal discharges during off-line tests. In this study, a new technique for enhancing the measurement sensitivities for corona and internal discharge based on an EM inductive position sensor is proposed. An EM probe that winds wires around horseshoe-shaped and cylindershaped ferrites as helices is designed and optimized for the implementation of off-line PD monitoring of the stator winding of a rotating machine. The measurement system based on this design is implemented, and it is verified from the results of the experiment performed in this study that the probe provides similar performance as existing commercial products.

Double-Side Notched Long-Period Fiber Gratings fabricated by Using an Inductively Coupled Plasma for Force Sensing

  • Fang, Yu-Lin;Huang, Tzu-Hsuan;Chiang, Chia-Chin;Wu, Chao-Wei
    • Journal of the Korean Physical Society
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    • 제73권9호
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    • pp.1399-1404
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    • 2018
  • This study used an inductively coupled plasma (ICP) dry etching process with a metal amplitude mask to fabricate a double-side notched long-period fiber grating (DNLPFG) for loading sensing. The DNLPFG exhibited increasing resonance attenuation loss for a particular wavelength when subjected to loading. When the DNLPFG was subjected to force loading, the transmission spectra were changed, showing a with wavelength shift and resonance attenuation loss. The experimental results showed that the resonant dip of the DNLPFG increased with increasing loading. The maximum resonant dip of the $40-{\mu}m$ DNLPFG sensor was -26.522 dB under 0.049-N loading, and the largest force sensitivity was -436.664 dB/N. The results demonstrate that the proposed DNLPFG has potential for force sensing applications.

Influence of Inductively Coupled Oxygen Plasma on the Surface of Poly(ether sulfone)

  • Lee, Do Kyung;Sohn, Young-Soo
    • 센서학회지
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    • 제31권4호
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    • pp.214-217
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    • 2022
  • The effect of inductively coupled plasma (ICP) treatment with O2 gas on the surface properties of poly(ether sulfone) (PES) was investigated. X-ray photoelectron spectroscopy (XPS) was used to analyze the chemical characteristics of the O2 plasma-treated PES films. The surface roughness of the pristine and O2 plasma-treated PES films for different RF powers of the ICP was determined using an atomic force microscope (AFM). The contact angles of the PES films were also measured, using which the surface free energies were calculated. The O1s XPS spectra of the PES films revealed that the number of polar functional groups increased following the O2 plasma treatment. The AFM analysis showed the average surface roughness increased from 1.01 to 4.48 nm as the RF power of the ICP was increased. The contact angle measurements revealed that the PES films became more hydrophilic as the RF power of the ICP was increased. The total surface energy increased with the RF power of the ICP, resulting from the increased polar energy component.

ICP-RIE를 이용한 저압용 실리콘 압력센서 제작 (Fabrication of a silicon pressure sensor for measuring low pressure using ICP-RIE)

  • 이영태
    • 센서학회지
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    • 제16권2호
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    • pp.126-131
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    • 2007
  • In this paper, we fabricated piezoresistive pressure sensor with dry etching technology which used ICP-RIE (inductively coupled plasma reactive ion etching) and etching delay technology which used SOI (silicon-on-insulator). Structure of the fabricated pressure sensor shows a square diaphragm connected to a frame which was vertically fabricated by dry etching process and a single-element four-terminal gauge arranged at diaphragm edge. Sensitivity of the fabricated sensor was about 3.5 mV/V kPa at 1 kPa full-scale. Measurable resolution of the sensor was not exceeding 20 Pa. The nonlinearity of the fabricated pressure sensor was less than 0.5 %F.S.O. at 1 kPa full-scale.

Inductively coupled nanocomposite wireless strain and pH sensors

  • Loh, Kenneth J.;Lynch, Jerome P.;Kotov, Nicholas A.
    • Smart Structures and Systems
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    • 제4권5호
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    • pp.531-548
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    • 2008
  • Recently, dense sensor instrumentation for structural health monitoring has motivated the need for novel passive wireless sensors that do not require a portable power source, such as batteries. Using a layer-by-layer self-assembly process, nano-structured multifunctional carbon nanotube-based thin film sensors of controlled morphology are fabricated. Through judicious selection of polyelectrolytic constituents, specific sensing transduction mechanisms can be encoded within these homogenous thin films. In this study, the thin films are specifically designed to change electrical properties to strain and pH stimulus. Validation of wireless communications is performed using traditional magnetic coil antennas of various turns for passive RFID (radio frequency identification) applications. Preliminary experimental results shown in this study have identified characteristic frequency and bandwidth changes in tandem with varying strain and pH, respectively. Finally, ongoing research is presented on the use of gold nanocolloids and carbon nanotubes during layer-by-layer assembly to fabricate highly conductive coil antennas for wireless communications.

Pt-AlGaN/GaN HEMT-based hydrogen gas sensors with and without SiNx post-passivation

  • Vuong, Tuan Anh;Kim, Hyungtak
    • 전기전자학회논문지
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    • 제23권3호
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    • pp.1033-1037
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    • 2019
  • GaN-based sensors have been widely investigated thanks to its potential in detecting the presence of hydrogen. In this study, we fabricated hydrogen gas sensors with AlGaN/GaN heterojunction and investigated how the sensing performance to be affected by SiN surface passivation. The gas sensor employed a high electron mobility transistors (HEMTs) with 30 nm platinum catalyst as a gate to detect the hydrogen presence. SiN layer was deposited by inductively-coupled chemical vapor deposition as post-passivation. The sensors with SiN passivation exhibited hydrogen sensing characteristics with various gas flow rates and concentrations of hydrogen in inert background gas at $200^{\circ}C$ similar to the ones without passivation. Aside from quick response time for both sensors, there are differences in sensitivity and recovery time because of the existence of the passivation layer. The results also confirmed the dependence of sensing performance on gas flow rate and gas concentration.

전계방출 및 근접 광센서 응용을 위한 서브 마이크론 aperture의 제작 (Microfabrication of submicron-size hole for potential held emission and near field optical sensor applications)

  • Lee, J.W.;Park, S.S.;Kim, J.W.;M.Y. Jung;Kim, D.W.
    • 한국진공학회지
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    • 제9권2호
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    • pp.99-101
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    • 2000
  • Submicron aperture 제작 기술은 near field optical sensor 또는 liquid metal ion source에 응용될 수 있는 가능성으로 인해 흥미를 모으고 있다. 본 실험에서는 submicron aperture 제작에 대해 기술할 것이다. 먼저 2 $\mu\textrm{m}$크기의 dot array를 광학 리소그라피 방법으로 패턴화하였다. KOH 비등방성 식각 방법으로 V-groove형을 만든 후, $1000^{\circ}C$에서 600분동안 건식 산화작업을 거쳤다. 이 산화과정에서 결정 방향에 따라 산화율이 달라지게 되는데 Si(111)면은 Si(100)면에 비해 산화율이 커서 두꺼운 산화막이 형성되며, 이 막은 연이은 건식식각 과정에서 etch-mask로 활용된다. Reactive ion etching은 ICP (Inductively Coupled Plasma) 장비를 사용하였으며, V-groove의 바닥에 형성된 90nm두께의 SiO$_2$와 그 아래의 Si을 식각하였다. 이 때, 기판에 걸린 negative bias는 $Cl_2$ RIE의 anisotropic etchig 효과를 증대시키는 것 같았으며, SEM촬영 결과 식각 후에 Si(111)면 위에는 약 130 nm정도의 산화층이 잔류하고 있었다. 이렇게 형성된 Si aperture는 향후 NSOM sensor등에 적용될 수 있을 것이다.

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$SnO_2$ 나노와이어를 이용한 NOx 가스센서 제작 및 특성평가 (Fabrication and Characteristic of NOx Gas Sensor by Using $SnO_2$ Nanowires)

  • 강교성;권순일;박재환;양계준;임동건
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.40-41
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    • 2007
  • $SnO_2$ nanowires are used at the nanoscale level for the electrical transduction of the gas interaction with these sensing materials. We report on a study of high sensitivity and fast NOx gas sensor. We focused on improving the response time and refresh time by growth nanowires on the trench structure of Si substrate as air path. To improve refresh time we applied the trench structure with depth of $10\;{\mu}m$ by the inductively coupled plasma reactive ion etching(ICP-RIE). The fabricated device was measured at temperature of $200{\sim}300^{\circ}C$. The sensor exhibit ultra-fast and reversible electrical response (t90% ~4 s for response and ~3 s for recovery).

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Analysis of H-ICP Source by Noninvasive Plasma Diagnostics of Etching Process

  • Park, Kun-Joo;Kim, Min-Shik;Lee, Kwang-Min;Chae, Hee-Yeop;Lee, Hi-Deok
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.126-126
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    • 2009
  • Noninvasive plasma diagnostic technique is introduced to analyze and characterize HICP (Helmholtz Inductively Coupled Plasma) source during the plasma etching process. The HICP reactor generates plasma mainly through RF source power at 13.56MHz RF power and RF bias power of 12.56MHz is applied to the cathode to independently control ion density and ion energy. For noninvasive sensors, the RF sensor and the OES (Optical emission spectroscopy) were employed since it is possible to obtain both physical and chemical properties of the reactor with plasma etching. The plasma impedance and optical spectra were observed while altering process parameters such as pressure, gas flow, source and bias power during the poly silicon etching process. In this experiment, we have found that data measured from these noninvasive sensors can be correlated to etch results. In this paper, we discuss the relationship between process parameters and the measurement data from RF sensor and OES such as plasma impedance and optical spectra and using these relationships to analyze and characterize H-ICP source.

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The Fabrication of an Applicative Device for Trench Width and Depth Using Inductively Coupled Plasma and the Bulk Silicon Etching Process

  • Woo, Jong-Chang;Choi, Chang-Auck;Kim, Chang-Il
    • Transactions on Electrical and Electronic Materials
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    • 제15권1호
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    • pp.49-54
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    • 2014
  • In this study, we carried out an investigation of the etch characteristics of silicon (Si) film, and the selectivity of Si to $SiO_2$ in $SF_6/O_2$ plasma. The etch rate of the Si film was decreased on adding $O_2$ gas, and the selectivity of Si to $SiO_2$ was increased, on adding $O_2$ gas to the $SF_6$ plasma. The optical condition of the Si film with this work was 1,350 nm/min, at a gas mixing ratio of $SF_6/O_2$ (=130:30 sccm). At the same time, the etch rate was measured as functions of the various etching parameters. The X-ray photoelectron spectroscopy analysis showed the efficient destruction of oxide bonds by ion bombardment, as well as the accumulation of high volatile reaction products on the etched surface. Field emission auger electron spectroscopy analysis was used to examine the efficiency of the ion-stimulated desorption of the reaction products.