• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.27-31
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• 2018

The effect of $NH_3$ plasma passivation on the chemical and electrical characteristics of ALD HfAlO dielectric on the InGaAs substrate was investigated. The results show that $NH_3$ plasma passivation exhibit better electrical & chemical performance such as much lower leakage current, lower density of interface trap(Dit) level, and low unstable interfacial oxide. $NH_3$ plasma passivation can effectively enhance interfacial characteristics. Therefore $NH_3$ plasma passivation improved the HfAlO dielectric performance on the InGaAs substrate.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.11
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• pp.30-36
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• 1997

AlGaAs/GaAs HBTs are developed well enough to be commercialized as an active device in optical transmission system, but there remains the unanswered questions about reliability. In this paper we applied the reverse constant current stress at the high voltage in avalanche region for a long time to find out a new degradation mechanism of junctrion I-V. The unction off-set voltage at which the current vanishes to zero was shifted to the negative direction of applied bias due to the increment of leakage current as the stress time increases. It was identified that the degradation was induced by the hot carriers which were generated at space charge region and trapped at the interface between GaAs base and the passivation nitride enhancing the electric field across the nesa edge.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.7
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• pp.469-473
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• 2003

The effect of photoquenching on infrared image of the EL2 center in semi-insulating(S.I.) GaAs has been studied using near infrared transmission techniques. Particular interest is devoted to as-grown and annealed samples of undoped S.I. GaAs. It is found that the quenching mechanism is different in each sample and also the quenching rate is dependent on the materials and the quenching temperature which is somewhat inconsistent with other existing publications.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.3
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• pp.11-17
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• 1998

Although GaAs HBTs are very attractive for high power amplifier because of their power handling capablity, they can't be actively commercialized due to the degradation of current gain occured in hihg current operation. In this paper we analyzed the type of current gain degradation of GaAs HBTs under high constant current stress, and identified the mechanism by using two dimensional numerical simulation. The cause of degradation was found out to be the variation of surface recombination states at the interface between GaAs extrinstic base and the nitride passivating the surface of base. The energy radiated from recombination of carriers in bulk as well as near the surface is estimated to activate the change of the surface states.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.257-262
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• 1999

The selective area growth of GaN by metal organic chemical vapor deposition has been carried out on GaN/ sapphire substrate using $SiO_2$ mask. We investgated the effect of growth parameters such as flow rate of $NH_3$(500­~1300sccm) and the growth temperature(TEX>$950~1060^{\circ}C$) on the growth selectivity and characteristics of GaN using the Scanning Electron Microscopy(SEM). The selectivity of GaN improved as flow rate of NH, and growth temperature in­creased. But the grown GaN shapes on the substrate windows was independent of the flow rate of $NH_3$. On the pattern shapes such as circle, stripe, and radiational pattern(rotate the stripe pattern by $30^{\circ}, 45^{\circ}$), we observed the hexagonal pyramid, the lateral over growth on the mask layer, and the difference of the lateral growth rate depending on growth condition.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1998.06a
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• pp.149-156
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• 1998

In this work, aiming at improvement of growth processes for the bulk GaAs single crystals, efforts have been made first in investigate thermodynamic properties of the Ga and As system and second to suggest that bulk GaAs crystals could be grown in principle with the single temperature zone only by determining the excess arsenic charge as a function of growth conditions. During crystal growth, this will be evaporized inside the growth chamber to induce the required inner pressure, instead of aesenic vapor pressure in the double temperature zone method, so as to be in equilibrium with the method, growth experiments have been prepared and carried out for dopes and undoped GaAs crystals with the newly built Bridgman system which was designed according to this principle. To compare the results to those of the double temperature zone method, the same numbers of GaAs crystals have been grown with both processes and all of them were characterized in single crystallinity, lattice defects and electrical properties. Especially, the relationship between growth conditions and crystal quality was discussed from the viewpoint of growth peculiarities with this method.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.16-19
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• 2000

DC and low frequency noise characteristics of InGaP/InGaAs pseudomorphic HEMTs (p-HEMTs) grown by compound source MBE are investigated for temperature range of 150K to 370K. Equivalent input noise spectra( $S_{iv}$ ) were measured as a function of frequency and temperature. $S_{iv}$ was measured to be 3.4 $\times$ 10$^{-12}$ $V^2$/ Hz at 1kHz for 1.3 X 50${\mu}{\textrm}{m}$$^2$InGaP/InGaAs p-HEMT at room temperature. Measurements of the low-frequency noise spectra of the p-HEMT as a function of temperature show that the trap with an activation energy level around 0.589 eV is a dominant trap that accounts for the low-frequency noise behavior of the device. The normalized extrinsic gm frequency dispersion of the p-HEMT. was as low as 2.5％ at room temperature, indicating that the device has well-behaved low-frequency noise characteristics. Sub-micron (0.25 $\times$ 50${\mu}{\textrm}{m}$$^2$) gate p-HEMT showed $f_{T}$ and $f_{max}$ of 40GHz and 108GHz, respectively.y.y.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.164-164
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• 2011

본 연구에서는 InAs 양자점 태양전지의 활성영역에 크기가 다른 양자점을 삽입하여 그 광학적 특성변화를 photoreflectance (PR)와 photoluminescence (PL)를 이용하여 연구하였다. 본 연구에 사용된 InAs 양자점 태양전지 구조는 n+-GaAs (100) 기판 위에 n+-GaAs buffer를 300 nm 성장 후 활성영역에 InAs 양자점과 40 nm 의 n-GaAs spacer를 이용하여 8층의 양자점을 삽입하였다. 그 위에 n-GaAs $1.14{\mu}m$와 p+-GaAs $0.6{\mu}m$, p+-AlGaAs window를 50 nm 성장하고 ohmic contact을 위하여 p+-GaAs 10 nm 성장하였다. 활성영역에 사용된 InAs 양자점의 크기는 InAs 조사량을 1.7 ML~3.0 ML까지 변화시키며 조절하였다. 양자점 태양전지의 활성영역에 삽입한 양자점의 크기에 따른 photoreflectance 측정에서 InAs 조사량이 0~2 ML 사이에서는 Franz-Keldysh oscillation (FKO)의 주기가 짧아지고 2.5 ML 이상에서는 일정한 값 가짐을 보였다. 이는 양자점의 크기가 커질수록 내부 응력에 의한 전기장의 변화에 의한 것으로 사료된다. 아울러 InAs 양자점 태양전지의 photoluminescence 측정 결과 상온에서 1.35 eV 근처에 발광이 관측되었으며 InAs 조사량이 증가할수록 발광중심 낮은 에너지쪽으로 이동함을 보였으며 태양전지 효율은 2.0 ML 인 경우 최고치를 나타내었다. InAs 조사량을 2.0 ML 이상 증가 시킨 경우는 효율이 점진적으로 감소하였다.

• Journal of Korea Multimedia Society
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• v.4 no.1
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• pp.82-90
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• 2001

Genetic Algorithm(GA) has known as a method of solving NP problem in various applications. Since a major drawback of the GA is that it needs a long computation time, the hardware implementation of Genetic Algorithm is focused on in recent studies. This paper proposes a new type of embedded one chip computer fort Hardware Implementation of Genetic Algorithm. The proposed embedded one chip computer consists of 16 Bit CPU care and hardware of genetic algorithm. In contrast to conventional hardware oriented GA which is dependent on main computer in the process of GA, the proposed embedded one chip computer is independent on main computer. Conventional hardware GA uses the fixed length of chromosome but the proposed embedded one chip computer uses the variable length of chromosome by employing the efficient 16 bit Pipeline Unit. Experimental results show that the proposed one chip computer is applicable to the design of evolvable hardware for Random NRZ bit synchronization circuit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.1022-1025
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• 2002

This paper presents the reliability of planar InP/InGaAs avalanche photodiodes (APD's) with recess etching, which is very crucial for the commercial 10-Gb/s optical receiver application. A versatile design for the planar InP/InGaAs APD's and bias-temperature tests to evaluate long-term reliability at temperature from 200 to $250^{\circ}C$. The reliability is examined by accelerated life tests by monitoring dark current and breakdown voltage. The lifetime of the APD's is estimated by a degradation activation energy. Based on the test results, it is concluded that the planar InP/InGaAs APD's with recess etching shows the sufficient reliability for practical 10-Gb/s optical receivers.