• Title/Summary/Keyword: InGaAs/GaAs

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Growing of AlGaAs/GaAs Double-Heterostructure by the Liquid Phase Epitaxy Method and Fabrication of the Light Emitting Diode (액상에피층 성장방법에 의한 AlGaAs/GaAs 이중 헤테로 구조의 성장과 LED의 제작)

  • 이원성;권영세
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.21 no.5
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    • pp.11-16
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    • 1984
  • In this paper, the construction of the Liquid Phase Epitaxy system for fabricating III-V compound semiconductor devices and the method of growing AIGaAs/GaAs Double-Hetero-structure are discussed. The possibility of this Double-Heterostructure for the Light Emitting Diode is confirmed also.

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Effects of Surface Offcut Angle of GaAs Substrate on Dislocation Density of InGaP Epilayers (GaAs기판의 표면 Offcut각도가 InGaP 에피막의 전위밀도에 미치는 영향)

  • 이종원;박경수;이종식
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.3
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    • pp.49-56
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    • 2002
  • In this study, the InGaP epilayers were grown on the exact and the $2^{\circ}$, $6^{\circ}$, $10^{\circ}$ of cut GaAs substrates by metal-organic vapor phase epitaxy, and the effects of interfacial elastic strains determined by the substrate offcut angle upon the resulting dislocation density of epilayer were investigated for the first time. The elastic strains were obtained from lattice mismatch and lattice misfit by TXRD, and the dislocation densities from epilayer x-ray FWHM. For the offcut angle range used in this study, the elastic strain was maximum and x-ray FWHM minimum at offcut angle $6^{\circ}$. From 11K PL measurements, PL wavelength was found to decrease with an increase of offcut angle. PL intensity was maximum at offcut angle $6^{\circ}$. TEM results showed that the electron diffraction pattern was of typical zincblende structure, and that the dislocation density was minimum for substrate offcut angle $6^{\circ}$. The results obtained in this study, along with the device fabrication process and beam characteristics, clearly demonstrated that the optimum substrate offcut angle for the InGaP/GaAs heterostructures is $6^{\circ}$.

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Morphological and Photoluminescence Characteristics of Laterally Self-aligned InGaAs/GaAs Quantum-dot Structures (수평 자기정렬 InGaAs/GaAs 양자점의 형태 및 분광 특성 연구)

  • Kim J. O.;Choe J. W.;Lee S. J.;Noh S. K.
    • Journal of the Korean Vacuum Society
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    • v.15 no.1
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    • pp.81-88
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    • 2006
  • Laterally self-aligned InGaAs/GaAs quantum-dots (QDs) have been fabricated by using a multilayer stacking technique. For the growth optimization, we vary the number of stacks and the growth temperature in the ranges of 1-15 periods and $500-540^{\circ}C$. respectively, Atomic force microscope (AFM) images and photoluminescence (PL) spectra reveal that the lateral alignment of QDs is enhanced in extended length by an increased stack period, but severely degrades into film-like wires above a critical growth temperature. The morphological and the photoluminescence characteristics of laterally self-aligned InGaAs QDs have been analyzed through mutual comparisons among four samples with different parameters. An anisotropic arrangement develops with increasing number of stacks, and high-temperature capping allows isolated QDs to be spontaneously organized into a one-dimensionally aligned chain-like shape over a few ${\mu}m$, Moreover, the migration time allowed by growth interruption plays an additional important role in the chain arrangement of QDs. The QD chains capped at high temperature exhibit blue shifts in the emission energy, which may be attributed to a slight outdiffusion of In from the InGaAs QDs.

A TEM Study on Growth Characteristics of GaN on Si(111) Substrate using MOCVD (Si(111) 기판 위에 MOCVD 법으로 성장시킨 GaN의 성장 특성에 관한 TEM 분석)

  • 신희연;정성훈;유지범;서수정;양철웅
    • Journal of the Korean institute of surface engineering
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    • v.36 no.2
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    • pp.135-140
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    • 2003
  • The difference in lattice parameter and thermal expansion coefficient between GaN and Si which results in many defects into the grown GaN is larger than that between GaN and sapphire. In order to obtain high quality GaN films on Si substrate, it is essential to understand growth characteristics of GaN. In this study, GaN layers were grown on Si(111) substrates by MOCVD at three different GaN growth temperatures ($900^{\circ}C$, $1,000^{\circ}C$ and $1,100^{\circ}C$), using AlN and LT-GaN buffer layers. Using TEM, we carried out the comparative investigation of growth characteristics of GaN by characterizing lattice coherency, crystallinity, orientation relationship and defects formed (transition region, stacking fault, dislocation, etc). The localized region with high defect density was formed due to the lattice mismatch between AlN buffer layer and GaN. As the growth temperature of GaN increases, the defect density and surface roughness of GaN are decreased. In the case of GaN grown at $1,100^{\circ}$, growth thickness is decreased, and columns with out-plane misorientation are formed.

InP 기판에 형성한 InAs/InAlGaAs 양자점의 광학적 특성

  • Lee, Ha-Min;Jo, Byeong-Gu;Choe, Il-Gyu;Park, Dong-U;Lee, Gwan-Jae;Lee, Cheol-Ro;Kim, Jin-Su;Han, Won-Seok;Im, Jae-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.194.2-194.2
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    • 2015
  • 본 논문에서는 InP 기판에 자발형성법 (Self-assembled Mode)으로 성장한 InAs/InAlGaAs 양자점(Quantum Dots)의 외부 열처리 온도에 따른 광학적 특성을 논의한다. 분자선증착기 (Molecular Beam Epitaxy, VH80MBE)로 5주기 적층구조를 갖는 InAs/InAlGaAs 양자점 시료 (기준시료)를 성장 후 온도 의존성 및 여기광세기 의존성 포토루미네슨스 (photoluminescence, PL) 분광법으로 기본특성을 평가하였다. 양자점 시료를 $500{\sim}800^{\circ}C$에서 열처리를 수행하고 광학적 특성을 열처리 전과 비교하여 분석하였다. $550^{\circ}C$에서 열처리한 InAs/InAlGaAs 양자점 시료의 저온 (11K) PL 파장은 1465 nm를 보였으며, 이는 열처리를 하지 않은 기준시료의 1452 nm 보다 13 nm 장파장으로 이동하였다. 열처리 온도가 $700^{\circ}C$ 이상인 경우, 양자점 PL 파장이 다시 단파장으로 이동하는 현상을 보였지만 여전히 열처리하지 않은 기준시료보다 장파장을 나타내었다. $700^{\circ}C$에서 열처리한 양자점 시료의 저온 PL 광세기는 기준시료보다 15.5배 더 크게 나타났으며, 주변 온도가 증가할수록 더디게 감소하는 것을 확인할 수 있었다. 온도의존성 PL로부터 구한 활성화에너지 (Activation Energy)는 $700^{\circ}C$ 열처리 온도의 경우 175.9 meV를 나타내었다. InAs/InAlGaAs 양자점 시료의 열처리 온도에 따른 광특성 변화를 InAs 양자점과 InAlGaAs 장벽층 계면에서 III족 원소인 In, Al 및 Ga의 상호확산과 결함이 완화되는 현상으로 해석할 수 있다.

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The Characteristics of $GaAs_{0.35}P_{0.65}$ Epitaxial Layer According to in-situ doping of $NH_3$ gas (In-situ $NH_3$ doping에 따른 $GaAs_{0.35}P_{0.65}$ 에피막의 특성)

  • Lee, Eun-Cheol;Lee, Cheol-Jin
    • Proceedings of the KIEE Conference
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    • 1998.07d
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    • pp.1249-1251
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    • 1998
  • We have studied the properties of $GaAs_{0.35}P_{0.65}$ epitaxial films on the GaP according to doping of $NH_3$ gas using VPE method by CVD. The efficiency of $GaAs_{0.35}P_{0.65}$ epitaxial films found to be greatly enhanced by the according of nitrogen doping. The diodes were fabricated by means of Zn diffusion into vapor grown $GaAs_{0.35}P_{0.65}$ epitaxial films doped with N and Te. The effects of nitrogen doping on carrier density of epitaxial films, PL wavelength and the power out, forward voltage of diodes are discussed. In the end, The effect of electrical and optical properties is influenced by the deep level and deep level density of nitrogen doping.

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Effect of Annealing Temperature on the Luminescence Properties of Digital-Alloy InGaAlAs Multiple Quantum Wells (디지털 합금 InGaAlAs 다중 양자 우물의 열처리 온도에 따른 발광 특성)

  • Cho, Il Wook;Byun, Hye Ryoung;Ryu, Mee-Yi;Song, Jin Dong
    • Journal of the Korean Vacuum Society
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    • v.22 no.6
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    • pp.321-326
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    • 2013
  • The effect of rapid thermal annealing (RTA) on the optical properties of digital-alloy InGaAlAs multiple quantum well (MQW) structures have been investigated by using photoluminescence (PL) and time-resolved PL measurements as a function of RTA temperature. The MQW samples were annealed from $700^{\circ}C$ to $850^{\circ}C$ for 30 s in a nitrogen atmosphere. The MQW sample annealed at $750^{\circ}C$ exhibited the strongest PL intensity and the narrowest FWHM (Full width at half maximum), indicating the reduced nonradiative recombination centers and the improved interfaces between the wells and barriers. The MQW samples annealed at $800^{\circ}C$ and $850^{\circ}C$ showed the decreased PL intensities and blueshifted PL peaks compared to $750^{\circ}C$-annealed sample. The blueshift of PL peak with increasing RTA temperatures are ascribed to the increase of aluminum due to intermixing of gallium (Ga) and aluminum (Al) in the interfaces of InGaAs/InAlAs short-period superlattices. The decrease of PL intensity after annealing at $800^{\circ}C$ and $850^{\circ}C$ are attributed to the interface roughening and lateral composition modulation caused by the interdiffusion of Ga and Al and indium segregation, respectively. With increasing RTA temperature the PL decay becomes slower, indicating the decrease of nonradiative defect centers. The optical properties of digital-alloy InGaAlAs MQW structures can be improved significantly with optimum RTA conditions.

Influence of Ga Content on the Ionic Conductivity of Li1+XGaXTi2-X(PO4)3 Solid-State Electrolyte Synthesized by the Sol-Gel Method

  • Seong-Jin Cho;Jeong-Hwan Song
    • Korean Journal of Materials Research
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    • v.34 no.4
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    • pp.185-193
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    • 2024
  • In this study, NASICON-type Li1+XGaXTi2-X(PO4)3 (x = 0.1, 0.3 and 0.4) solid-state electrolytes for all-solid-state batteries were synthesized through the sol-gel method. In addition, the influence on the ion conductivity of solid-state electrolytes when partially substituted for Ti4+ (0.61Å) site to Ga3+ (0.62Å) of trivalent cations was investigated. The obtained precursor was heat treated at 450 ℃, and a single crystalline phase of Li1+XGaXTi2-X(PO4)3 systems was obtained at a calcination temperature above 650 ℃. Additionally, the calcinated powders were pelletized and sintered at temperatures from 800 ℃ to 1,000 ℃ at 100 ℃ intervals. The synthesized powder and sintered bodies of Li1+XGaXTi2-X(PO4)3 were characterized using TG-DTA, XRD, XPS and FE-SEM. The ionic conduction properties as solid-state electrolytes were investigated by AC impedance. As a result, Li1+XGaXTi2-X(PO4)3 was successfully produced in all cases. However, a GaPO4 impurity was formed due to the high sintering temperatures and high Ga content. The crystallinity of Li1+XGaXTi2-X(PO4)3 increased with the sintering temperature as evidenced by FE-SEM observations, which demonstrated that the edges of the larger cube-shaped grains become sharper with increases in the sintering temperature. In samples with high sintering temperatures at 1,000 ℃ and high Ga content above 0.3, coarsening of grains occurred. This resulted in the formation of many grain boundaries, leading to low sinterability. These two factors, the impurity and grain boundary, have an enormous impact on the properties of Li1+XGaXTi2-X(PO4)3. The Li1.3Ga0.3Ti1.7(PO4)3 pellet sintered at 900 ℃ was denser than those sintered at other conditions, showing the highest total ion conductivity of 7.66 × 10-5 S/cm at room temperature. The total activation energy of Li-ion transport for the Li1.3Ga0.3Ti1.7(PO4)3 solid-state electrolyte was estimated to be as low as 0.36 eV. Although the Li1+XGaXTi2-X(PO4)3 sintered at 1,000 ℃ had a relatively high apparent density, it had less total ionic conductivity due to an increase in the grain-boundary resistance with coarse grains.

A Study of Characteristics of lnxGa1-xP by Photoreflectance measurement (Photoreflectance 측정에 의한 InxGa1-xP의 특성 연구)

  • Kim D. L.;Yu J. I.
    • Laser Solutions
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    • v.8 no.3
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    • pp.5-10
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    • 2005
  • [ $InxGa_{1-x}P/GaAs$ ] structures were grown by chemical beam epitaxy(CBE), Pure phosphine($PH_3$) gases were used as group V sources. for the group III sources, TEGa, TmIn were used. $InxGa_{1-x}P$ epilayer was grown on SI-GaAs substrate and has a 1-${\mu}m$ thick. We have investigated the characteristics of $InxGa_{1-x}P$ by the photoreflectance(PR) spectroscopy, The PR spectrum of $InxGa_{1-x}P$ shows third-derivative feature whose Peaks Provide energy gap. The energy gap of $InxGa_{1-x}P$ has deduced composition x. From temperature dependance of PR spectra, temperature coefficient is $dEg/dT=-3.773{\times}10^{-4}$ eV/K, and Varshni coefficients $\alpha$ and $\beta$ values obtained $4{\times}10^4$ eV/K and 267 K respectively. Also, interaction $\alpha$B was 19.4 meV using the Bose-Einstein temperature relation, and $\Theta$ value related the average phonon frequency were 101.4 K. In particular, shoulder peak related to defects observed in PR signal that measured in temperature 82 K.

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