• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.1
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• pp.21-24
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• 2020

We investigated a solution-driven Yttrium Tin Oxide (YSnO) film that was imprinted using a parallel nanostructure as a liquid crystal (LC) alignment layer. The imprinting process was conducted at the annealing temperature of 100℃. To evaluate the effect of this process, we conducted surface analyses including atomic force microscopy (AFM). During imprinting, the surface roughness was reduced, and anisotropic characteristics were observed. Planar LC alignment was observed at a pretilt angle of 0.22° on YSnO film. Surface anisotropy induced by imprinting method forces LC to align along the direction of the parallel nanostructure, which is an alternative to conventional polyimide treated using a rubbing process.

• Transactions of Materials Processing
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• v.22 no.1
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• pp.36-41
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• 2013

The present study examines the micro-pattern replication on a plastic film using ultrasonic imprinting. Ultrasonic imprinting uses ultrasonic waves to generate repetitive microscale deformation in the polymer film. The resulting deformation heat on the surface of the film causes the surface region to soften sufficiently so that a replication of the micro-pattern can be obtained. To successfully replicate the micro-pattern on a large area of polymer film, a high replication ratio is needed as well as good uniformity over the entire region. In this study, a horn design is investigated by finite element analysis and is optimized through a response surface analysis. In the ultrasonic imprinting experiments, the response surface method was also used to determine the optimal processing conditions for better replication characteristics.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.579-584
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• 2008

A nano-imprinting stage has been widely used in various fields of nanotechnology. In this study, an analysis method of a nano-imprinting stage machine using FEM and flexible multi-body vibration has been presented. The simulation using CAE for the imprinting machine is to analyze vibration characteristics of 3-axis nano-imprinting stage and 4-axis nano-imprinting stage. Structural components such as the upper plate have been modeled with finite elements to analyze flexibility effects during the precision stage motion. In this paper flexible multi-body dynamic simulation is executed to support robust design of the precision stage mechanism.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.211-217
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• 2007

A nano-imprinting stage has been widely used in various fields of nanotechnology. In this study, an analysis method of a nano-imprinting stage machine using FEM and flexible multi-body kinematics and dynamics has been presented. We have developed a virtual imprinting machine to evaluate the prototype design in the early design stage. The simulation using CAE for the imprinting machine is not only to analyze static and dynamic characteristics of the machine but also to determine design parameters of the components for the imprinting machine, such as dimensions and specifications of actuators and sensors. Structural components as the upper plate, the rotator, the shaft and the translator have been modeled with finite elements to analyze flexibility effects during the precision stage motion. In this paper flexible multi-body dynamic simulation is executed to support robust design of the precision stage mechanism. In addition, we made the 4-axis stage model to compare the dynamic behavior with that of 3-axis stage model.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.371-374
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• 2007

A method for metal nano powder imprinting is proposed as a patterning process for conductive tracks that is inexpensive and scalable down to the nanoscale. Conductive tracks with line widths of $0.5{\sim}20{\mu}m$ were fabricated using this method. The processing conditions were optimized to avoid various types of defects, and to increase the degree of sintering and electric conductivity of the imprinted conductive tracks. The mean electric resistivity of the conductive tracks imprinted under optimum conditions was $8.95{\mu}{\Omega}{\cdot}cm$, which is in the range required for practical applications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.196-198
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• 2003

Classical lithography in semiconductor employs stepper technologies. Limits of this technology are clearly seen at structures below 100nm. Nano-imprinting lithography is a new method for generating patterns in submicron range at reasonable cost. In order to manufacture nano-imprinting lithography(NIL) equipment, several NIL manufacturers have been developing key technologies for realization of nano-imprinting process, recently. In this paper, we've been describe state-of-the-art and technology trends for nano-imprinting lithography equipments.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.104-107
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• 2007

An aspheric microlens array to improve the properties of multi optical probes was designed and fabricated. To generate multi optical probes with good qualities, a microlens array with the minimum spherical aberration was designed by ray tracing. Using the reflow process, a master pattern of aspheric microlens array was made and finally with the ultraviolet-imprinting (UV-imprinting) method, the aspheric microlens array was replicated. The reflow condition was optimized to realize the master pattern of the microlens array with the designed aspheric shape. The intensity distribution of the optical probes at the focal plane showed a diffraction-limited shape.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.509-510
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• 2008

Hybrid Imprint Lithography (HIL) is proposed where photolithography and imprinting processes are employed. Fabrication step of multilevel or three dimensional patterns is suggested. The method of controlling residual layer thickness after imprinting is developed. The thickness of residual layer changes lineally with imprinting time and can be controlled. Polymer patterns fabricated by this HIL is demonstrated.