• 제목/요약/키워드: Impact ionization

검색결과 120건 처리시간 0.033초

생약 중 잔류 농약의 분석법: GC/MS에 의한 27종 잔류 규제 농약의 분석 (Analysis of Residual Pesticides in Herbal Drugs: GC/MS Analysis of 27 Controlled Pesticides)

  • 박만기;박정일;윤혜란;윤인병;조술연;황귀서
    • 약학회지
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    • 제40권2호
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    • pp.141-148
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    • 1996
  • GC/MS analysis of 27 controlled pesticides in herbal drugs was studied. Selected ion monitoring(sim) technique was applied to increase the GC/MS sensitivity. Typical peaks in th e mass spectrum of each pesticides were selected as quantitation, comfirmation or alternate ion. Twenty seven pesticides were divided into five groups according to their retention time and the peaks for SIM were programmed accordingly. The combination of two ionization methods, electron impact(EI)-SIM-MS and negative ion chemical ionization(NCI)-SIM-MS, were well-fitted for the detection, confirmation and quantitation of multiclass residual pesticides in herbal drugs.

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Research for Hot Carrier Degradation in N-Type Bulk FinFETs

  • Park, Jinsu;Showdhury, Sanchari;Yoon, Geonju;Kim, Jaemin;Kwon, Keewon;Bae, Sangwoo;Kim, Jinseok;Yi, Junsin
    • 한국전기전자재료학회논문지
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    • 제33권3호
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    • pp.169-172
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    • 2020
  • In this paper, the effect of hot carrier injection on an n-bulk fin field-effect transistor (FinFET) is analyzed. The hot carrier injection method is applied to determine the performance change after injection in two ways, channel hot electron (CHE) and drain avalanche hot carrier (DAHC), which have the greatest effect at room temperature. The optimum condition for CHE injection is VG=VD, and the optimal condition for DAHC injection can be indirectly confirmed by measuring the peak value of the substrate current. Deterioration by DAHC injection affects not only hot electrons formed by impact ionization, but also hot holes, which has a greater impact on reliability than CHE. Further, we test the amount of drain voltage that can be withstood, and extracted the lifetime of the device. Under CHE injection conditions, the drain voltage was able to maintain a lifetime of more than 10 years at a maximum of 1.25 V, while DAHC was able to achieve a lifetime exceeding 10 years at a 1.05-V drain voltage, which is 0.2 V lower than that of CHE injection conditions.

InAlAs/InGaAs/GaAs MHEMT 소자의 항복 특성에 관한 연구 (A Study on the Breakdown in MHEMTs with InAlAs/InGaAs Heterostructure Grown on the GaAs substrate)

  • 손명식
    • 대한전자공학회논문지SD
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    • 제48권11호
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    • pp.1-8
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    • 2011
  • 트랜지스터의 최대 출력 성능을 제한하는 요소 중 가장 중요한 하나가 항복 전압이다. GaAs 기판 위에 점진적으로 성장된 메타몰픽(Metamorphic) InAlAs/InGaAs HEMTs(MHEMT)는 InP 기판 위에 성정한 HEMT에 비해 비용 측면에서 특히 장점을 가지고 있다. 그러나 GaAs 나 InP 기반의 HEMT 소자들은 모두 우수한 마이크로파 및 밀리미터파 주파수 특성 및 이에 따른 저잡음 특성에 비해 낮은 항복전압으로 인해 파워 소자로서는 중간출력 정도의 소자로서만 사용 가능하다. 이러한 HEMT 소자의 항복 전압을 개선하기 위하여 본 논문에서는 InAlAs/$In_xGa_{1-x}As$/GaAs MHEMT 소자들의 항복 특성을 시뮬레이션하고 분석하였다. 2차원 소자 시뮬레이터의 hydrodynamic 전송 모델을 사용하여 $In_{0.52}Al_{0.48}As/In_{0.53}Ga_{0.47}As$ 이종접합 구조를 갖는 제작된 0.1-${\mu}m$ ${\Gamma}$-gate MHEMT 소자에 대하여 파라미터 보정 작업을 수행한 후 항복 특성에 영향을 주는 요소들을 분석하였다. 깊은 준위 트랩 효과를 고려한 충돌 이온화 및 게이트 전계를 분석하였고, 인듐(In) 몰 성분 변화에 따른 $In_xGa_{1-x}As$ 채널에서의 항복 특성 예측을 위한 충돌 이온화 계수를 경험적으로 제안 적용하였다.

Drain induced barrier lowering and impact ionization effects in short channel polysilicon TFTs

  • Fortunato, G.;Valletta, A.;Gaucci, P.;Mariucci, L.;Cuscuna, M.;Maiolo, L.;Pecora, A.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.907-910
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    • 2008
  • The effect of channel length reduction on the electrical characteristics of self-aligned polysilicon TFTs has been investigated by combining experimental characteristics and 2-D numerical simulations. The role of drain induced barrier lowering and floating body effects has been carefully analized using numerical simulations.

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게이트가 파인 구조를 이용한 SOI MOSFET에서의 항복전압 개선 (Breakdown Voltage Improvement in SOI MOSFET Using Gate-Recessed Structure)

  • 최진혁;박영준;민홍식
    • 전자공학회논문지A
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    • 제32A권12호
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    • pp.159-165
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    • 1995
  • A gate-recessed structure is introduced to SOI MOSFET's in order to increase the source-to-drain breakdown voltage. A significant increase in the breakdown voltage is observed compared with that of a planar single source/drain SOI MOSFET without inducing the appreciable reduction of the current drivability. We have analyzed the origin of the breakdown voltage improvement by the substrate current measurements and 2-D device simulations, and shown that the breakdown voltage improvement is caused by the reductions in the impact ionization rate and the parasitic bipolar current gain.

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Asymmetric 및 Symmetric MOSFET 소자의 Drain Breakdown 특성 분석

  • 최평호;김상섭;최병덕
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.232.2-232.2
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    • 2013
  • 본 연구에서는 asymmetric과 symmetric MOSFET 소자의 drain breakdown 및 snapback 특성을 분석하였다. 실험에서는 두 MOSFET 소자의 동작 영역에서 게이트와 드레인에 각각 전압을 인가하였다. 드레인 전류-전압 곡선으로 부터 drain breakdown 전압과 snapback 전압을 추출하였다. 결과 avalanche breakdown 발생 전의 드레인 전류는 asymmetric 구조의 경우 더 작은 값을 보였으며 이는 asymmetric 구조에서의 drain field 가 더 낮기 때문이다. 따라서 impact ionization은 asymmetric 구조에서 덜 발생하며, snapback 전압은 avalanche breakdown voltage가 작은 asymmetric 구조에서 크게 나타났다.

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고항복전압 MHEMT 전력소자 설계 (Simulation Design of MHEMT Power Devices with High Breakdown Voltages)

  • 손명식
    • 한국진공학회지
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    • 제22권6호
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    • pp.335-340
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    • 2013
  • 본 논문은 InP 식각정지층을 갖는 MHEMT 소자의 항복전압을 증가시키기 위한 시뮬레이션 설계 논문이다. MHEMT 소자의 게이트 리세스 구조 및 채널 구조를 변경하여 시뮬레이션을 수행하였고 비교 분석하였다. MHEMT 소자의 드레인 측만을 완전히 제거한 비대칭 게이트 리세스 구조인 경우 $I_{dss}$ 전류가 90 mA에서 60 mA로 줄어들지만 항복 전압은 2 V에서 4 V로 증가함을 확인하였다. 이는 $Si_3N_4$ 보호층과 InAlAs 장벽층 사이의 계면에서 형성되는 전자-포획 음의 고정전하로 인해 채널층에서의 전자 공핍이 심화되어 나타나는 현상으로 이는 채널층의 전류를 감소시켜 충돌이온화를 적게 형성시켜 항복전압을 증가시킨다. 또한, 동일한 구조의 비대칭 게이트 리세스 구조에서 채널층을 InGaAs/InP 복합 채널로 바꾸어 설계한 구조에서는 항복전압이 5 V로 증가하였다. 이는 높은 드레인 전압에서 InP 층의 적은 충돌이온화와 이동도로 인해 전류가 더 감소했기 때문이다.

PMOSFET에서 채널 방향에 대한 소자 성능 의존성 (Dependence of Device Performance and Reliability on Channel Direction in PMOSFET's)

  • 복정득;박예지;한인식;권혁민;박병석;박상욱;임민규;정의선;이정환;이희덕
    • 한국전기전자재료학회논문지
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    • 제23권6호
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    • pp.431-435
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    • 2010
  • In this paper, we investigated the dependence of device performance and hot carrier lifetime on the channel direction of PMOSFET. $I_{D.sat}$ vs. $I_{Off}$ characteristic of PMOSFET with <100> channel direction is greater than that with <110> channel direction because carrier mobility of <100> channel direction is greater than that of <110> channel direction. However, hot carrier lifetime for <110> channel direction is much lower than that with <110> channel due to the greater impact ionization rate in the <100> channel direction. Therefore, concurrent consideration of reliability characteristics and device performance is necessary for channel strain engineering of MOSFETs.

Investigation of Ne and He Buffer Gases Cooled Ar+ Ion Clouds in a Paul Ion Trap

  • Kiai, S.M. Sadat;Elahi, M.;Adlparvar, S.;Nemati, N.;Shafaei, S.R.;Karimi, Leila
    • Mass Spectrometry Letters
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    • 제6권4호
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    • pp.112-115
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    • 2015
  • In this article, we examine the influences of Ne and He buffer gases under confined Ar+ ion cloud in a homemade Paul ion trap in various pressures and confinement times. The trap is of small size (r0 = 1 cm) operating in a radio frequency (rf) voltage only mode, and has limited accuracy of 13 V. The electron impact and ionization process take place inside the trap and a Faraday cup has been used for the detection. Although the experimental results show that the Ar+ ion FWHM with Ne buffer gas is wider than the He buffer gas at the same pressure (1×10-1 mbar) and confinement time is about 1000 μs, nevertheless, a faster cooling was found with He buffer gas with 500 μs. ultimetly, the obtanied results performed an average cloud tempertures reduced from 1777 K to 448.3 K for Ne (1000 μs) and from 1787.9 K to 469.4 K for He (500 μs)

필드 플레이트가 설계된 다이아몬드 쇼트키 장벽 다이오드 (Diamond Schottky Barrier Diodes With Field Plate)

  • 장해녕;강동원;하민우
    • 전기학회논문지
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    • 제66권4호
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    • pp.659-665
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    • 2017
  • Power semiconductor devices required the low on-resistance and high breakdown voltage. Wide band-gap materials opened a new technology of the power devices which promised a thin drift layer at an identical breakdown voltage. The diamond had the wide band-gap of 5.5 eV which induced the low power loss, high breakdown capability, low intrinsic carrier generation, and high operation temperature. We investigated the p-type pseudo-vertical diamond Schottky barrier diodes using a numerical simulation. The impact ionization rate was material to calculating the breakdown voltage. We revised the impact ionization rate of the diamond for adjusting the parallel-plane breakdown field at 10 MV/cm. Effects of the field plate on the breakdown voltage was also analyzed. A conventional diamond Schottky barrier diode without field plate exhibited the high forward current of 0.52 A/mm and low on-resistance of $1.71{\Omega}-mm$ at the forward voltage of 2 V. The simulated breakdown field of the conventional device was 13.3 MV/cm. The breakdown voltage of the conventional device and proposed devices with the $SiO_2$ passivation layer, anode field plate (AFP), and cathode field plate (CFP) was 680, 810, 810, and 1020 V, respectively. The AFP cannot alleviate the concentration of the electric field at the cathode edge. The CFP increased the breakdown voltage with evidences of the electric field and potential. However, we should consider the dielectric breakdown because the ideal breakdown field of the diamond is higher than that of the $SiO_2$, which is widely used as the passivation layer. The real breakdown voltage of the device with CFP decreased from 1020 to 565 V due to the dielectric breakdown.