• Electronics and Telecommunications Trends
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• v.3 no.2
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• pp.116-133
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• 1988

ASIC (Application Specific Integrated Circuit)은 직역하면 응용특정 IC, 혹은 특정용도 IC로서 LSI시장의 조사회사인 Dataquest사가 '84년경부터 사용하기 시작한 말이다. ASIC이 최근 크게 주목을 끌고있는 것은, 반도체 사용자가 자신의 제품에 개성을 불어넣기 위해서는 범용IC를 사용해온 것으로는 기술적 우위성이 확보되지 않는다고 판단했기 때문에 주문형 LSI를 강하게 추진해 왔다는 것과 반도체 메이커도 메모리IC를 중심으로 한 범용IC시장의 부진, 더우기 날로 더해가는 반도체 시장의 시장쟁탈 및 무역마찰로 인해 ASIC 시장에로의 참여가 강화되어 왔다는 점 등을 들수있다. 집적화 기술은 매년 진보하여 지금은 100만개 이상의 트랜지스터를 집적할 수 있게 되었다. 따라서 지금까지 SSI/MSI를 사용해서 회로설계한 기능단위의 칩을 프린터 기판위에 조합시켜 시스팀을 구축해 왔으나, 앞으로는 하나의 칩위에 시스팀을 구성하는 시대로 변하고 있다. ASIC은 그 요청에 따라서 one-chip화의 개념에 따라서 만들어진 것으로서, 시장환경에 대단히 유익한 디바이스로 생각할 수 있다. 시스팀의 one-chip화의 실현결과 압도적으로 소형화, 경량화, 성자원화가 달성됨과 동시에 신뢰성 및 동작성능도 우수하게 되었다. ASIC기술은 현재 주류로 되어있는 게이트 어레이를 볼때, 개발비용은 크게 감소하여 개발기간도 논리회로가 완성된다면 3~4주 정도로 단축시킬수 있다. ASIC 설계에는 각 공정에 있어서 고도의 컴퓨터 지원설계가 채용되고 제조공정에서는 첨단의 프로세서 기술 등이 이용되므로 ASIC기술은 종합적인 첨단기술의 집약이라고 불러도 좋을것이다. 이러한 기술추세에 맞추어 전자통신 동향분석지 제3권 제1호(1988.3.)에 발표된 최신 ASIC기술동향의 후속편으로 ASIC에 관련된 중요용어 50개를 선정, 알파벳 순으로 나열하여 설명하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.12
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• pp.2199-2204
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• 2007

The objective of this study is to get an implication through the application of Technology Acceptance Model (TAM) focused on Mobile Banking Service based on IC Chip. Thus firstly, this study reviewed the related literatures and materials. After this, this parer analyzed this TAM model with covariance structural method to search the factors influencing technology acceptance of Mobile banking service. In conclusion, the proposed model showed that 'innovation factor' influenced 'perceived usefulness' and 'user's acquaintance' influenced 'perceived ease of use'. And this 'perceived usefulness' influenced 'perceived ease of use' and this 'perceived ease of use' influence 'attitude toward use'.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.4
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• pp.120-126
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• 1989

IC chip layout pattern recognition algorithms using image processing techniques are being developed for the automation of manufacturing and inspecting chips. Recognitioin of chip pattern requires feature extraction from nach rrame of chip image adn needs to match the feature data through all frames. In this paper, vertex position and form having layout information are extracted by the feature straightening algorithm, and global coordinates of layout pattern are extracted by the feature straightening algorithm, and global coordinates of layout pattern are obtainnd by vertex form matching from the overlapped area of neighbour frame.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.3-7
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• 2000

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

• Proceedings of the Korea Society of Information Technology Applications Conference
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• 2005.11a
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• pp.103-106
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• 2005

This paper reports design and fabrication of CMOS temperature sensor circuit using MOSIS 0.25um CMOS technology. The proposed circuit has a temperature coefficient of $13mV/^{\circ}C$ for a wide operating temperature range with a good linearity. This circuit may be applicable to the design of one-chip IC where quartz crystal resonator is directly mounted on CMOS oscillator chips.

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.3-3
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• 1995

Plastic IC encapsulation utilizing lead on chip(LOC) die attach technique allows higher device density per unit package area, and faster current speed and easter leadframe design. Nevertheless, since the top surface of the chip is directly attached to the area of the leadframe with a double-sided adhesive tape in the LOC package, it tends to be easily damaged by the leadframe, leading to limitation in its utilization. In this work, it is detailed how the damage of the chip surface occurs, and it is influenced and improved by the LOC construct.

• International Journal of Quality Innovation
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• v.8 no.3
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• pp.81-112
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• 2007

In the competitive global market, firms have to keep profit from innovation activities. A firm makes profits by offering products or services at a lower cost than its competitors or by offering differentiated products at premium prices that more than compensate for the extra cost of differentiation. The IC Package and Testing technology industries were the first high technological industry to build in Taiwan. The Package and Testing industries in Taiwan adopted competitive innovation activities to become stronger. In our study, we want to know how innovation activities influence a firm operating in the IC Package and Testing industries. Our study used a questionnaire and Likert five-point scale to survey the innovation activities, customer and feedback in innovation performance in the IC Package and Testing industry. The wafer level chip size packing technology in our study indicates the innovation activities. Because we need to compare the difference between the wafer level chip size packing technology and wire bonding technology to recognize innovation and how the innovator and customer were influenced. Our conclusions are described below: (1) When the innovator adopts innovation activities that can be maintained using experiments and knowledge, using machine and decision variables more quickly will produce success; (2) Innovators should adopt innovation activities that focus on customers that use knowledge and experimentation, training time and cost. If an innovation forces customers to spend much time and cost to learn new technology or applications, the innovation will not be adopted; (3) Innovators that create innovation performance higher than his customers must also consider the impact upon their customers. We have to remind innovator to focus on why their customers have a different level of evolution in the same innovation activities.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.5
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• pp.74-82
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• 2015

As the complexity of an electronic device and the reduction of its operating voltage is progressing, susceptibility test of the chip and module for internal or external noises is essential. Although the immunity compliance of the chip was served with IEC 62132-4 Direct Power Injection method as an industry standard, in fact, EM immunity of the chip is influenced by their Power Domain Network (PDN). This paper evaluates the EM noise tolerance of a PLL and compares their noise transfer characteristics to the PLL on various PCB boards. To make differences of the PDNs of PCBs, various PCBs with or without LDO and with several types of capacitors are tested. For evaluation of discrepancies between EM characteristics of an IC only and the IC on real boards, the analysis of the noise transfer characteristics according to the PDNs shows that it gives important information for the design having robust EM characteristics. DPI measurement results show that greatly improved immunity of the PLL in the low-frequency region according to using the LDO and a frequency change of the PLL according to the DPI could also check with TEM cell measurement spectrum.

• Journal of Korean Electronics
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• v.5 no.4
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• pp.27-37
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• 1985

• The Magazine of the IEIE
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• v.8 no.3
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• pp.43-47
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• 1981