• 한국정밀공학회지
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• 제11권5호
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• pp.161-170
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• 1994

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interfermetry(ESPI) method, in measuring two-dimensional in- plane displacement. The analysis result of measurement by ESPI is quite comparable to that of measurement by strain gauge method. This implieds that the method of ESPI is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversial point, measurement error. This error is discussed to be affected not by ESPI method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. Further development of advanced first-order interpolation method is being undertaken for the more precise in-plane strain measurement.

• 전자공학회논문지D
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• 제34D권8호
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• pp.41-51
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• 1997

The device simulator (BANDIS) which can analyze efficiently the electrical characteristics of the semiconductor devices under the three dimensional stationary conditions on the IBM PC was developed. Poisson, electon and hole continuity equations are discretized y te galerkin method using a tetrahedron as af finite element. The frontal solver which has exquisite data structures and advanced input/output functions is dused for the matrix solver which needs the highest cost in the three dimensional device simulation. The discretization method of the continuity equations used in BANDIS are compared with that of the scharfetter-gummel method used in the commercial three-dimensional device. To verify an accuracy and the efficiency of the discretization method, the simulation results of the PN junction diode and the BJT from BANDIS are compared with those of the commercial three-dimensiional device simulator such as DAVINCI. The maximum relative error within 2% and the average number of iterations needed for the convergence is decreased by more than 20%. The total simulation time of the BJT with 25542 nodes is decreased to about 60% compared with that of DAVINCI.

• 디지털산업정보학회논문지
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• 제5권1호
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• pp.99-105
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• 2009

Recently the research is much interested in about the inspection system using by computer vision system. In this paper, we deal with shape inspection technique for moving to be long and narrow object on conveyor belt. first, we are acquired for moving object on conveyor belt. then the object segmentation is using by color information for background and object. the object position be calculated by horizontal and a vertical histogram. second, we are checked for two hole in front part, widths and top/bottom side information in middle part, and finally checking for two holes in rear part. The performance of our proposed model is evaluated by experiments, within error of 1㎜, and can be checking to 17 object /min.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.2435-2439
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• 2005

In case of visual sensing systems with multiple mirrors, systematic errors need to be reduced by the system calibration and the mirror position adjustment in order to enhance system measurement accuracy. In this paper, a self calibration method is presented for a visual sensing system designed to measure the three-dimensional information in deformable peg-in-hole tasks. It is composed of a CCD camera and a series of mirrors including two pyramidal mirrors. By using an image of the inner pyramidal mirror taken by the system, the error parameters of the inner pyramidal mirror could be calibrated or adjusted. Also the influence of the plane mirrors is investigated.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1992년도 봄 학술발표회 논문집
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• pp.30-35
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• 1992

Since many design problems in the railroad, aerospace and machine structures involve considerations of the effect of cyclic loading, manufacturing and quality control processes must fully account for fatigue of critical components. Due to the sensitivity of the Paris law, it is very important to calculate the ΔK numerically to minimize the error of predicted fatigue life in cycles. It is shown that the p-version of FEM based on LEFM analysis is far better suited for computing the stress intensity factors than the conventional h-version. To demonstrate the proficiency of the proposed scheme, the welded T-joint with crack problem of box car body bolster assembly and a crack problem emanating Iron a circular hole in finite strip have been solved.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1581-1584
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• 2003

This paper proposed efficient manufacturing system using OMM(on-machine measurement) system and OMM operating S/W based 3D modeler. A Developed program connected tool machine with RS232C. It is composed two operating system that touch probe operating and laser displacement sensor operating system. A program for touch probe possible measure considered inspection feature and CAD data. The laser operating program is used inspection for profile. very small hole using installed feature data. This system is applied manufacturing line of mold(cavity, core) also verification of efficiency manufacturing process that production, reduction machining error of each process

• 대한전자공학회논문지SD
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• 제39권1호
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• pp.12-17
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• 2002

본 논문에서는 전자와 정공의 이온화 계수로부터 4H-SiC를 위한 유효 이온화 계수를 cㆍE/sup m/의 형태로 추출하였고, 이 유효 이온화 계수를 이용하여 4H-SiC p/sup +/n 접합에서의 항복시 임계 전계와 항복 전압을 위한 해석적 표현식을 유도하였다. 해석적 항복 전압 및 항복 전계 결과는 10/sup 15/㎝/sup -3/∼10/sup 18/㎝/sup -3/의 농도 범위에서 실험 결과와 비교하여 오차 범위 10% 이내로 잘 일치하였다.

• 한국정밀공학회지
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• 제20권8호
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• pp.76-85
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• 2003

In this paper, a technical method for removing the solder from PCBs has been proposed to simplify the pulverizing process and to get higher quality of materials for recycling of the electronic parts in the Printed Circuit Boards (PCBs). There are several techniques to remove the solder from PCB, such as physical and chemical method, vibration, suction and blowing and so on. Among them, the suction technique turned out the best method by investigation. In the suction method, there are three variables for removing the solder. They are a temperature of the thermal wire, a velocity of moving PCB and a gap between PCB and thermal wire. To find the optimal variables for the system, an experiment has been conducted by a trial and error method. The optimal variables were found $220^{\circ}C$ of temperature, 11.58mm/s of velocity, 10mm of gap (A gap between suction hole and bottom of PCBs is 5mm). The result of the experiment shows that 50% of the solder were removed.

• 전자공학회논문지A
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• 제32A권8호
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• pp.107-118
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• 1995

Three-dimensional simulator for thermal oxidation process is developed. The simulator is consisted by two individual module, one is analytic-model module and the other is numerical-model module. The analytic-model which uses simple complementary-error function guarantees fast calculation in prediction of multi-dimensional oxidation process. The numerical-model which is based on boundary element method (BEM), has a good accuracy and suitable for various process conditions. The results of this study show that oxide growth is retarded at the corner of hole structure and enhanced at the corner of island structure. These effects are reson of different distribution of oxidant diffusion and mask stress. The utility of models and simulator developed in this study is demonstrated by using it to predict not only traditional shape of LOCOS but also process effects in small geometry.

• 한국정보과학회:학술대회논문집
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• 한국정보과학회 1998년도 가을 학술발표논문집 Vol.25 No.2 (2)
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• pp.650-652
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• 1998

본 논문은 mesh 간략화를 위한 새로운 Gaussian 곡률 오차 추정 방법을 제안한다. Gaussian 곡률은 임의의 형상을 갖는 삼각화 된 단면체 표면에 대하여 위상과 기하학적 정보를 angle 과 face 의 관계로 정형화하여, vertex에 관한 곡률로 근사하여 표현한다. 간략화 방법은 지역적 형상으로부터 전체적인 형상을 추정한 후, 적절한 curvature criteria 로 간략화가 될 vertex를 선택하고 제거한다. 제거된 vertex에 의해 생성된 hole은 곡률에 기반하여 삼각화하고 곡률이 변화되는 vertex들의 Gaussian 곡률 오차를 계산한다. 각 간략화 level마다 최대 Gaussian 곡률 오차를 계산하므로, 사용자는 Gaussian 곡률 오차 추정으로 원하는 간략화 level을 지정할 수 있다. 또한 주어진 오차 안에서 vertex뿐만 아니라 edge나 face의 제거로, 간략화 되는 영역을 확산시켜 필요한 위상과 기하학적 정보를 유지하는 간략화를 할 수 있다.