• 전자공학회논문지SC
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• 제40권2호
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• pp.1-9
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• 2003

본 논문에서는 ASC(Area Scan Camera)를 이용한 비젼시스템과 belt type xy-table을 사용하여 metal mask의 홀 생성유무 검사시스템을 개발하고, 적용할 수 있는 알고리즘을 소개한다. Metal mask의 전체 영역을 일정한 크기의 검사영역으로 분할한다. 각각의 검사영역의 크기는 ASC의 FOV(Field of View)와 동일하다. 이때 belt type xy-table에서 발생하는 위치오차를 고려하여 일정영역을 중첩하여 분할한다. 검사블록에 대한 카메라이미지는 gerber 파일을 이용하여 생성한 기준이미지와 비교된다. 검사장치에 장착된 metal mask의 회전각도를 계산하기 위하여 존재하는 가장 큰 홀에 대한 카메라이미지를 획득하고, 홀의 수평 에지를 추출한 후 직선의 방정식을 이용한다. Belt type xy-table의 backslash와 같은 기계적 결함에 의해 기준 이미지와 카메라이미지에 존재하는 홀 사이에는 위치오차가 존재한다. 두 이미지를 일치시키기 위해 각 이미지에 존재하는 홀의 무게중심점을 이용한 HT(Hough-Transform)을 사용하여 위치오차정보를 추출하고, 기준이미지의 중심점을 이동시킨다. 각각의 이미지에 존재하는 홀에 대한 무게중심점, 면적, 가로길이, 세로길이 등의 정보를 레이블링을 통하여 구한다. 두 이미지에 존재하는 홀의 무게중심점과 면적을 이용하여 홀의 생성 유무를 판단한다. 그리고 실제로 시스템을 제작하여 위 알고리즘을 적용한다.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2003년도 가을 학술발표회 논문집
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• pp.403-409
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• 2003

The finite element method is one of the most widely used method of structural analysis that has wide applications in diverse fields of engineering and science. The method has been proven effective and reliable in many practical problems. One of the reasons for the methods' popularity is its ease of use, but still the user has to input the finite element mesh which affects the accuracy of the results. The knowledge required to form an effective mesh for a given problem is somewhat complex and for sometime there has been research effort to automate the generation of the mesh and this is called the adaptive mesh generation scheme. A good adaptive mesh scheme seemed to require an accurate assessment of error and generally this requires some additional computation. This paper looks into the possibility of generating adaptive meshes based on representative strain values in each finite element method. The proposed adaptive scheme does not require additional computations other that looking up the data values already computed as finite element analysis results and simple manipulations of these data. Two plane stress problems, a plate with a hole and a deep beam with a concentrated load at the end are considered to show the progress of the improved generation of adaptive meshes using the scheme.

• 한국정밀공학회지
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• 제11권5호
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• pp.161-170
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• 1994

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interfermetry(ESPI) method, in measuring two-dimensional in- plane displacement. The analysis result of measurement by ESPI is quite comparable to that of measurement by strain gauge method. This implieds that the method of ESPI is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversial point, measurement error. This error is discussed to be affected not by ESPI method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. Further development of advanced first-order interpolation method is being undertaken for the more precise in-plane strain measurement.

• 전자공학회논문지D
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• 제34D권8호
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• pp.41-51
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• 1997

The device simulator (BANDIS) which can analyze efficiently the electrical characteristics of the semiconductor devices under the three dimensional stationary conditions on the IBM PC was developed. Poisson, electon and hole continuity equations are discretized y te galerkin method using a tetrahedron as af finite element. The frontal solver which has exquisite data structures and advanced input/output functions is dused for the matrix solver which needs the highest cost in the three dimensional device simulation. The discretization method of the continuity equations used in BANDIS are compared with that of the scharfetter-gummel method used in the commercial three-dimensional device. To verify an accuracy and the efficiency of the discretization method, the simulation results of the PN junction diode and the BJT from BANDIS are compared with those of the commercial three-dimensiional device simulator such as DAVINCI. The maximum relative error within 2% and the average number of iterations needed for the convergence is decreased by more than 20%. The total simulation time of the BJT with 25542 nodes is decreased to about 60% compared with that of DAVINCI.

• 디지털산업정보학회논문지
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• 제5권1호
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• pp.99-105
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• 2009

Recently the research is much interested in about the inspection system using by computer vision system. In this paper, we deal with shape inspection technique for moving to be long and narrow object on conveyor belt. first, we are acquired for moving object on conveyor belt. then the object segmentation is using by color information for background and object. the object position be calculated by horizontal and a vertical histogram. second, we are checked for two hole in front part, widths and top/bottom side information in middle part, and finally checking for two holes in rear part. The performance of our proposed model is evaluated by experiments, within error of 1㎜, and can be checking to 17 object /min.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.2435-2439
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• 2005

In case of visual sensing systems with multiple mirrors, systematic errors need to be reduced by the system calibration and the mirror position adjustment in order to enhance system measurement accuracy. In this paper, a self calibration method is presented for a visual sensing system designed to measure the three-dimensional information in deformable peg-in-hole tasks. It is composed of a CCD camera and a series of mirrors including two pyramidal mirrors. By using an image of the inner pyramidal mirror taken by the system, the error parameters of the inner pyramidal mirror could be calibrated or adjusted. Also the influence of the plane mirrors is investigated.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1992년도 봄 학술발표회 논문집
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• pp.30-35
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• 1992

Since many design problems in the railroad, aerospace and machine structures involve considerations of the effect of cyclic loading, manufacturing and quality control processes must fully account for fatigue of critical components. Due to the sensitivity of the Paris law, it is very important to calculate the ΔK numerically to minimize the error of predicted fatigue life in cycles. It is shown that the p-version of FEM based on LEFM analysis is far better suited for computing the stress intensity factors than the conventional h-version. To demonstrate the proficiency of the proposed scheme, the welded T-joint with crack problem of box car body bolster assembly and a crack problem emanating Iron a circular hole in finite strip have been solved.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1581-1584
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• 2003

This paper proposed efficient manufacturing system using OMM(on-machine measurement) system and OMM operating S/W based 3D modeler. A Developed program connected tool machine with RS232C. It is composed two operating system that touch probe operating and laser displacement sensor operating system. A program for touch probe possible measure considered inspection feature and CAD data. The laser operating program is used inspection for profile. very small hole using installed feature data. This system is applied manufacturing line of mold(cavity, core) also verification of efficiency manufacturing process that production, reduction machining error of each process

• 대한전자공학회논문지SD
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• 제39권1호
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• pp.12-17
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• 2002

본 논문에서는 전자와 정공의 이온화 계수로부터 4H-SiC를 위한 유효 이온화 계수를 cㆍE/sup m/의 형태로 추출하였고, 이 유효 이온화 계수를 이용하여 4H-SiC p/sup +/n 접합에서의 항복시 임계 전계와 항복 전압을 위한 해석적 표현식을 유도하였다. 해석적 항복 전압 및 항복 전계 결과는 10/sup 15/㎝/sup -3/∼10/sup 18/㎝/sup -3/의 농도 범위에서 실험 결과와 비교하여 오차 범위 10% 이내로 잘 일치하였다.

• 한국정밀공학회지
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• 제20권8호
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• pp.76-85
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• 2003

In this paper, a technical method for removing the solder from PCBs has been proposed to simplify the pulverizing process and to get higher quality of materials for recycling of the electronic parts in the Printed Circuit Boards (PCBs). There are several techniques to remove the solder from PCB, such as physical and chemical method, vibration, suction and blowing and so on. Among them, the suction technique turned out the best method by investigation. In the suction method, there are three variables for removing the solder. They are a temperature of the thermal wire, a velocity of moving PCB and a gap between PCB and thermal wire. To find the optimal variables for the system, an experiment has been conducted by a trial and error method. The optimal variables were found $220^{\circ}C$ of temperature, 11.58mm/s of velocity, 10mm of gap (A gap between suction hole and bottom of PCBs is 5mm). The result of the experiment shows that 50% of the solder were removed.