• 제목/요약/키워드: High stacking system

검색결과 85건 처리시간 0.026초

하이브리드 탄소섬유 적층구조에 따른 복합재료의 기계적 특성 연구 (Study on the Mechanical Properties of Hybridized Carbon Fiber Composite According to Stacking Structure)

  • 구선웅;오우진;원종성;이하람;윤주영;이승구
    • 한국염색가공학회지
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    • 제30권4호
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    • pp.313-320
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    • 2018
  • As carbon fiber reinforced composites(CFRP) are widely used in aerospace, automobile, marine, and sports goods applications, they have been studied extensively by various researchers. However, CFRP have been pointed out because of machining problems such as delamination and burr phenomenons. Especially, hole machining process, drilling, has non-smooth features on inlet and outlet surfaces of drilled hole. This kind of machining problem can be controlled to some extent by using high modulus pitch-CF, which has considerable effects on fracture behavior of composite compared with only PAN CF composite. Therefore, PAN and pitch hybridized CF composites were prepared having high strength and modulus. The results demonstrate that the hybrid CFRP specimens with pitch CF offer the good potential to enhance modulus as well as strength properties. Dynamic mechanical, flexural, and impact properties were measured and analyzed. Morphological surface of the composites were also observed by IFS-28, canon after hole machining.

3 차원 형상의 미소제품 제작을 위한 마이크로 광 조형시스템의 개발 (Development of micro-stereolithography system for the fabrication of three-dimensional micro-structures)

  • 이인환;조윤형;조동우;이응숙
    • 한국정밀공학회지
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    • 제21권2호
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    • pp.186-194
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    • 2004
  • Micro-stereolithography is a newly proposed technology as a means that can fabricate a 3D micro-structure of free form. It makes a 3D micro-structure by dividing the shape into many slices of relevant thickness along horizontal surfaces, hardening each layer of slice with a focused laser beam, and stacking them up to a desired shape. In this technology, differently from the conventional stereolithography, scale effect is dominant. To realize micro-stereolithography technology, we developed the micro-stereolithography apparatus which is composed of an Ar+ laser, x-y-z stages. controllers. optical devices and scan path generation software. Related processes were developed, too. Using the system, a number of micro-structures were successfully fabricated. Some of these samples are shown for prove this system. Laser scan path generation algorithm and software considering photopolymer solidification phenomena as well as given 3D model were developed. Sample fabrication of developed software shows relatively high dimensional accuracy compared to the uncompensated result.

머신러닝 기반 기업부도위험 예측모델 검증 및 정책적 제언: 스태킹 앙상블 모델을 통한 개선을 중심으로 (Machine learning-based corporate default risk prediction model verification and policy recommendation: Focusing on improvement through stacking ensemble model)

  • 엄하늘;김재성;최상옥
    • 지능정보연구
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    • 제26권2호
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    • pp.105-129
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    • 2020
  • 본 연구는 부도위험 예측을 위해 K-IFRS가 본격적으로 적용된 2012년부터 2018년까지의 기업데이터를 이용한다. 부도위험의 학습을 위해, 기존의 대부분 선행연구들이 부도발생 여부를 기준으로 사용했던 것과 다르게, 본 연구에서는 머튼 모형을 토대로 각 기업의 시가총액과 주가 변동성을 이용하여 부도위험을 산정했으며, 이를 통해 기존 방법론의 한계로 지적되어오던 부도사건 희소성에 따른 데이터 불균형 문제와 정상기업 내에서 존재하는 부도위험 차이 반영 문제를 해소할 수 있도록 하였다. 또한, 시장의 평가가 반영된 시가총액 및 주가 변동성을 기반으로 부도위험을 도출하되, 부도위험과 매칭될 입력데이터로는 비상장 기업에서 활용될 수 있는 기업 정보만을 활용하여 학습을 수행함으로써, 포스트 팬데믹 시대에서 주가 정보가 존재하지 않는 비상장 기업에게도 시장의 판단을 모사하여 부도위험을 적절하게 도출할 수 있도록 하였다. 기업의 부도위험 정보가 시장에서 매우 광범위하게 활용되고 있고, 부도위험 차이에 대한 민감도가 높다는 점에서 부도위험 산출 시 안정적이고 신뢰성 높은 평가방법론이 요구된다. 최근 머신러닝을 활용하여 기업의 부도위험을 예측하는 연구가 활발하게 이루어지고 있으나, 대부분 단일 모델을 기반으로 예측을 수행한다는 점에서 필연적인 모델 편향 문제가 존재하고, 이는 실무에서 활용하기 어려운 요인으로 작용하고 있다. 이에, 본 연구에서는 다양한 머신러닝 모델을 서브모델로 하는 스태킹 앙상블 기법을 활용하여 개별 모델이 갖는 편향을 경감시킬 수 있도록 하였다. 이를 통해 부도위험과 다양한 기업정보들 간의 복잡한 비선형적 관계들을 포착할 수 있으며, 산출에 소요되는 시간이 적다는 머신러닝 기반 부도위험 예측모델의 장점을 극대화할 수 있다. 본 연구가 기존 머신러닝 기반 모델의 한계를 극복 및 개선함으로써 실무에서의 활용도를 높일 수 있는 자료로 활용되기를 바라며, 머신러닝 기반 부도위험 예측 모형의 도입 기준 정립 및 정책적 활용에도 기여할 수 있기를 희망한다.

적층각이 다른 CFRP/Al 혼성 원형부재의 충돌안전성능 평가 (Evaluation to Collision Safety Performance of Stacking Angle Different CFRP/Al Circular Member)

  • 양용준;김영남;차천석;정종안;양인영
    • 한국안전학회지
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    • 제30권6호
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    • pp.1-6
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    • 2015
  • The actual condition is that environmental pollution due to the development of various industries has recently become a serious issue. An interest in improving the gas mileage is rising due to an increase in the number of vehicles in the era of high oil price in particular. In order to solve this problem, priority should be given to light-weight design of car body, However, at present, a design method enabling the conventional steel plate to be replaced is direly needed in order to guarantee passengers' safety according to excessive light-weight design of car body. In this study, in order to apply a design method that could realize fuel savings and environmental pollution prevention through an improvement in gas mileage together with meeting the safety requirements for vehicles, it was supposed that CFRP/Al composites member would be used as primary structural member. And to this end, it was intended to obtain optimum design data by experimentally implementing external impulsive load applied to the car body. According to results of impact test of CFRP/Al composites member, a collapsed shape of folding, crack, and bending occurred. So, it was possible to find that energy was observed. And in case of specimen having an angle of $90^{\circ}$ in the outermost layer and stack sequence of $[90^{\circ}{_2}/0^{\circ}2]s$, its collapsed length was shown to be short. Therefore, it was possible to find that the absorbed energy was shown to be higher by 20% or above at the maximum.

Development of High-Quality LTCC Solenoid Inductor using Solder ball and Air Cavity for 3-D SiP

  • Bae, Hyun-Cheol;Choi, Kwang-Seong;Eom, Yong-Sung;Kim, Sung-Chan;Lee, Jong-Hyun;Moon, Jong-Tae
    • 마이크로전자및패키징학회지
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    • 제16권4호
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    • pp.5-8
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    • 2009
  • In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

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Nano-Scale Cu Direct Bonding Technology Using Ultra-High Density, Fine Size Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integrated System

  • Lee, Kang-Wook
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.69-77
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    • 2016
  • We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

Through Silicon Stack (TSS) Assembly for Wide IO Memory to Logic Devices Integration and Its Signal Integrity Challenges

  • Shin, Jaemin;Kim, Dong Wook
    • 한국전자파학회지:전자파기술
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    • 제24권2호
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    • pp.51-57
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    • 2013
  • The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

초음파 이미지를 이용한 CFRP 복합적층판의 적층결함 평가 (On Evaluation of Stacking Fault in CERP Composite Plates of Using Ultrasonic Images)

  • 임광희;나승우;심재기;양인영
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2003년도 춘계학술발표대회 논문집
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    • pp.121-124
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    • 2003
  • This paper shows shear wave behavior of CFRP(carton fiber reinforced plastics) composite laminates as a polar grid form to evaluate vibration pattern of ultrasonic transducers, which gives measured modelling fundamental contents of nondestructive evaluation. This modelling decomposes the transmission of a linearly polarized wave into orthogonal components through each ply of a laminate. It is found that a high probability shows between the model and measurement system in characterizing lay up of CFRP composite laminates. Also evaluating quantitatively the defects in CFRP laminates who found to be possible of normalized frequency obtained from 2D-FFT technique based on C-scan method. Thus, the technique is proven to be one of the useful means to evaluate any internal defect in CFRP composite laminates.

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Bi-2223/Ag HTS 장선재의 Ic 특성 향상 공정 연구 (Study on fabrication process of long length of Bi-2223/Ag MTS wires for high critical current)

  • 하동우;양주생;황선역;이동훈;최정규;하홍수;오상수;권영길
    • 한국초전도저온공학회:학술대회논문집
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    • 한국초전도저온공학회 2003년도 학술대회 논문집
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    • pp.105-108
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    • 2003
  • Long length of Bi-2223 superconducting wires were fabricated by stacking, drawing process with different precursor owders and different heat-treatment histories. The precursor powders were 2 kinds of Pb content. And a part of the tapes were experienced pre-annealing process which caused tetragonal structure of Bi-2212 phase to orthorhombic structure of it was during drawing process. We confirmed the transformation of Bi-2212 phase from tetragonal structure to orthorhombic structure and reduction of second phases. We designed and made a continuous Ic measurement system for Bi-2223/Ag HTS tape. We could achieve best Ic of 65 A at the Bi-2223/Ag tape using low Pb content of precursor powder and experienced pre-annealing process.

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박판형 고효율 터보홴의 공력학적 설계 (Aerodynamic Design of Slim and High-efficient Turbo-Fan)

  • 이명재;김남욱;박덕준;조인수;이승배
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2600-2605
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    • 2008
  • Turbo-fans for a FFU unit should be aerodynamically designed to provide the FFU system with the given flow-rate at the lowest rotational-speed by considering the interaction effect with the FFU casing. In this study, slim and highly efficient turbo-fans are designed to satisfy the given performance at the specific speed by using the hybrid-stacking method of an inducer and a 2D-bladed turbo fan. The mean-line analysis, cascade theory, and CFD technique are all together applied to control the passage areas on the meridional plane from the inlet to the exit of the blade. Furthermore, the torque control algorithm is adopted to improve the performances within the constraints by the motor rpm-torque characteristics, and the resulting measured performances of mock-up fans are discussed.

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