• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.25-29
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• 2008

Reliability and performance in metal gate/high-k device with multiple gate dielectrics were investigated. MOSFETs with a thin $HfSiO_x$ layer on a thermal Si02 dielectric as gate dielectrics exhibit excellent mobility and low interface trap density. However, the distribution of threshold voltages of $HfSiO_x/SiO_2$ stack devices were wider than those of $SiO_2$ and $HfSiO_x$ single layer devices due to the penetration of Hf and/or intermixing of $HfSiO_x$ with underlying $SiO_2$. The results of TZDB and SILC characteristics suggested that a certain portion of $HfSiO_x$ layer reacted with the underlying thick $SiO_2$ layer, which in turn affected the reliability characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.821-825
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• 2013

Effect of multi-stacked layer (MSL), 0.1 mol (M) and 0.3 mol (M) hafnium oxide ($HfO_2$) alignment layers were fabricated via a solution-process for LCs orientation. The solutions were spin-coated and annealed in a furnace. MSL consists of three sub-layers using 0.1 M solution, mono-layer (ML) is composed of 0.3 M $HfO_2$ solution. Then ion-beam irradiation was treated with 1.8 keV for 2 min. $HfO_2$-based LC cells were investigated through photographs, pre-tilt angle using crystal rotation method, X-ray photoelectron spectroscopy (XPS) measurement, and surface roughness using atomic force microscopy(AFM) for their characteristic research. Good LC orientation characteristics were observed on MSL $HfO_2$ surface. The LC alignment mechanism on MSL $HfO_2$ and ML $HfO_2$ surfaces was attributed to van der Waals (VDW) interaction between the LC molecular and substrate surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.8-9
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• 2006

Hafnium oxide ($HfO_2$) thin films were deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$. Prior to the deposition of $HfO_2$ films, a thin Hf ($10\;{\AA}$) metal layer was deposited. Deposition temperature of $HfO_2$ thin film was $350^{\circ}C$ and its thickness was $150\;{\AA}$. Samples were then annealed using furnace heating to temperature ranges from 500 to $900^{\circ}C$. The MOS capacitor of round-type was fabricated on Si substrates. Thermally evaporated $3000\;{\AA}$-thick AI was used as top electrode. In this work, We study the interface characterization of $HfO_2$/Hf/Si MOS capacitor depending on annealing temperature. Through AES(Auger Electron Spectroscopy), capacitance-voltage (C-V) and current-voltage (I-V) analysis, the role of Hf layer for the better $HfO_2$/Si interface property was investigated. We found that Hf meta1 layer in our structure effective1y suppressed the generation of interfacial $SiO_2$ layer between $HfO_2$ film and silicon substrate.

• Journal of Technologic Dentistry
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• v.31 no.2
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• pp.23-30
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• 2009

All-ceramic restorations have gained acceptance among clinicians and patients because of their superior esthetics. Most all-ceramic systems have a 2-layer structure, using a weak veneering ceramic over a strong supporting core. often, failure of all-ceramic restorations occurs when the veneering ceramic fractures, exposing the core material. The purpose of this study was to compare the shear bond strength of heat press ceramic system (Zirpress) to zirconia core with various surface treatments. 10 metal cores and 50 zirconia cores were fabricated and divided into six groups according to surface treatment such as Zirliner application, aluminium oxide blasting, and 9.5% HF etching. Sixty specimens were prepared using Zirpress, veneered 8mm height and 3mm in diameter, over the zirconia cores (n=10). The shear bond strength test was performed in a universal testing machine with a crosshead speed of 1/min. Ultimate shear bond strength data were analyzed with One-way ANOVA and the Scheffe's test (p=.05). Within the limits of this study, the following conclusions were drawn: The mean shear bond strengths (MPa) were: 12.93 for $110{\mu}m$ aluminium oxide blasting/Rexillium III/IPS e.Max Zirpress; 14.92 for $50{\mu}m$ aluminium oxide blasting ${\pm}9.5%$ HF etching/Zirconis core/IPS e.Max Zirpress; 16.37 for $110{\mu}$ aluminium oxide blasting + 9.5% HF etching/Zirconis core/IPS e.Max Zirpress; 12.89 for $200{\mu}$ aluminium oxide blasting + 9.5% HF etching/Zirconis core/IPS e.Max Zirpress; 19.30 for 9.5% HF etching/Zirconis core/IPS e.Max Zirpress; 19.55 for Zirliner/Zirconis core/IPS e.Max Zirpress. The mean shear bond strength for ZNTZH (Zirliner/Zirconis core) and ZNTEH (9.5% HF etching/Zirconis core) were significantly superior to MS110H ($110{\mu}$ aluminium oxide blasting/Rexillium III) and ZS200EH ($200{\mu}$ aluminium oxide blasting + 9.5% HF etching/Zirconis core) (p<0.05).

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1149-1150
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• 2015

In this study, hafnium was doped into aluminum zinc oxide (AZO) films were deposited on glass and Si substrates at room temperature via co-sputtering by varying the electric power applied to the Hf target. The properties of deposited Hf-doped AZO films, such as crystalline structure, optical transmittance, and band gap were analyzed using various methods such as X-ray diffraction (XRD) and UV/visible spectrophotometer. The experimental results confirmed that the abovementioned properties of Hf-AZO films strongly depended on the Hf sputtering power.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.161-162
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• 1994

No Abstract, See Full Text

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.208-214
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• 1995

In order to study on the penetrations of HF solution acording to the geometrical shrinkage of contact-hole pattern size, the wet etch characteristics for oxide in microchannel patterns was investigated. Microchannel patterns of LPCVD oxide surrounded by nitride film, with dimensions of 0.1~1$\mu\textrm{m}$ height and 0.1~20$\mu\textrm{m}$, width, were fabricated. And the etch rates of oxide in HF solution were observed. It was found that oxide etch rate for micro-channel patterns in HF was not affected by pattern sizes and initial aspect ratios up to $0.1 \times 0.1 \mu \textrm{m}^{2} size and 1.2$\mu\textrm{m}$ depth. Finally, it was concluded that there were no special limitations for penetrations of HF solution in wet processes according to the geometrical shrinkage of contact-hole pattern size.

• Proceedings of the Korea Crystallographic Association Conference
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• 2002.11a
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• pp.42-43
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• 2002

반도체 디바이스의 발전은 높은 직접화 및 동작 속도를 추구하고 있으며, 이를 위해서 MOSFET의 scale down시 발생되는 문제를 해결해야만 한다. 특히, Channel이 짧아짐으로써 발생하는 device의 열화현상으로 동작전압의 조절이 어려워 짐을 해결해야만 하며, gate oxide 두께를 줄임으로써 억제할 수 있다고 알려져 왔다. 현재, gate oxide으로 사용되고 있는 SiO2박막은 비정질로써 ～8.7 eV의 높은 band gap과 Si기판 위에서 성장이 용이하며 안정하다는 장점이 있으나, 두께가 1.6 nm 이하로 얇아질 경우 전자의 direct Tunneling에 의한 leakage current 증가와 gate impurity인 Boron의 channel로의 확산, 그리고 poly Si gate의 depletion effect[1,2] 등의 문제점으로 더 이상 사용할 수 없게 된다. 2001년 ITRS에 의하면 ASIC제품의 경우 2004년부터 0.9～l.4 nm 이하의 EOT가 요구된다고 발표하였다. 따라서, gate oxide의 물리적인 두께를 증가시켜 전자의 Tunneling을 억제하는 동시에 유전막에 걸리는 capacitance를 크게 할 수 있다는 측면에서 high-k 재료를 적용하기 위한 연구가 진행되고 있다[3]. High-k 재료로 가능성 있는 절연체들로는 A1₂O₃, Y₂O₃, CeO₂, Ta₂O, TiO₂, HfO₂, ZrO₂,STO 그리고 BST등이 있으며, 이들 재료 중 gate oxide에 적용하기 위해 크게 두 가지 측면에서 고려해야 하는데, 첫째, Si과 열역학적으로 안정하여 후속 열처리 공정에서 계면층 형성을 배제하여야 하며 둘째, 일반적으로 high-k 재료들은 유전상수에 반비례하는 band gap을 갖는 것으로 알려줘 있는데 이 Barrier Height에 지수적으로 의존하는 leakage current때문에 절연체의 band gap이 낮아서는 안 된다는 점이다. 최근 20이상의 유전상수와 ～5 eV 이상의 Band Gap을 가지며 Si기판과 열역학적으로 안정한 ZrO₂[4], HfiO₂[5]가 관심을 끌고 있다. HfO₂은 ～30의 고유전상수, ～5.7 eV의 높은 band gap, 실리콘 기판과의 열역학적 안전성 그리고 poly-Si와 호환성등의 장점으로 최근 많이 연구가 진행되고 있다. 또한, Hf은 SiO₂를 환원시켜 HfO₂가 될 수 있으며, 다른 silicide와 다르게 Hf silicide는 쉽게 산화될 수 있는 점이 보고되고 있다.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2675-2678
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• 2012

Studies on niobium anodization in the mixture of 1 M $H_3PO_4$ and 1 wt % HF at galvanostatic anodization are described here in detail. Interestingly, duplex niobium oxide consisting of thick barrier oxide and correspondingly thick porous oxide was prepared at a constant current density of higher than 0.3 $mAcm^{-2}$, whereas simple porous type oxide was formed at a current density of lower than 0.3 $mAcm^{-2}$. In addition, simple barrier or porous type oxide was obtained by galvanostatic anodization at a single electrolyte of either 1 M $H_3PO_4$ or 1 wt % HF, respectively. The formation mechanism of duplex type structures was ascribed to different forming voltages required for moving anions.