• Title/Summary/Keyword: Heating film

검색결과 507건 처리시간 0.033초

Reduction of Vacuum Sublimation by Ion Beam Treatment for e-beam Deposited SiC Films

  • Kim, Jaeun;Hong, Sungdeok;Kim, Yongwan;Park, Jaewon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.138.1-138.1
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    • 2013
  • We present the low temperature (${\leq}1,000^{\circ}C$) vacuum sublimation behavior of an e-beam evaporative deposited on a SiC film and a method to reduce the vacuum sublimation through an ion beam process. The density of the SiC film deposited using the e-beam evaporation method was ~60% of the density of the bulk source material. We found that the sublimation became appreciable above ${\sim}750^{\circ}C$ under $1.5{\times}10^{-5}$ torr pressure and the sublimation rate increased with an increase in temperature, reaching ~70 nm/h at $950^{\circ}C$ when the coated sample was heated for 5 h. When the film was irradiated with 70 keV N+ ions prior to heating, the sublimation rate decreased to ~23 nm/h at a fluence of $1{\times}10^{17}\;ions/cm^2$. However, a further increase in fluence beyond this value or an extended heating period did not change (decrease or increase) the sublimation rate any further.

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Polysilicon Thin Film Transistors on spin-coated Polyimide layer for flexible electronics

  • Pecora, A.;Maiolo, L.;Cuscuna, M.;Simeone, D.;Minotti, A.;Mariucci, L.;Fortunato, G.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.261-264
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    • 2007
  • We developed a non self-aligned poly-silicon TFTs fabrication process at two different temperatures on spin-coated polyimide layer above Si-wafer. After TFTs fabrication, the polyimide layer was mechanically released from the Si-wafer and the devices characteristics were compared. In addition self-heating and hot-carrier induced instabilities were analysed.

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열가소성 폴리머 필름의 트라이볼로지 특성에 대한 온도의 영향 (Effects of Temperature on the Tribological Characteristics of Thermoplastic Polymer Film)

  • 김광설;허정철;김경웅
    • Tribology and Lubricants
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    • 제25권4호
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    • pp.207-216
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    • 2009
  • Friction tests were carried out in order to investigate the effects of temperature on the friction and wear behaviors between a PMMA film and a fused silica lens using a microtribometer. The friction forces on the PMMA film were measured under atmospheric condition as the temperature of the film was increased from 300 K to 443 K. The contact area between the film and the lens was observed. The tribological characteristics of the film were significantly changed as the temperature increased. The changes were discussed with the change of the film state from glassy to viscous flow. In addition, the results showed that the friction behavior can be varied with the thermal history of the PMMA film. Residual solvent in the PMMA film could emerge to the PMMA surface due to an additional heating and the solvent on the film surface decreased the friction force.

TFT LCD 제조용 대면적 Magnetron Sputtering 장치 설계와 Al 성장막 특성 조사 (Design of a Large Magnetron Sputtering System for TFT LCD and Investigation of Sputtered AI Film Properties)

  • 유운종
    • 한국진공학회지
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    • 제2권4호
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    • pp.480-485
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    • 1993
  • Factros considered building the magnetron sputtering system for TFT LCD (thin film transistor liquid crystal display0 metallization were thin film thichnes uniformity, temperature uniformity and the pressure gradient of sputtering gas flow in vacuum chamber, base pressure, and the stability fo the carrier moving . The system was consisted of a deposition chamber, a pre-heating chamber, a RF-precleaning chamber and a load/unload lock chamber. The system was designed to handle a substrate with dimension of 400$\times$400mm. The temperautre uniformity of a heater table developed showed $250 ^{\circ}C\pm$5% accuracyon the substrate glass. A base pressure of 1.8 $\times$10-7 torr was obtained after 24 hours pumping with a cryo pump. After an aluminum target was installed in a sputtering source and the film wa sdeposited on the glass, the uniformity, reflectivity and sheet resistance of the deposited film were measured.

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건물에너지 절감을 위한 열차단 필름의 성능 평가 (Thermal Performance Evaluation of The Window Film Insulation for Building Energy Savings)

  • 남중우;원종서
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2008년도 추계학술발표대회 논문집
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    • pp.75-80
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    • 2008
  • Recently, Energy savings in buildings has received much attention in response to the increased needs for global warming and better comforts of the occupants in apartment housing. This study proposes the method which uses the sun control window film to reduce the cooling load and heating load improving the thermal performance of the building and it improves an energy efficiency. The film which used in actual measurement has a low shading coefficient and a solar energy transmission. so we measured the surface temperature of the triple Low-e glazing system used and inside temperature according to the change of outside temperature and solar energy to study thermal performance evaluation. As a result, it was helpful to use window film insulation to reduce inside temperature in summer and to keep room warm in winter.

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$pbTiO_3$ 졸-겔 박막의 화학분석 (Chemcial Analysis of Sol-Gel Derived $pbTiO_3$ Thin Film)

  • 김승현;김창은;심인보;오영제
    • 한국세라믹학회지
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    • 제33권6호
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    • pp.623-630
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    • 1996
  • A Sol-gel derived ferroelectric PbTiO3 thin film was synthesized by using diethanolamine (DEA) as a comple-xing agent. Surface chemical analyses were examined in order to study the effect of heating temperature on the composition of thin film by EPMA and XPS. A rapid volatilization of lead was observed in the films fired at $700^{\circ}C$ or higher and the ratio of Pb:Ti was found to be 34:66. A depth profile by Ar+ showed that the Ar sputtering decreased Pb amount of inner part of the film resulting in Ti-rich phase near the surface of the film.

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Evaporation of Water in an Aqueous Lithium Bromide Solution flowing over a Horizontal Tube

  • Kim, Dong-Kwan;Kim, Moo-Hwan
    • International Journal of Air-Conditioning and Refrigeration
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    • 제9권3호
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    • pp.57-62
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    • 2001
  • Falling film heat transfer analyses with aqueous lithium bromide solution were performed to investigate the transfer characteristics of the copper tubes. Finned (knurled) tube and a smooth tube were selected as test specimens. Averaged generation fluxes of water and the heat flux were obtained. As the film flow rate of the solution increased, the generation fluxes of water decreased for both tubes due to the fact that the heat transfer resistance increased with the film thickness. The effect of the enlarged surface area at the knurled tube was supposed to be dominant at a small flow rate. The generation fluxes of water increased with the increasing degree of tube wall superheat. Nucleate boiling is supposed to occur at a wall superheat of 20K for a smooth tube, and at 10K for a knurled tube. The increased performance of the knurled tube was supposed to mainly come from the effect of the increased heating surface area.

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일정온도로 가열되는 원통 형상 슬러지 박막의 건조에 대한 3차원 해석 (Three-Dimensional Analysis on Drying Process of a Cylindrical Thin Film Layer of Sludge under Uniform Heating)

  • 이공훈;김욱중
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2009년도 하계학술발표대회 논문집
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    • pp.1326-1331
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    • 2009
  • Drying process in the cylindrical thin film layer of sludge with the thickness less than a few millimeters has been investigated. Thin film drying is specially designed and used to dry the viscous materials like sewage sludge. The thin film layer of sludge is dried on the metallic cylindrical surface through which thermal energy is supplied to the layer during drying. The wall temperature is assumed to be constant during drying in the present study for the simplification. In order to solve the equations, the mass transfer rate on the drying surface should be determined. The mass flux of evaporated water vapor on the surface is estimated with the formulation given in the literature. The effect of some physical parameters on drying has been examined to figure out the drying characteristics of the sludge layer.

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열진공성형에서 발생하는 필름의 두께 분포와 패턴 변형에 관한 연구 (A study on the thickness distribution and pattern deformation of films in vacuum-assisted thermoforming)

  • 성겸손;이호상
    • Design & Manufacturing
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    • 제12권2호
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    • pp.5-10
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    • 2018
  • Vacuum-assisted thermoforming is one of the critical steps for successful application of film insert molding(FIM) to parts of complex shape. In this study, the simulations and experiments of thermoforming processes were performed to investigate the effects of process conditions on thickness distribution and printed pattern deformation of films in vacuum-assisted thermoforming. The film thickness uniformity increased with decreasing film heating time, whereas it increased with increasing vacuum delay time. After thermoforming of films with uniform pattern space of 5mm, the maximum space was 9.432mm. Based on the simulation, a modified pattern was calculated to obtain uniform spaces after thermoforming. In the experiments for film with the modified pattern, the maximum space appeared 5.837mm. In, addition. the predicted patterns were in good agreement with the experimental results.