• 대한금속재료학회지
• /
• 제48권4호
• /
• pp.277-288
• /
• 2010

The hot corrosion properties of heat-resistant steels were investigated in an oxidation atmosphere including artificial ash and sulfur dioxide. The heat-resistant steels of T22, T92, T122, T347HFG, Super304H and HR3C were evaluated at 620, 670 and $720^{\circ}C$ for 400 hours. The relationship between the corrosion rate and the temperature followed a bell-shaped curve with a peak rate at around $670^{\circ}C$. The corrosion rates showed a decreasing tendency as the chrome contents of these steels increased from 2.15 wt.% to 24.5 wt.%, and austenitic steels had a lower corrosion rate than ferritic steels. Sulfidation by $SO_2$ as well as molten salt corrosion also had an effect on the total corrosion rate, especially showing an increase in the corrosion rate in ferritic steels. Regardless of the chrome content in the steels and irrespective of the test temperature, the corrosion scale was composed of an outer oxide and an artificial ash mixed layer, a middle oxide layer and inner sulfide, and a mixed oxide layer. As the chrome content increased, the proportion of chrome oxide in the corrosion scale increased. Before spalling of the corrosion scale, voids and cracks were initiated in the sulfide and the mixed oxide layer or at the interface with the substrate.

• 한국안전학회지
• /
• 제13권2호
• /
• pp.22-29
• /
• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• 설비공학논문집
• /
• 제30권1호
• /
• pp.1-9
• /
• 2018

Thermal performance of a heat sink for an inverter power stack was analyzed in terms of array and installation location of an Insulated Gate Bipolar Transistor (IGBT). Thermal flow around the heat sink was calculated with a numerical model that could simulate forced convection. Thermal performance was calculated depending on the array and location of high- and low-power IGBTs considering the maximum temperature of IGBT. The optimum array and installation location were found and causes were analyzed based on results of numerical analysis. For the numerical analysis, experiment design considered the installation location of IGBT, ratio of heat generation rates of high- and low-power IGBTs, and velocity of the inlet air as design variables. Based on numerical results, a correlation that could calculate thermal performance of the heat sink was suggested and the maximum temperature of the IGBT could be predicted depending on the installation method.

• 대한기계학회논문집A
• /
• 제27권3호
• /
• pp.393-400
• /
• 2003

Excessive generation of BOG during the LNG transportation not only causes the severe financial loss but also leads to the unexpected disaster. Therefore, the carrier cargo insulating interior LNG should be carefully designed based upon an accurate heat transfer analysis. However. it is not simple to analyze heat transfer of LNG cargo, because it is in a complex insulation structure and LNG carrier experiences a complicated heat transfer according to various kinds of voyage conditions. In this paper, we carried out the transient finite element heat transfer analysis for a cargo of Mark-111 membrane-type LNG carrier during laden voyage, and we compared heat transfer rates between considering natural convection and considering conduction. For this goal, we developed a PCL program incorporating with a commercial MSC/NASTRAN FEM code.

• 대한기계학회논문집B
• /
• 제31권4호
• /
• pp.367-375
• /
• 2007

The purpose of this study is to investigate the cooling performance of Heat Pipe Heat Exchanger(HPHE) for an electronic telecommunication system by adequate convection condition. Heat generation rates of electronic components, the temperature distributions of HPHE and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system, a program is developed. The program is useful to a user who is not familiar with an electronic telecommunication system. The simulation results showed that the HPHE were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $17.4^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared.

• 에너지공학
• /
• 제7권2호
• /
• pp.223-230
• /
• 1998

서울특별시 소재 대형 상업건물중 50개 에너지 다소비업체를 선정하여 에너지 사용실태를 조사하였다. 조사대상 건물은 병원, 호텔, 백화점/사무실 등 3개 집단으로 분류하여 시설현황, 에너지사용량, 부하분포특성 등을 분석하였다. 여름철 냉방전력 사용량이 열부하 피크 발생에 직접적인 영향을 미치는 것으로 나타났으며 이를 열병합발전-흡수식 냉동기 방식으로 대체할 경우 전기부하 분포가 연간 비교적 일정하게 변환시킬 수 있어 열부하추종운전방식에 적합함을 알 수 있었다. 그러나, 단일건물의 경우 연간열부하분포가 경제적 규모에 미달하여 단독으로 열병합발전 설비를 도입하기에는 미흡한 점이 있어 다수건물을 대상으로 하는 공동 열병합발전 방식이 보다 유리한 것으로 판단된다. 이를 추진하기에는 전기사업법, 액화천연가스 요금체계 등과 같은 법제도의 정비가 선결되어야 할 것이다.

• 대한기계학회논문집B
• /
• 제38권3호
• /
• pp.227-234
• /
• 2014

전기 자동차의 연료 소모량은 배터리 성능에 의존한다. 배터리의 성능은 작동온도에 민감하기 때문에, 배터리 온도 관리는 성능과 내구성을 보장한다. 특히, 배터리 팩에서의 모듈의 온도 분포는 냉각특성에 영향을 미친다. 이 연구는 모듈 사이의 온도 분포를 확인 할 수 있는 배터리 열적 모델링에 초점을 두었다. 본 연구의 배터리 모델은 NiMH 각형 모델이며, 10개의 모듈로 구성되어졌다. 배터리 열 모델은 열 발생, 채널을 통과하는 대류 열 전달 그리고 모듈 사이의 전도 열 전달로 구성되었다. 배터리 내에서 발생되는 열발생 모델은 충/방전 동안의 전기적인 저항열에 의해 계산되어 진다. 모델은 전 하이브리드 자동차의 운전 동안 적절한 열관리의 전략을 결정한다.

• 대한기계학회논문집B
• /
• 제37권10호
• /
• pp.933-940
• /
• 2013

본 실험에서는 실제 태양광 발전용 인버터의 냉각에 사용할 2개의 압출형과 2개의 압입형 히트싱크의 방열 성능을 평가하였다. 두 압입형 히트싱크의 핀의 개수는 62개와 98개, 전열면적은 $2.8m^2$, $5.3m^2$이고, 두 압출형 히트싱크의 핀의 개수는 38개와 47개, 전열면적은 $1.8m^2$, $1.9m^2$이다. 압입형 히트싱크의 방열율은 각각 82.7 %, 86.3 %, 압출형 히트싱크의 방열율은 각각 79.6 %, 81.6 %로 측정되었다. 각 히트싱크의 방열성능 평가결과에서 히트싱크의 전열면적이 증가할수록 방열율이 증가하는 경향을 보였다. 압입형인 S-62 히트싱크는 압출형인 E-47 히트싱크 보다 전열면적이 47.4 % 증가하였음에도 불구하고 방열량은 1.3% 증가하는데 그쳤다. 이는 압출형의 우수한 전열성능 때문인 것으로 판단된다. 또한 압입형인 S-98 히트싱크는 동일한 압입형인 S-62 히트싱크에 비해 전열면적이 89.3 % 증대되었음에도 방열량 증가는 4.4 %에 불과하여 전열면적에 대한 최적화가 필요함을 알 수 있었다.

• 대한설비공학회:학술대회논문집
• /
• 대한설비공학회 2008년도 하계학술발표대회 논문집
• /
• pp.1149-1154
• /
• 2008

The present study investigates the heat transfer characteristics on concave surface with array impinging jet and fin arrangement. The heat transfer coefficients was measured by TLC method. The Reynolds number based on jet hole diameter is 10,000 and hole diameter-to-plate distance ratio (H/d) is fixed at 2. The rectangular fins are installed in the curved channel and the width of fin varies from 1d to 3d. Without fins, the averaged heat transfer coefficients decreases as moves downstream region. While, the rectangular fins block the crossflow and higher heat transfer rates were observed compared to smooth channel.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2008년도 추계학술대회B
• /
• pp.2043-2052
• /
• 2008

The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at $95^{\circ}C$.