Proceedings of the KSME Conference (대한기계학회:학술대회논문집)

The Korean Society of Mechanical Engineers (대한기계학회)
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Thermal Performance of Cooling System for a Laptop Computer Using a Boiling Enhancement Microstructure

비등 촉진 마이크로 구조물을 이용한 휴대용 컴퓨터 냉각시스템의 열성능에 관한 연구

  • 조남해 (금오공과대학교 기계공학부) ;
  • 정원용 (금오공과대학교 기계공학과 대학원) ;
  • 박상희 (금오공과대학교 기계공학부)
  • Published : 2008.11.05
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Abstract

The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at $95^{\circ}C$.

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