• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.163-166
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• 2002

We investigated structural and electrical properties of Metal-Oxide-Semiconductor(MOS) structure using Hafnium $oxide(HfO_{2})$ as high-k gate dielectric material. $HfO_{2}$ films are ultrathin gate dielectric material witch have a thickness less than 2.0nm， so it is spotlighted to be substituted $SiO_{2}$ as gate dielectric material. In this paper We have grown $HfO_{2}$ films with pt electrode on P-type Silicon substrate by RF magnetron sputtering system using $HfO_{2}$ target and oserved the property of semiconductor-oxide interface. Using pt electrode, it is necessary to be annealed at ${300^{\circ}C}$. This process is to increase an adhesion ratio between $HfO_{2}$ films with pt electrode. In film deposition process, the deposition time of $HfO_{2}$ films is an important parameter. Structura1 properties are invetigated by AES depth profile, and electrical properties by Capacitance-Voltage characteristic. Interface trap density are measured to observe the interface between $HfO_{2}$ with Si using High-frequency(1MHz) C-V and Quasi - static C-V characteristic.

• Journal of the Korean Chemical Society
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• 제33권2호
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• pp.168-176
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• 1989

Theoretical analysis of HF chemical laser models are performed through chemical reaction kinetics, gain process and stimulated emission process. A chemical laser of F+$H_2$ nonchain reaction is investigated through V-R transitions of excited HF for vibrational levels up to v = 3 and rate equations including nonchain pumping and deactivation. On this analysis, harmonic and anharmonic vibrational levels are considered separately and the results of the corresponding power calculations are showed very small difference between the two. Output powers are calculated with variation of temperature and initial concentrations of $H_2$. A HF chemical laser of $H_2$+$F_2$ chain reaction is also simulated with a premixed initial condition. Results of present model calculations are satisfactory through comparison with detailed calculations reported by others.

• Korean Journal of Materials Research
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• 제27권1호
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• pp.48-52
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• 2017

In this study, we used I-V spectroscopy, photoconductivity (PC) yield and internal photoemission (IPE) yield using IPE spectroscopy to characterize the Schottky barrier heights (SBH) at insulator-semiconductor interfaces of Pt/$HfO_2$/p-type Si metal-insulator-semiconductor (MIS) capacitors. The leakage current characteristics of the MIS capacitor were analyzed according to the J-V and C-V curves. The leakage current behavior of the capacitors, which depends on the applied electric field, can be described using the Poole-Frenkel (P-F) emission, trap assisted tunneling (TAT), and direct tunneling (DT) models. The leakage current transport mechanism is controlled by the trap level energy depth of $HfO_2$. In order to further study the SBH and the electronic tunneling mechanism, the internal photoemission (IPE) yield was measured and analyzed. We obtained the SBH values of the Pt/$HfO_2$/p-type Si for use in Fowler plots in the square and cubic root IPE yield spectra curves. At the Pt/$HfO_2$/p-type Si interface, the SBH difference, which depends on the electrical potential, is related to (1) the work function (WF) difference and between the Pt and p-type Si and (2) the sub-gap defect state features (density and energy) in the given dielectric.

• Proceedings of the Korea Crystallographic Association Conference
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• 한국결정학회 2002년도 정기총회 및 추계학술연구발표회
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• pp.45-47
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• 2002

반도체 소자의 고집적화 및 고속화가 요구됨에 따라 MOSFET 구조의 게이트 절연막으로 사용되고 있는 SiO₂ 박막의 두께를 감소시키려는 노력이 이루어지고 있다. 0.1㎛ 이하의 소자를 위해서는 15Å 이하의 두께를 갖는 SiO₂가 요구된다. 하지만 두께감소는 절연체의 두께와 지수적인 관계가 있는 누설전류를 증가시킨다[1-3]. 따라서 같은 게이트 개패시턴스를 유지하면서 누설전류를 감소시키기 위해서는 높은 유전상수를 갖는 두꺼운 박막이 요구되는 것이다. 그러므로 약 25정도의 높은 유전상수를 갖고 5.2～7.8 eV 정도의 비교적 높은 bandgap을 갖으며, 실리콘과 열역학적으로 안정한 물질로 알려진 HfO2[4-5]가 최근 큰 관심을 끌고 있다. 본 연구에서는 HfO₂ 박막을 실제 소자에 적용하기 위하여 전극 및 열처리에 따른 HfO₂ 박막의 미세구조 및 전기적 특성에 관한 연구를 수행하였다. 이를 위해, HfO₂ 박막을 reactive DC magnetron sputtering 방법으로 증착하고, XRD, TEM, XPS를 사용하여 ZrO₂ 박막의 미세구조를 관찰하였으며, MOS 캐패시터 구조의 C-V 및 I-V 특성을 측정하여 HfO₂ 박막의 전기적 특성을 관찰하였다. HfO₂ 타겟을 스퍼터링하면 Ar 스퍼터링에 의해 에너지를 가진 산소가 기판에 스퍼터링되어 Si 기판과 반응하기 때문에 HfO₂ 박막 형성과 더불어 Si 기판이 산화된다[6]. 그래서 HfO₂같은 금속 산화물 타겟 대신에 순수 금속인 Hf 타겟을 사용하고 반응성 기체로 O₂를 유입시켜 타겟이나 시편위에서 high-k 산화물을 만들면 SiO/sub X/ 계면층을 제어할 수 있다. 이때 저유전율을 갖는 계면층은 증착과 열처리 과정에서 형성되고 특히 500℃ 이상에서 high-k/Si를 열처리하면 계면 SiO₂층은 증가하는 데, 이것은 산소가 HfO₂의 high-k 박막층을 뚫고 확산하여 Si 기판을 급속히 산화시키기 때문이다. 본 방법은 증착에 앞서 Si 표면을 희석된 HF를 이용해 자연 산화막과 오염원을 제거한 후 Hf 금속층과 HfO₂ 박막을 직류 스퍼터링으로 증착하였다. 우선 Hf 긍속층이 Ar 가스 만의 분위기에서 증착되고 난 후 공기중에 노출되지 않고 연속으로 Ar/O₂ 가스 혼합 분위기에서 반응 스퍼터링 방법으로 HfO₂를 형성하였다. 일반적으로 Si 기판의 표면 위에 자연적으로 생기는 비정질 자연 산화막의 두께는 10～15Å이다. 그러나 Hf을 증착한 후 단면 TEM으로 HfO₂/Si 계면을 관찰하면 자연 산화막이 Hf 환원으로 제거되기 때문에 비정질 SiO₂ 층은 관찰되지 않았다. 본 실험에서는 HfO2의 두께를 고정하고 Hf층의 두께를 변수로 한 게이트 stack의 물리적 특성을 살펴보았다. 선증착되는 Hf 금속층을 0, 10, 25Å의 두께 (TEM 기준으로 한 실제 물리적 두께) 로 증착시키고 미세구조를 관찰하였다. Fig. 1(a)에서 볼 수 있듯이 Hf 금속층의 두께가 0Å일때 13Å의 HfO₂를 반응성 스퍼터링 방법으로 증착하면 HfO₂와 Si 기판 사이에는 25Å의 계면층이 생기며, 이것은 Ar/O₂의 혼합 분위기에서의 스퍼터링으로 인한 Si-rich 산화막 또는 SiO₂ 박막일 것이다. Hf 금속층의 두께를 증가시키면 계면층의 성장은 억제되는데 25Å의 Hf 금속을 증착시키면 HfO₂ 계면층은 10Å미만으로 관찰된다. 그러므로 Hf 금속층이 충분히 얇으면 플라즈마내 산소 라디칼, 이온, 그리고 분자가 HfO₂ 층을 뚫고 Si 기판으로 확산되어 SiO₂의 계면층을 성장시키고 Hf 금속층이 두꺼우면 SiO/sub X/ 계면층을 환원시키면서 Si 기판으로의 산소의 확산은 막기 때문에 계면층의 성장은 억제된다. 따라서 HfO₂/Hf(Variable)/Si 계에서 HfO₂ 박막이 Si 기판위에 직접 증착되면, 순수 HfO₂ 박막의 두께보다 높은 CET값을 보이고 Hf 금속층의 두께를 증가시키면 CET는 급격하게 감소한다. 그러므로 HfO₂/Hf 박막의 유효 유전율은 단순 반응성 스퍼터링에 의해 형성된 HfO₂ 박막의 유전율보다 크다. Fig. 2에서 볼 수 있듯이 Hf 금속층이 너무 얇으면 계면층의 두께가 두꺼워 지고 Hf 금속층이 두꺼우면 HfO₂층의 물리적 두께가 두꺼워지므로 CET나 EOT 곡선은 U자 형태를 그린다. Fig. 3에서 Hf 10초 (THf=25Å) 에서 정전 용량이 최대가 되고 CET가 20Å 이상일 때는 high-k 두께를 제어해야 하지만 20Å 미만의 두께를 유지하려면 계면층의 두께를 제어해야 한다.

• Structural Engineering and Mechanics
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• 제61권6호
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• pp.701-709
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• 2017

Seismic dissipation devices can play a crucial role in mitigating earthquake damages, loss of life and post-event repair and downtime costs. This research investigates the use of ring springs with high-force-to-volume (HF2V) dissipaters to create damage-free, recentring connections and structures. HF2V devices are passive rate-dependent extrusion-based devices with high energy absorption characteristics. Ring springs are passive energy dissipation devices with high self-centring capability to reduce the residual displacements. Dynamic behaviour of a system with nonlinear structural stiffness and supplemental hybrid damping via HF2V devices and ring spring dampers is used to investigate the design space and potential. HF2V devices are modelled with design forces equal to 5% and 10% of seismic weight and ring springs are modelled with loading stiffness values of 20% and 40% of initial structural stiffness and respective unloading stiffness of 7% and 14% of structural stiffness (equivalent to 35% of their loading stiffness). Using a suite of 20 design level earthquake ground motions, nonlinear response spectra for 8 different configurations are generated. Results show up to 50% reduction in peak displacements and greater than 80% reduction in residual displacements of augmented structure compared to the baseline structure. These gains come at a cost of a significant rise in the base shear values up to 200% mainly as a result of the force contributed by the supplemental devices.

• Korean Journal of Materials Research
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• 제18권12호
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• pp.673-677
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• 2008

Calcia (CaO) stabilized cubic-$HfO_2$ is studied by density functional theory (DFT) with generalized gradient approximation (GGA). When a Ca atom is substituted for a Hf atom, an oxygen vacancy is produced to satisfy the charge neutrality. The lattice parameter of a $2{\times}2{\times}2$ cubic $HfO_2$ supercell then increases by $0.02\;{\AA}$. The oxygen atoms closest to the oxygen vacancy are attracted to the vacancy as the vacancy is positive compared to the oxygen ion. When the oxygen vacancy is located at the site closest to the Ca atom, the total energy of $HfO_2$ reaches its minimum. The energy barriers for the migration of the oxygen vacancy were calculated. The energy barriers between the first and the second nearest sites, the second and the third nearest sites, and the third and fourth nearest sites are 0.2, 0.5, and 0.24 eV, respectively. The oxygen vacancies at the third and fourth nearest sites relative to the Ca atom represent the oxygen vacancies in undoped $HfO_2$. Therefore, the energy barrier for oxygen migration in the $HfO_2$ gate dielectric is 0.24 eV, which can explain the origin of gate dielectric leakage.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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• pp.86-88
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• 2003

Gate 산화막을 high-k 물질인 $HfO_2$ 박막을 이용하여 N-type MOS field effect transistor를 제작하였다. 전극은 poly-Si 전극을 사용하였다. Gate 산화막은 ALD 로 $Hf(N(CH_3)_2)_4$ 원료를 이용하여 $HfO_2$ 박막을 형성하였다. 산화제는 $H_{2}O$ 와 $O_3$ 를 사용하였는데, $H_{2}O$ 가 약간 우수하였으나 그 차이는 크지 않았다. $HfO_2$ 를 증착하기 전에 in-situ 로 $O_3$ 를 흘려 줌으로써 $SiO_2$를 얇게 형성하였는데, 이 결과 threshold voltage 가 약 0.2V 높아지고 saturation current 가 커지는 것이 관찰되었다. 이러한 결과는 $HfO_2$ 박막을 직접 channel 위에 증착하는 것보다 $O_3$ 를 이용 얇은 $SiO_2$ 를 형성하고 그 위에 $HfO_2$ 박막을 증착하는 방법이 transistor의 특성을 향상시키는 데 도움이 된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.147-148
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• 2006

Ge nanocrystals(NCs)-embedded MOS capacitors are charactenzed in this work using capacitance-voltage measurement. High-k dielectrics $HfO_2$ are employed for the gate material m the MOS capacitors, and the C-V curves obtained from $O_2-$ and $NH_3$-annealed $HfO_2$ films are analyzed.

• Journal of Technologic Dentistry
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• 제27권1호
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• pp.19-25
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• 2005

Ti6Al4V alloy have been mainly used as implant materials. Ti-6Al-4V alloy instead of pure Ti is being widely used as biomaterials has some characteristics such as high fatigue strength, tensile strength. But it has been reported recently that vanadium component expresses cytotoxicity and carcinogenicity and aluminium component is related with dementia of Alzheimer type. In order to overcome their detrimental effects, $\beta$-phase stabilizer Nb was chosen in the present study, in addition Ta and Hf were added to Ti-40wt.%Nb alloy to improve its mechanical properties. This paper was described the influence of heat treatment of Ti-40Nb alloys with 2wt%Ta, 2wt%Hf on the mechanical properties. Specimens of Ti alloys were melted in vacuum arc furnace and homogenized at 1050$^{\circ}C$ for 24 hr. and then were aged after solution heat treat at $\alpha+\beta$ and $\beta$ regions. The mechanical properties of Ti alloys were analysed by hardness test, tensile test, elongation test and SEM test. The results can be summarized as follows: 1. The mechanical properties Ti-40wt.%Nb were improved when 2wt.% Ta and 2wt.%Hf were added. 2. The higher tensile strength value and elongation at solution heat treat was higher than solution heat treat and then were aged.

• Structural Engineering and Mechanics
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• 제37권4호
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• pp.385-399
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• 2011

The aim of this research is to model the behaviour of recently developed high force to volume (HF2V) passive energy dissipation devices using a simple finite element (FE) model. Thus, the end result will be suitable for use in a standard FE code to enable computationally fast and efficient analysis and design. Two models are developed. First, a detailed axial model that models an experimental setup is created to validate the approach versus experimental results. Second, a computationally and geometrically simpler equivalent rotational hinge element model is presented. Both models are created in ABAQUS, a standard nonlinear FE code. The elastic, plastic and damping properties of the elements used to model the HF2V devices are based on results from a series of quasi-static force-displacement loops and velocity based tests of these HF2V devices. Comparison of the FE model results with the experimental results from a half scale steel beam-column sub-assembly are within 10% error. The rotational model matches the output of the more complex and computationally expensive axial element model. The simpler model will allow computationally efficient non-linear analysis of large structures with many degrees of freedom, while the more complex and physically accurate axial model will allow detailed analysis of joint connection architecture. Their high correlation to experimental results helps better guarantee the fidelity of the results of such investigations.