• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.2
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• pp.250-256
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• 2014

In this study, we deposited and investigated ${\mu}c$-Si:H thin films prepared by Plasma Enhanced Chemical Vapor Deposition(PECVD) system. To deposition silicon thin films, we controlled $SiH_4$ gas concentration, RF input power, and heater temperature. According to the experiments, the more $SiH_4$ gas concentration increased, deposition rate also increased but crystalline property decreased at the same conditions. In the RF input power case, deposition rate and crystalline property increased together when the input power increased from 100[W] to 300[W]. If RF input power was 300[W], deposition rate has reached saturation point. In the heater temperature, deposition rate increased when heater temperature increased. Crystalline property maintained a certain level until heater temperature was $250[^{\circ}C]$. And then it was a suddenly increased. Multistep method has been proposed to improve the quality of ${\mu}c$-Si:H thin film. $SiH_4$ gas was injected with a time interval. According to the experiments, crystallite ratio improve about 20~60[%] and photo conductivity increased up to six times.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.109.1-109
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• 1998

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.10
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• pp.1694-1696
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• 2016

Present thin film solar cells with hydrogenated amorphous silicon oxide (a-SiO:H) as an absorber suffer from low fill factor(FF) of 61~64 [%] in spite of its benefits related to high open circuit voltage ($V_{oc}$). Since degraded quality of a-SiO:H absorber by alloying with oxygen can affect the FF, we aimed to achieve high photosensitivity by minimizing $CO_2$ gas addition. Improving optical gap($E_{opt}$) has been attained by strong hydrogen dilution combined with lowering substrate temperature down to 100 [$^{\circ}C$]. Small amount of the $CO_2$ was added in order to disturb microcrystalline formation by high hydrogen dilution. The developed a-SiO:H has high photosensitivity (${\sim}2{\times}10^5$) and high $E_{opt}$ of 1.85 [eV], which contributed to attain remarkable FF of 74 [%] and high $V_{oc}$ (>1 [V]). As a result, high power conversion efficiency of 7.18 [%] was demonstrated by using very thin absorber layer of only 100 [nm], even though we processed all experiment at extremely low temperature of 100 [$^{\circ}C$].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.05a
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• pp.43-46
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• 1995

We fabricate a bottom gate a-Si:H TFT on N-Type <100> Si wafer. According to the variation of gate and drain voltage, the hysteresis characteristic curves were measured experimentally. Also, we showed that the model predict the hysteresis characteristic successfully. Drain current on the hysteresis characteristic currie showed an exponential variation. Hysteresis area of TFT increased with the drain voltage increase and decreases with the drain voltage decrease.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.08a
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• pp.221-221
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• 2009

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.7
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• pp.1135-1143
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• 1994

We fabricate a bottom gate a-Si:H TFT on N-Type <100> Si wafer. According to the Variation of gate and drain voltage, the hysteresis characteristic curves were measured experimentally. Also, we proposed model equation and showed that the model predict the hysteresis characteristic successfully. Drain current on the hysteresis characteristic curve showed an exponential variation. Hysteresis area of TFT increased with the drain voltage increase and decreases with the drain voltage decrease.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.35-37
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• 2005

100, 200nm 크기의 colloidal silica 각각에 나노 ceria 입자를 수열합성법으로 코팅하였다. Colloidal silica 입자에 ceria를 코팅 시 slurry의 pH조절과 수열처리에 이용하여 silica에 ceria가 코팅됨을 TEM과 zeta-potential을 이용하여 확인하였다. 연마 슬러리의 분산 안정성과 연마효율을 높이기 위하여 슬러리의 pH 는 9로 하였으며, 이때의 zeta-potential 값은 -25 mV이었다. 1 wt%로 제조된 연마슬러리를 이용하여, 4 inch $SiO_2$, $Si_3N_4$ wafer를 압력변화에 따른 연마특성을 관찰 하였다. Ceria coated colloidal silica 100 nm, 200 nm와 commercial한 $CeO_2$입자를 연마압력 6 psi로 oxide film을 연마한 결과 연마율이 각각 2490 ${\AA}/min$, 4200 ${\AA}/min$, 4300 ${\AA}/min$으로 측정되었다. 또한 $SiO_2$, $Si_3N_4$ film의 6 psi압력에서 ceria coated colloidal silica 100 nm, 200 nm와 commercial 한 $CeO_2$입자의 선택비는 3, 3.8, 6.7 이었다. 입자크기가 클수록 연마율이 높으며, Preston equation을 따라 연마 압력과 연마율이 비례하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.169-174
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• 2022

This study is to verify the feasibility of SiC single crystal growth using recycled SiC powder. The fundamental physical properties such as particle size, shape, composition and impurities of the recycled powder were analyzed, and the sublimation behavior occurring inside the reactor were predicted using the basic data. As a result of comprehensive judgment, the physical properties of the recycled powder were suitable for single crystal growth, and single crystal growth experiments were conducted using this. 100 mm 4H-SiC single crystal ingot with a height of 25 mm was grown without polytype inclusion. In the case of micro-pipe density was 0.02 ea/cm² and resistivity characteristics was 0.015~0.020 ohm·cm², commercial level quality was obtained, but additional analysis related to dislocation density and stacking faults is required for device application.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.61-61
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• 1999

저항이 5$\Omega$-cm인 n-type Si(100) 웨이퍼를 실리콘 식각시 마스크로 사용하기 위하여 습식 열산화법을 이용하여 100$0^{\circ}C$에서 SiO2을 2400$\AA$ 성장시킨 후, OPCVD 공정을 통해 785$^{\circ}C$서 SiH2Cl2 가스 30sccm과 NH3가스 100sccm을 이용하여 Si3N4를 3000$\AA$ 증착시켰다. 이 웨이퍼를 포토-리쏘그라피 공정을 거쳐 지름 2$\mu\textrm{m}$의 포토레지스트 패턴을 제작한 후 600W의 RF power하에서 CF4 가스 10sccm, CHF3 가스 15sccm, O2가스 8sccm 및 Ar가스 10sccm을 이용하여 MERIE 방법으로 Si3N4를 식각한 다음, 7:1 BHF 용액내에서 30초간의 습식식각을 통해 40wt.%의 KOH 용액내에 8$0^{\circ}C$에서 30초간의 이방성 식각을 통해 피라미드 모양의 Si FEA(field emitter array)를 제작하였다. 본 실험은 다음과 같이 완성된 Si FEA를 샤프닝 산화 후 산화막 식각을 통해 마스크를 제거한 다음, tip의 열화학적 내구성을 증가시키고 장시간 구동시 안정성과 전계방출 전류밀도를 높이기 위해 tip의 표면에 Ti를 sputter 방법으로 약 300$\AA$ 증착시킨 후, RTA 장비를 이용하여 2단계 열처리 (first annealing:$600^{\circ}C$/30sec, second annealing : 85$0^{\circ}C$/15sec)를 통해 Si FEA의 경우보다 낮은 turn-on 전압과 높은 전계방출 특성을 나타낼 것으로 기대된다.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.372-377
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• 2013

Machinable SiC ceramics are prepared with the addition of $Al_2TiO_5$. Ready-to-press SiC and $Al_2TiO_5$ powders are mixed and pressureless sintered at $1750^{\circ}C$ and $1850^{\circ}C$ for 1 h. The weight ratios of the SiC and $Al_2TiO_5$ powders are 100 : 0, 100 : 10, and 100 : 20. After sintering, only SiC peaks are detected in the X-ray diffraction analyses. The density, strength, and grain size of the SiC increase with increases in the $Al_2TiO_5$ content and sintering temperature. The $Al_2TiO_5$-doped specimens are easy to micro-hole machine. Based on the density and strength data, the ceramics sintered at $1850^{\circ}C$ can be used as machinable ceramics.