• Title/Summary/Keyword: GaInP/GaAs HBT

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Broadband power amplifier design utilizing RF transformer (RF 트랜스포머를 사용한 광대역 전력증폭기 설계)

  • Kim, Ukhyun;Woo, Jewook;Jeon, Jooyoung
    • Journal of IKEEE
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    • v.26 no.3
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    • pp.456-461
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    • 2022
  • In this paper, a two-stage single-ended power amplifier (PA) with broadband gain characteristics was presented by utilizing a radio frequency (RF) transformer (TF), which is essential for a differential amplifier. The bandwidth of a PA can be improved by designing TF to have broadband characteristics and then applying it to the inter-stage matching network (IMN) of a PA. For broadband gain characteristics while maintaining the performance and area of the existing PA, an IMN was implemented on an monolithic microwave integrated circuit (MMIC) and a multi-layer printed circuit board (PCB), and the simulation results were compared. As a result of simulating the PA module designed using InGaP/GaAs HBT model, it has been confirmed that the PA employing the proposed design method has an improved fractional bandwidth of 19.8% at a center frequency of 3.3GHz, while the conventional PA showed that of 11.2%.

Formation of ITO Ohmic Contact to ITO/n+lnP for III-V Optoelectronic Devices (III-V 광소자 제작을 위한 ITO/n+lnP 옴 접촉 특성연구)

  • 황용한;한교용
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.5
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    • pp.449-454
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    • 2002
  • The use of a thin film of indium between the ITO and the $n^+-lnP$ contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. $ITO/n^+-lnP$ ohmic contact was successfully achieved by the deposition of indium and annealing. The specific contact resistance of about $6.6{\times}10^{-4}\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to $ITO/n^+-lnP$ contact without the deposition of indium between ITO and $n^+-lnP$, it exhibited Schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with those of InP/InGaAs HBTs with the opaque emitter contacts.

Design of a New Harmonic Noise Frequency Filtering Down-Converter in InGaP/GaAs HBT Process

  • Wang, Cong;Yoon, Jae-Ho;Kim, Nam-Young
    • Journal of electromagnetic engineering and science
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    • v.9 no.2
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    • pp.98-104
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    • 2009
  • An InGaP/GaAs MMIC LC VCO designed with Harmonic Noise Frequency Filtering(HNFF) technique is presented. In this VCO, internal inductance is found to lower the phase noise, based on an analytic understanding of phase noise. This VCO directly drives the on-chip double balanced mixer to convert RF carrier to IF frequency through local oscillator. Furthermore, final power performance is improved by output amplifier. This paper presents the design for a 1.721 GHz enhanced LC VCO, high power double balance mixer, and output amplifier that have been designed to optimize low phase noise and high output power. The presented asymmetric inductance tank(AIT) VCO exhibited a phase noise of -133.96 dBc/Hz at 1 MHz offset and a tuning range from 1.46 GHz to 1.721 GHz. In measurement, on-chip down-converter shows a third-order input intercept point(IIP3) of 12.55 dBm, a third-order output intercept point(OIP3) of 21.45 dBm, an RF return loss of -31 dB, and an IF return loss of -26 dB. The RF-IF isolation is -57 dB. Also, a conversion gain is 8.9 dB through output amplifier. The total on-chip down-converter is implanted in 2.56${\times}$1.07 mm$^2$ of chip area.

On-chip Smart Functions for Efficiency Enhancement of MMIC Power Amplifiers for W-CDMA Handset Applications

  • Youn S. Noh;Kim, Ji H.;Kim, Joon H.;Kim, Song G.;Park, Chul S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.1
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    • pp.47-54
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    • 2003
  • New efficiency enhancement techniques have been devised and implemented to InGaP/GaAs HBT MMIC power amplifiers for W-CDMA mobile terminals applications. Two different types of bias current control circuits that select the efficient quiescent currents in accordance with the required output power levels are proposed for overall power efficiency improvement. A dual chain power amplifier with single matching network composed of two different parallel-connected power amplifier is also introduced. With these efficiency enhancement techniques, the implemented MMIC power amplifiers presents power added efficiency (PAE) more than 14.8 % and adjacent channel leakage ratio(ACLR) lower than -39 dBc at 20 dBm output power and PAE more than 39.4% and ACLR lower than -33 dBc at 28 dBm output power. The average power usage efficiency of the power amplifier is improved by a factor of more than 1.415 with the bias current control circuits and even up to a factor of 3 with the dual chain power amplifier.

A Design of MMIC Oscillator with Miniaturized Hairpin Resonator Structure (헤어핀 공진기 구조를 소형화한 MMIC 발진기 설계)

  • Choi, Jong-Won;Moon, Seong-Mo;Park, Jun-Seok;Lee, Jae-Hak;Lee, Moon-Que
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.2067-2069
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    • 2004
  • 본 논문에서는 전통적인 헤어핀 공진기보다 훨씬 소형화한 헤어핀 공진기 구조를 이용하여 X 대역 MMIC 발진기를 InGaP/GaAs HBT 공정을 이용하여 제작하였다. 헤어핀 공진기의 크기는 약 1/4정도로 작게 구현이 가능하였으며, 이를 적용한 발진기의 측정결과 주파수는 8.295 GHz, 출력전력은 4.8 dBm, 위상잡음특성은 100 kHz 옵셋 주파수에서 -106.8 dBc/Hz, 1 MHz 옵셋 주파수에서 -121.7 dBc/Hz를 각각 나타내었다.

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