• 한국전기전자재료학회논문지
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• 제28권12호
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.444-445
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• 2006

We prepared ZnO:Al thin films under various sputtering conditions by using facing targets sputtering (FTS) method. ZnO:Al thin films were deposited on polyethersulfon (PES) substrate which is the thickness of 200um at room temperature. the electrical, optical and crystallographic properties of ZnO:Al were investigated. From the results, prepared alll ZnO:Al thin films showed (002) diffraction peaks. ZnO:Al thin film with a resistivity of $8.4{\times}10^{-4}{\Omega}cm$ and a transmittance of over 80% in visible range was obtained.

• Advances in Computational Design
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• 제7권4호
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• pp.371-393
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• 2022

This paper presents a three-dimensional flexible pavement simulated in ANSYS subjected to moving vehicular load on the surface of the pavement typical for the road section in Nepal. The adopted finite element (FE) model of pavement is validated with the classical theoretical formulations for half-space pavement. The validated model is further utilized to understand the damping and dynamic response of the pavement. Transient analysis of the developed FE model is done to understand the time varying response of the pavement under a moving vehicle. The material properties of pavement considered in the analysis is taken from typical road section used in Nepal. The response quantities of pavement with nonlinear viscoelastic asphalt layer are found significantly higher compared to the elastic pavement counterpart. The structural responses of the pavement decrease with increase in the vehicle speed due to less contact time between the tires of the vehicle and the road pavement.

• Journal of Welding and Joining
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• 제33권3호
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.25-28
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• 2000

In this paper, three types of organic electroluminescent devices(OELD) were fabricated on mechanically flexible plastic substrate by using vacuum deposition method. The devices consist of a hole transporting material such as TPD, a light-emitting material such as Alq$\sub$3/ and an electron transporting material, blocking material such as PBD. Electrical and optical properties of these OELDs were measured. This paper shows that organic small molecules based on OELD can be successfully deposited on a flexible plastic substrate. This points open the potential for low cost mass production of flexib]e displays, including roll to roll processing.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.234-235
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• 2005

True electronic paper displays are being enabled by the development of two core technologies - plastic electronics for display backplanes and electrophoretic ink for use as the imaging layer. Electrophoretic ink developed by E Ink Corporation continues to advance performance along with parallel technology breakthroughs in flexible TFT backplanes. An overview of these advances in the ink imaging material will be discussed with special emphasis of the expected impact on the emerging flexible display applications.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.237.2-237.2
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• 2005

• 한국고분자학회지:고분자과학과기술
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• 제21권3호
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• pp.247-250
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• 2010

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.413-413
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• 2009

Silicon nanowires (Si NWs)-based top-gate field-effect transistors (FETs) are constructed by using Si NWs transferred onto flexible plastic substrates. Si NWs are obtained from the silicon wafers using photolithography and anisotropic etching process, and transferred onto flexible plastic substrates. To evaluate the electrical performance of the silicon nanowires, we examined the output and transfer characteristics of a top-gate field-effect transistor with a channel composed of a silicon nanowire selected from the nanowires on the plastic substrate. From these FETs, a field-effect mobility and transconductance are evaluated to be $47\;cm^2/Vs$ and 272 nS, respectively.

• 한국전기전자재료학회논문지
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• 제22권12호
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• pp.1023-1027
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• 2009

Cadmium sulfide (CdS) thin film for flexible optical device applications were prepared at $H_2/(Ar+H_2)$ flow ratios on polyethersulfon (PES) flexible polymer substrates at room temperature by radio frequency magnetron sputtering technique. The CdS thin films deposited at room temperature showed a (002) preferred orientation and the smooth surface morphologies. Films deposited at a hydrogen flow ratio of 25% exhibited a photo- and dark-sheet resistance of about 50 and $2.7\;{\times}\;10^5\;{\Omega}/square$, respectively. From the result of the bending test, CdS films exhibit a strong adhesion with the PES polymer substrates and the $Al_2O_3$ passivation layer deposited on the CdS films only shows an increase of the resistance of 8.4% after exposure for 120 h in air atmosphere.