• 제목/요약/키워드: Flexible electronic device

검색결과 170건 처리시간 0.027초

Comparative Study on Hydrogen Behavior in InGaZnO Thin Film Transistors with a SiO2/SiNx/SiO2 Buffer on Polyimide and Glass Substrates

  • Han, Ki-Lim;Cho, Hyeon-Su;Ok, Kyung-Chul;Oh, Saeroonter;Park, Jin-Seong
    • Electronic Materials Letters
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    • 제14권6호
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    • pp.749-754
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    • 2018
  • Previous studies have reported on the mechanical robustness and chemical stability of flexible amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) on plastic substrates both in flat and curved states. In this study, we investigate how the polyimide (PI) substrate affects hydrogen concentration in the a-IGZO layer, which subsequently influences the device performance and stability under bias-temperature-stress. Hydrogen increases the carrier concentration in the active layer, but it also electrically deactivates intrinsic defects depending on its concentration. The influence of hydrogen varies between the TFTs fabricated on a glass substrate to those on a PI substrate. Hydrogen concentration is 5% lower in devices on a PI substrate after annealing, which increases the hysteresis characteristics from 0.22 to 0.55 V and also the threshold voltage shift under positive bias temperature stress by 2 ${\times}$ compared to the devices on a glass substrate. Hence, the analysis and control of hydrogen flux is crucial to maintaining good device performance and stability of a-IGZO TFTs.

갈륨 및 갈륨 합금을 이용한 저온접합 기술 동향 (Trends of Low-temperature Bonding Technologies using Gallium and Gallium Alloys)

  • 홍태영;심호률;손윤철
    • 마이크로전자및패키징학회지
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    • 제29권2호
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    • pp.11-18
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    • 2022
  • 최근 세계적으로 유연 전자소자 관련 기술들이 주목을 받으면서 유연소자 제작 과정에서의 성형성 및 굽힘 상태에서의 성능과 내구성 등의 문제점을 개선하기 위하여 액체 금속을 사용한 배선·접합 기술들의 개발이 요구되고 있다. 이러한 요구에 부응하여 독성이 없으면서 낮은 점도와 우수한 전기전도도를 가지는 갈륨 및 갈륨계 합금 (공정 갈륨-인듐 및 공정 갈륨-인듐-주석 등)의 액체금속을 저온 접합소재로 이용하려는 다양한 연구들이 이루어지고 있다. 본 논문에서는 갈륨 및 갈륨계 합금을 이용한 저온접합 기술의 최신 연구동향을 정리하여 소개하고자 한다. 이러한 기술들은 향후 유연 전자소자의 제조 및 전자패키지에서의 저온접합 등의 분야에서 실용화를 위한 중요한 기반기술이 될 것으로 예상된다.

Novel Hierarchical Test Architecture for SOC Test Methodology Using IEEE Test Standards

  • Han, Dong-Kwan;Lee, Yong;Kang, Sung-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권3호
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    • pp.293-296
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    • 2012
  • SOC test methodology in ultra deep submicron (UDSM) technology with reasonable test time and cost has begun to satisfy high quality and reliability of the product. A novel hierarchical test architecture using IEEE standard 1149.1, 1149.7 and 1500 compliant facilities is proposed for the purpose of supporting flexible test environment to ensure SOC test methodology. Each embedded core in a system-on- a-chip (SOC) is controlled by test access ports (TAP) and TAP controller of IEEE standard 1149.1 as well as tested using IEEE standard 1500. An SOC device including TAPed cores is hierarchically organized by IEEE standard 1149.7 in wafer and chip level. As a result, it is possible to select/deselect all cores embedded in an SOC flexibly and reduce test cost dramatically using star scan topology.

시작시기와 납기를 고려하는 유연흐름공장의 일정계획 (A Scheduling Scheme for Flexible Flow Shop with Release Date and Due Date)

  • 이주한;김성식
    • 산업공학
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    • 제11권3호
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    • pp.1-13
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    • 1998
  • This paper addresses a scheduling scheme for Flexible Flow Shop(FFS) in the case that a factory is a sub-plant of an electronic device manufacturing plant. Under this environment, job orders for the sub-plants in the production route are generated together with job processing time bucket when the customer places orders for final product. The processing time bucket for each job is a duration from possible release date to permissible due date. A sub-plant modeled FFS should schedule these jobs orders within time bucket. Viewing a Printed Circuit Board(PCB) assembly line as a FFS, the developed scheme schedules an incoming order along with the orders already placed on the scheduled. The scheme consists of the four steps, 1)assigning operation release date and due date to each work cells in the FFS, 2)job grouping, 3)dispatching and 4)machine allocation. Since the FFS scheduling problem is NP-complete, the logics used are heuristic. Using a real case, we tested the scheme and compared it with the John's algorithm and other dispatching rules.

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Fabrication of Organic-Inorganic Nanohybrid Semiconductors for Flexible Electronic Device

  • 한규석;정희찬;권덕현;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.114-114
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    • 2011
  • We report a high-performance and air-stable flexible and invisible semiconductor which can be substitute for the n-type organic semiconductors. N-type organic-inorganic nanohybrid superlattices were developed for active semiconducting channel layers of thin film transistors at low temperature of $150^{\circ}C$ by using molecular layer deposition with atomic layer deposition. In these nanohybrid superlattices, self-assembled organic layers (SAOLs) offer structural flexibility, whereas ZnO inorganic layers provide the potential for semiconducting properties, and thermal and mechanical stability. The prepared SAOLs-ZnO nanohybrid thin films exhibited good flexibility, transparent in the visible range, and excellent field effect mobility (> 7cm2/$V{\cdot}s$) under low voltage operation (from -1 to 3V). The nanohybrid semiconductor is also compatible with pentacene in p-n junction diodes.

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Electric Circuit Fabrication Technology using Conductive Ink and Direct Printing

  • 정재우;김용식;윤관수
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.12.1-12.1
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    • 2009
  • For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

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CNT의 도입에 의한 β-phase PVDF의 형성과 CNT/PVDF 복합막에서의 압전성능 개선 (Formation of β-phase PVDF by Introduction of CNTs in the CNT/PVDF Composite Film and Resulting Improvement of Piezoelectric Performance)

  • 임영택;이선우
    • 한국전기전자재료학회논문지
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    • 제29권11호
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    • pp.712-715
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    • 2016
  • In this paper, we fabricated flexible CNT/PVDF piezoelectric composite device by introducing CNTs (carbon nanotubes) into PVDF (poly-vinylidene fluoride) solution using spray coating technique. Flexible PEDOT:PSS conducting polymer was used as electrodes. We tried to improve the piezoelectric performance from the CNT/PVDF composite film by increasing the portion of the ${\beta}$-phase PVDF in the film. We confirmed the structural conformation of the CNT/PVDF composite film as a function of CNT concentration by using FT-IR (fourier transform infra-red). As increasing CNT concentration, portion of the ${\beta}$-phase PVDF and resulting piezoelectric performance increased in the CNT/PVDF composite film. We found that CNTs introduced were played as seeds for formation of the ${\beta}$-phase PVDF in the CNT/PVDF composite film and resulting improvement of the piezoelectric performance.

PEDOT:PSS 전극의 전도도향상에 의한 CNT/PVDF 복합막의 압전성능 개선 (Improvement of Piezoelectric Performance of the CNT/PVDF Composite Film by Enhancing Conductivity of the PEDOT:PSS Electrodes)

  • 임영택;이선우
    • 한국전기전자재료학회논문지
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    • 제29권11호
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    • pp.716-719
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    • 2016
  • In this paper, we fabricated flexible CNT/PVDF (carbon nanotube / polyvinylidene fluoride) piezoelectric composite device with flexible poly(3,4-ethylenedioxythiophene) : polystyrene sulfonate (PEDOT:PSS) conducting polymer electrode using spray coating method. We tried to improve the piezoelectric performance from the CNT/PVDF composite film by enhancing electrical conductivity of the PEDOT:PSS electrodes. Electrical conductivity of the PEDOT:PSS electrode was enhanced by dipping it into the EG (ethylene glycol) solvent. Changes of chemical composition of the PEDOT:PSS electrode were analyzed with the dipping time by XPS (x-ray photoelectron spectroscopy) in terms of oxygen (O1s). Finally, Piezoelectric performances such as output voltage and current were measured with the dipping time. We found that enhanced electrical conductivity of the PEDOT:PSS electrodes resulted in improvement of the piezoelectric performance of the CNT/PVDF films.

Polymer 광도파로 제작 및 특성 (Preparation and Optical Characteristic of Polymer waveguide)

  • 김성구;조재철;정운조;박계춘;강성준;이진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.275-277
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    • 1999
  • A application possibility of photoresist flexible film for optical waveguide is proposed and described. The optical waveguide dimensions that is consists of Mach-zehnder interferometric and single channel waveguide based on the single-mode conditions in LiNbO$_3$ device was utilized and fabricated by wet etching technique. This Polymer material for core layer is SU-8/5O(Microchem.) and its refractive index from prism couping method was measured about 1.59 thickness about 10${\mu}{\textrm}{m}$ at wavelength 0.6328${\mu}{\textrm}{m}$. From the results, this work can show the possibility of fabricating a flexible optical waveguide in the field of integrated optics.

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마이크로 인몰드 공정기술 기반 전자소자 제조 및 응용 (Recent Progress in Micro In-Mold Process Technologies and Their Applications)

  • 김성현;권영우;홍석원
    • 마이크로전자및패키징학회지
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    • 제30권2호
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    • pp.1-12
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    • 2023
  • 전 세계적 모바일 스마트 기기 혁명은 사람이 접하는 모든 공간에서 독립된 형태의 전기회로를 요구하고 있으며, 전자기기간 연결된 사물인터넷의 구현은 사용자 측면에서 운용이 쉽고 지속 가능한 디지털 생태계 인프라 구축에서 매우 중요한 위치를 차지하고 있다. 이러한 기술은 자동차 전장품, 가정용 가전제품 및 웨어러블 기기의 생산 기술 발전으로 이어지고 있으며, 특히 최근 소개된 인몰드 전자기기(in-mold electronics, IME)는 기존의 대량 공정의 장점을 극대화할 수 있는 기술로 대두되고 있다. 이 기술은 평평한 2차원 기판에 기능성 잉크를 인쇄하고, 3차원 형상으로 열/사출 성형하여 경량화 및 저비용으로 장치를 생산해내는 경제성 강점을 이유로 산업적인 가치를 평가받고 있다. 본 논문에서는 인몰드 전자 장치의 제조기술 및 응용 측면에 대한 가장 최신의 국내외 연구 그룹에서 제안된 기술 개발을 소개하고자 한다. 신체 표면상에서 독립된 형태의 바이오센서 전자소자의 운용을 위한 생체 모사 기술, 에너지 소자, 생체신호 모니터링 센서들을 인몰드 기술로 구현하는 기술 및 장치 구성은, 4차 산업혁명과 함께 성장 중인 유연인쇄전자 기술과 융합되어 회로 기판 제조기술의 혁신을 가져올 것으로 기대된다.