• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.21 no.2
• /
• pp.218-223
• /
• 2010

In this paper, a novel CPW(Coplanar Waveguide)-fed UWB(Ultra Wide Band) antenna is designed, implemented, and measured for UWB communications. CPW-fed planar antenna has advantages of wide-bandwidth, low-cost and easy interaction with radio frequency front end circuitry. We have used HFSS(High Frequency Structure Simulator) of Ansoft which is based on the FEM(Finite Element Method) to simulate the proposed antenna. FR-4 substrate of thickness 1.6 mm and relative permitivity 4.4 is used for implementation. The proposed antenna showed VSWR(Voltage Standarding Wave Ratio)${\leq}2$ for the frequency band from 3.1 GHz to 10.6 GHz which is used for ultra wide band communication. Measured peak gains are 2.61, 4.95, 2.89, 7.35 dBi at 3, 6, 8, 11 GHz, respectively.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.11 no.11
• /
• pp.1047-1052
• /
• 2016

In this paper, we propose the CSLR(: Complementary Single Loop Resonators)-loaded inset fed patch antenna with a conducting reflector to improve the radiation patterns. Reflector of the proposed antenna is located below about ${\lambda}_0/4$ from the ground plane of the patch, the size is about two times of the patch. The proposed antenna is designed and fabricated on the substrate which has a dielectric constant and thickness with 2.5 and 0.787 mm, respectively. Simulation results are obtained by using the HFSS, 3D EM Solver based Finite Element Method(: FEM). The resonant frequency and matching characteristics of the antenna with reflector are substantially the same as when there is no change in the antenna without reflector, it is confirmed that radiation patterns are significantly improved by the reflector.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.39 no.6
• /
• pp.583-588
• /
• 2015

Asymptotic method has been often used to theoretically analyze the complete contact problem. The error of the asymptotic results increases as the distance from the contact edge increases. The singularity cannot be properly obtained from a finite element (FE) analysis owing to the finiteness of the element size. In the present work, the complete contact problem in bonded condition is analyzed using a combined experimental-numerical approach to assist and/or compare with the asymptotic results. Al and Cu alloys are used for the material combination of the punch and substrate. 120 and 135 degrees are used for the punch angle. The FE models are validated by comparison of displacement distributions obtained by the FE analysis and $moir{\acute{e}}$ experiment. Generalized stress intensity factors are evaluated using the validated FE models. Stress field in the vicinity of the sharp contact edges obtained from the FE and asymptotic analyses are compared. The discrepancies are also discussed.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.24 no.12
• /
• pp.1635-1643
• /
• 2000

The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

• Journal of the Korean Electrochemical Society
• /
• v.14 no.3
• /
• pp.138-144
• /
• 2011

The transport phenomena of electron and ion around the electrode have been analyzed, herein the computational program to simulate the electrochemical signal of cyclic voltammetry has been implemented. For the dominant mass-transfer system, the governing equation and its boundary conditions are confined to the semi-infinite diffusion model and the reversible reaction at the electrode. In order to obtain the numerical solutions of cyclic voltammetry, MATLAB was used for the explicit finite difference method. Experimental results from the cyclic voltammetry of electrochemical system(10 mM $K_3Fe(CN)_6$ and 0.1M KCl) upon the ITO glass substrate were compared with the numerical solutions. Present program explains the experimental results fairly well, where they approached the simulated ones closely with deceasing the scan rate. Furthermore, the effects of electrode area, electrochemical reaction constants and transfering coefficients in the cyclic voltammetry were discussed quantitatively.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.15 no.1
• /
• pp.226-234
• /
• 2011

The service life of concrete structures exposed to a marine environment can be extended by controlling the amount of chloride in cover concrete. Patching is one of the appropriate maintenance techniques for chloride contamination. Chloride-contaminated cover concrete is removed and replaced with sound one. It can provide less risk of corrosion of steel, so that the structure can be maintained for required service life. In this study, a quantitative assessment of the service life subjected to the chloride attack is proposed to determine the effective repair options such as repair depth, repair material and timing of repair. The Crank-Nicolson based finite difference formulation from Fick's second law is proposed to predict the profiles of chloride ion in a repaired concrete structure, considering ingress of chloride from outer and redistribution of residual chloride from the substrate concrete. Therefore, the repair application times and maintenance cost for the target service life can be estimated. Finally, the numerical examples are presented to ensure its applicability.

• Bulletin of the Korean Chemical Society
• /
• v.32 no.spc8
• /
• pp.2941-2948
• /
• 2011

A nanogap formed by a metal nanoparticle and a flat metal substrate is one kind of "hot site" for surface-enhanced Raman scattering (SERS). The characteristics of a typical nanogap formed by a planar Au and either an Au and Ag nanoparticle have been well studied using 4-aminobenzenethiol (4-ABT) as a probe. 4-ABT is, however, an unusual molecule in the sense that its SERS spectral feature is dependent not only on the kinds of SERS substrates but also on the measurement conditions; thus further characterization is required using other adsorbate molecules such as 1,4-phenylenediisocyanide (1,4-PDI). In fact, no Raman signal was observable when 1,4-PDI was selfassembled on a flat Au substrate, but a distinct spectrum was obtained when 60 nm-sized Au or Ag nanoparticles were adsorbed on the pendent -NC groups of 1,4-PDI. This is definitely due to the electromagnetic coupling between the localized surface plasmon of Au or Ag nanoparticle with the surface plasmon polariton of the planar Au substrate, allowing an intense electric field to be induced in the gap between them. A higher Raman signal was observed when Ag nanoparticles were attached to 1,4-PDI, irrespective of the excitation wavelength, and especially the highest Raman signal was measured at the 632.8 nm excitation (with the enhancement factor on the order of ${\sim}10^3$), followed by the excitation at 568 and 514.5 nm, in agreement with the finite-difference timedomain calculation. From a separate potential-dependent SERS study, the voltage applied to the planar Au appeared to be transmitted without loss to the Au or Ag nanoparticles, and from the study of the effect of volatile organics, the voltage transmission from Au or Ag nanoparticles to the planar Au also appeared as equally probable to that from the planar Au to the Au or Ag nanoparticles in a nanogap electrode. The response of the Au-Ag nanogap to the external stimuli was, however, not the same as that of the Au-Au nanogap.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.4
• /
• pp.49-60
• /
• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Korean Journal of Materials Research
• /
• v.8 no.8
• /
• pp.744-750
• /
• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Advances in concrete construction
• /
• v.9 no.1
• /
• pp.43-54
• /
• 2020

This paper presents an innovative stress-function variational approach in formulating the interfacial shear and normal stresses in an externally bonded concrete joint using carbon fiber-reinforced plastic (CFRP) plies. The joint is subjected to surface traction loadings applied at both ends of the concrete substrate layer. By introducing two interfacial shear and normal stress functions on the CFRP-concrete interface, based on Euler-Bernoulli beam idea and static stress equations of equilibrium, the entire stress fields of the joint were determined. The complementary strain energy was minimized in order to solve the governing equation of the joint. This yields an ordinary differential equation from which the interfacial normal and shear stresses were proposed explicitly, satisfying all the multiple traction boundary conditions. Lamination theory for composite materials was also employed to obtain the interfacial stresses. The proposed approach was validated by the analytic models in the literature as well as through a comprehensive computational code generated by the authors. Furthermore, a numerical verification was carried out via the finite element software ABAQUS. In the end, a scaling analysis was conducted to analyze the interfacial stress field dependence of the joint upon effective issues using the devised code.