• Title/Summary/Keyword: Finite substrate

Search Result 247, Processing Time 0.025 seconds

Simultaneous Switching Noise Reduction Technique in Multi-Layer Boards using Conductive Dielectric Substrate (전도성 운전기판을 이용한 다층기판에서의 Simultaneous Switching Noise 감소 기법)

  • 김성진;전철규;이해영
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 1999.11a
    • /
    • pp.33-36
    • /
    • 1999
  • In this paper, we proposed a simultaneous switching noise(SSN) reduction technique in muti-layer beards(MLB) for high-speed digital applications and analyzed them using the Finite Difference Time Domain(FDTD) method. The new method by conductive dielectric substrates reduces SSN couplings and resonances, significantly, which cause series malfunctions in the modem high-speed digital applications.

  • PDF

Propagation Characteristics of Shielded Coplanar Waveguides (차폐된 코플래너 도파로의 전송특성)

  • 김영택;이택경
    • Journal of the Korean Institute of Telematics and Electronics A
    • /
    • v.32A no.9
    • /
    • pp.1236-1243
    • /
    • 1995
  • The propagation characteristics of the symmetric and the asymmetric shielded coplanar waveguide with finite metallization thickness is analyzed by boundary integral method employing the equivalence principle. Since the Green's function and the basis functions are composed of sinusoidal functions, the integration in Galerkin's method is solved analytically. The propagation constants of the fundamental and the first higher order mode are obtained and the effects of strip thickness, substrate permittivity, and the asymmetry of the structure are calculated.

  • PDF

Design ofa wideband HTS antenna

  • Hwang, Jong-Sun;Park, Sung-Jin;Han, Byoung-Sung;Chung, Dong-Chul
    • 한국초전도학회:학술대회논문집
    • /
    • v.10
    • /
    • pp.197-200
    • /
    • 2000
  • In this paper, we present a novel methodology for a wideband HTS antenna of finite length placed on a dielectric substrate. A methodology used in this work is based on a moment-method techniques with Green function singularity when the field point is in the source triangle. The designed resonance frequency of our HTS antenna is 11.85 GHz. The return loss is -26 dB. The bandwidth obtained is a significant 10.6 %. Experimental measurements for a HTS antenna designed in X-band are shown to agree well with the simulated prediction.

  • PDF

Design Study of Adhesively Bonded Structures

  • Chung, Jae-Ung
    • Korean Journal of Computational Design and Engineering
    • /
    • v.14 no.2
    • /
    • pp.122-128
    • /
    • 2009
  • The failure responses of adhesively bonded, hat stiffened structures are studied through numerical analysis using the finite element method. The responses are evaluated numerically for the bonded hat section/substrate structures containing different combinations of materials. It is studied what kind of material combinations causes the easier crack initiation in the structure. This study is conducted under plane strain conditions and J-integral via a commercial code ABAQUS as a total critical energy release criterion was used for observation on crack initiation. Also, the influence of adhesive on the structure is studied.

Stability analysis of high-temperature superconductor(Au/YBCO) film using one-dimensional FDM (1차원 FDM을 이용한 고온 초전도체(Au/YBCO) 박막의 안정성 해석)

  • 김진석;설승윤
    • Progress in Superconductivity and Cryogenics
    • /
    • v.4 no.2
    • /
    • pp.27-30
    • /
    • 2002
  • One dimensional conduction equation is solved by finite difference method, to analyse the stability of Au/YBCO film deposited on a sapphire substrate. Joule heat is included in the case of current sharing state. The analysis shows the quench and recovery of superconductor depending on the amount of thermal disturbance release on the center surface of superconductor. The critical disturbance energies for different filling factor and operating current are calculated.

Experimental and numerical disbond localization analyses of a notched plate repaired with a CFRP patch

  • Abderahmane, Sahli;Mokhtar, Bouziane M.;Smail, Benbarek;Wayne, Steven F.;Zhang, Liang;Belabbes, Bachir Bouiadjra;Boualem, Serier
    • Structural Engineering and Mechanics
    • /
    • v.63 no.3
    • /
    • pp.361-370
    • /
    • 2017
  • Through the use of finite element analysis and acoustic emission techniques we have evaluated the interfacial failure of a carbon fiber reinforced polymer (CFRP) repair patch on a notched aluminum substrate. The repair of cracks is a very common and widely used practice in the aeronautics field to extend the life of cracked sheet metal panels. The process consists of adhesively bonding a patch that encompasses the notched site to provide additional strength, thereby increasing life and avoiding costly replacements. The mechanical strength of the bonded joint relies mainly on the bonding of the adhesive to the plate and patch stiffness. Stress concentrations at crack tips promote disbonding of the composite patch from the substrate, consequently reducing the bonded area, which makes this a critical aspect of repair effectiveness. In this paper we examine patch disbonding by calculating the influence of notch tip stress on disbond area and verify computational results with acoustic emission (AE) measurements obtained from specimens subjected to uniaxial tension. The FE results showed that disbonding first occurs between the patch and the substrate close to free edge of the patch followed by failure around the tip of the notch, both highest stress regions. Experimental results revealed that cement adhesion at the aluminum interface was the limiting factor in patch performance. The patch did not appear to strengthen the aluminum substrate when measured by stress-strain due to early stage disbonding. Analysis of the AE signals provided insight to the disbond locations and progression at the metal-adhesive interface. Crack growth from the notch in the aluminum was not observed until the stress reached a critical level, an instant before final fracture, which was unaffected by the patch due to early stage disbonding. The FE model was further utilized to study the effects of patch fiber orientation and increased adhesive strength. The model revealed that the effectiveness of patch repairs is strongly dependent upon the combined interactions of adhesive bond strength and fiber orientation.

Finite element analysis of CFRP laminate repairs on damaged end regions of prestressed concrete bridge girders

  • Shaw, Ian D.;Andrawes, Bassem
    • Advances in Computational Design
    • /
    • v.2 no.2
    • /
    • pp.147-168
    • /
    • 2017
  • Over the past couple decades, externally bonded fiber reinforced polymer (FRP) composites have emerged as a repair and strengthening material for many concrete infrastructure applications. This paper presents an analytical investigation of the use of carbon FRP (CFRP) for a specific problem that occurs in concrete bridge girders wherein the girder ends are damaged by excessive exposure to deicing salts and numerous freezing/thawing cycles. A 3D finite element (FE) model of a full scale prestressed concrete (PC) I-girder is used to investigate the effect of damage to the cover concrete and stirrups in the end region of the girder. Parametric studies are performed using externally bonded CFRP shear laminates to determine the most effective repair schemes for the damaged end region under a short shear span-to-depth ratio. Experimental results on shear pull off tests of CFRP laminates that have undergone accelerated aging are used to calibrate a bond stress-slip model for the interface between the FRP and concrete substrate and approximate the reduced bond stress-slip properties associated with exposure to the environment that causes this type of end region damage. The results of these analyses indicate that this particular application of this material can be effective in recovering the original strength of PC bridge girders with damaged end regions, even after environmental aging.

Squeeze Film Damping of Perforated Planar Microstructures (기판에 수직으로 진동하는 다공 평판 미소구조물의 공기감쇠)

  • Kim, Eung-Sam;Jo, Yeong-Ho;Kim, Mun-Eon
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.49 no.1
    • /
    • pp.64-69
    • /
    • 2000
  • This paper investigates the equeeze film damping of a perforated planar micromechanical structure that oscillates in the normal direction to the substrate. Special focus has been places on the effect of holes and edges of the perforated planar microstructures on the squeeze film damping of oscillatory motions. Theoretical models and test structures of the squeeze film damping have been developed for the transversely oscillating perforated plates. A set of nine different test structures, having three different sized with three different numbers of perforations, has been fabricated and tested. The experimental Q-factors, measured from the fabricated test structures, are compared with the theoretical values, estimated from finite element analysis. It is found that the finite element analysis overestimates the Q-factors up to 150% of the experimental values. Major discrepancy comes from the inaccuracy of the zero pressure condition, placed by the finite element analysis along the perforated edges.

  • PDF

Optimization of Electrode Pattern for Multilayer Ceramic Heater by Finite Element Method (유한요소법에 의한 적층형 세라믹 히터의 전극 패턴 최적화)

  • Han, Yoonsoo;Kim, Shi Yeon;Yeo, Dong-Hun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.30 no.12
    • /
    • pp.776-781
    • /
    • 2017
  • In this study, we investigated the effect of electrode pattern design on the thermal shock resistance and temperature uniformity of a ceramic heater. A cordierite substrate with a low thermal expansion coefficient was fabricated by tape casting, and a tungsten electrode was printed and used as a heating element. The temperature distribution of the ceramic heater was calculated by a finite-element method (FEM) by considering various electrode patterns, and the tensile stress distribution due to the thermal stress was calculated. In the electrode pattern with a single-line width, the central part of the ceramic heater was heated to the maximum temperature, and the position of the ceramic heater having a double-line width was changed to the maximum temperature, depending on the position of the minimum line width pattern. The highest tensile stress was found along the edges of the ceramic heater. The temperature gradient at the edge determined the tensile stress intensity. The smallest tensile stress was observed for electrode pattern D, which was expected to be advantageous in resisting thermal shock failures in ceramic heaters.

Finite Element Analysis of the Room Temperature Nanoimprint Lithography Process with Rate-Dependent Plasticity (변형률속도를 고려한 상온 나노임프린트 공정의 유한요소해석)

  • Song J. H.;Kim S. H.;Hahn H. Thomas;Huh H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2005.10a
    • /
    • pp.63-66
    • /
    • 2005
  • Nanoimprint lithography (NIL) process at room temperature has been newly proposed in recent years to overcome the shape accuracy and sticking problem induced in a conventional NIL process. Success of the room temperature NIL relies on the accurate understand of the mechanical behavior of the polymer. Since a conventional NIL process has to heat a polymer above the glass transition temperature to deform the physical shape of the polymer with a mold pattern, viscoelastic property of polymer have major effect on the NIL process. However, rate dependent behavior of polymer is important in the room temperature NIL process because a mold with engraved patterns is rapidly pressed onto a substrate coated with the polymer by the hydraulic equipment. In this paper, finite element analysis of the room temperature NIL process is performed with considering the strain rate dependent behavior of the polymer. The analyses with the variation of imprinting speed and imprinting pattern are carried out in order to investigate the effect of such process parameters on the room temperature NIL process. The analyses results show that the deformed shape and imprint force is quite different with the variation of punch speed because the dynamic behavior of the polymer is considered with the rate dependent plasticity model. The results provide a guideline for the determination of process conditions in the room temperature NIL process.

  • PDF