• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.99-105
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• 2022

칩사이즈가 작아짐에 따라 선폭 또한 미세화되면서 인터커넥션의 밀집정도가 증가하고 있다. 그로 인해 캐패시터 층과 전기전도층의 저항 차이로 인해 RC delay가 문제되고 있다. 이를 해결하기 위해서는 높은 전기전도도의 전극과 낮은 유전율의 유전체 개발이 요구된다. 본 연구에서는 PCB (Print Circuit Board)의 회로를 외부요인으로부터 보호하는 상용 PSR (photo solder resist)과 우수한 내열 및 저유전 특성을 보유한 PI (polyimide)를 혼합하여 저유전체 잉크 개발을 진행하였다. 그 결과 PSR과 PI를 10:3으로 혼합한 잉크가 가장 우수한 결과를 보였으며 20 GHz와 28 GHz에서 각각 유전 상수 약 2.6, 2.37을 보였고, 유전손실은 약 0.022, 0.016으로 측정되었다. 차후 어플리케이션 적용 가능성 검증을 위해 테프론에 제작된 다양한 선폭의 전송선로에 평가하였으며 그 결과, PSR만 사용했을 때보다 PI와 혼합한 저유전체 잉크를 사용한 전송선로의 손실이 S21에서 평균 0.12 dB 덜 감소한 결과를 보였다.

• 패션비즈니스
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• 제16권5호
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• pp.57-73
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• 2012

The main objective of this research was to understand the characteristics of pleats design through the analysis of modern female fashion as they appear in the 'Collections' from '09 A/W to '12 S/S. Data collection of 1027 was done through the review of 'pr$\hat{e}$t-$\grave{a}$-porter Collections' of three cities; Milan, New York, Paris. Along with the qualitative interpretation of pleats design, statistical analysis of frequency and ${\chi}^2$-test were completed for data analysis. The main findings were as follows; 1. The five types of pleats design were founded in the order of accordion, knife, box, inverted, and sunburst pleats. The frequency and ratio of pleats design occurency showed significant difference between collections. 2. There were significant difference between the types of pleats and their line characteristics of thickness, continuity, length, direction. = Thin fabrics with delicate fine folds were mainly appeared in accordion and sunburst pleats. On the other hand, midium thickness fabrics were used for knife, box & inverted pleats, however, the different images were projected according to the width and the number of folds, characteristics of fabrics and textures. = In all the type of pleats but sunburst, continuity line was appeared the most. The discontinuous lines were appeared the most in the layered types and, sometimes, at some construction lines to add some decorative details or design variations. = The long line were the most frequently appeared in long one-pieces or long skirts of knife, accordion, sunburst pleats. While, the shorter lines showed the most frequently in box and inverted pleats, which mainly used for skirts or the lower part of one-piece. = For the line directions, the vertical lines were the most frequently appeared, and followed by mixed and diagonal line. In mixed or diagonal lines, same type of pleat was repeated in one design. For diagonal lines, one direction was mainly used, however, the symmetrical arrangements or repeated diagonal pleats in various directions also used. In mixed lines, the type of one or two diagonal and one vertical line was the most frequently appeared.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.21-28
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• 2004

Polytetrafluoroethylene (PTFE/Teflon ) 인쇄회로기판용 미세 피치 솔더 범프 형성을 위해 dry film photoresist (DFR)를 photolithography 공정에 적용하였다. DFR lamination을 위한 test board는 폭 100$\mu\textrm{m}$와 두께 18$\mu\textrm{m}$의 copper line들이 100-200$\mu\textrm{m}$의 간격으로 배열된 형태로 디자인하였다. 15$\mu\textrm{m}$의 두께를 갖는 DFR을 hot roll laminator를 사용하여 lamination 온도와 속도를 변화시켜가면서 lamination 공정 실험을 수행하였다. 실험 결과, PTFE 인쇄회로기판에 DFR을 lamination하는 공정의 최적 조건은 lamination 온도 $150^{\circ}C$, 속도 약 0.63cm/s였다. UV exposure 및 development 공정을 거쳐 저융점 솔더 재료인 인듐을 증착하였다. DFR 박리 순서에 따른 두 가지 다른 reflow 공정을 통해 최소 지름 50$\mu\textrm{m}$, 최소 피치 100$\mu\textrm{m}$를 갖는 인듐 솔더 범프를 형성하였다.

• 대한기계학회논문집B
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• 제37권9호
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• pp.873-877
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• 2013

잉크젯 기술은 가정용 프린터에서부터 제조 도구로 확대 되었다. 최근 인쇄전자 분야에서 고해상도 인쇄가 요구되고 있다. 기존의 잉크젯 인쇄 패터닝 방식을 향상 시키기 위해 전기수력학잉크젯 기술이 최근 주목을 받고 있는데 노즐 직경보다 작은 방울을 토출할 수 있고 넓은 점도 범위와 재료를 사용할 수 있기 때문이다. 본 논문에서는 미세 패터닝을 위한 EHD 프린팅 시스템이다. 요구 적출형 프린팅에 의해 다양한 패턴을 인쇄하고 벡터와 레스터 프린팅 알고리즘을 개발하였다. 내경이 $8{\mu}m$ 인 노즐을 이용하여 $7{\mu}m$ 이하의 미세 전도성 선폭을 EHD 방식을 통해 만들 수 있다.

• 한국진공학회지
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• 제5권4호
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• pp.309-314
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• 1996

VLSI 공정에 평탄화를 위하여 사용되는 SOG과 AFM lithography에 resist 재료로서 이용되는 것이 확인되었다. 이에 기초하여, 본 연구는, SOG가 VLSI lithography 공정에 이용되기 위한 coating막 두께의 가변, 현상을 위한 etching time 및 etching selectivity의 가변, 패턴의 크기에 따르는 적정 공급전압을 선택 등으로 공정의 여유도를 크게 개선하였다. 공급전압 60V, FE 전류량 5nA로서 800$\AA$의 fine 패턴을 얻었다. 차세대 DRAM 제작공정 기술을 위한 AFM lithography에 있어서, SOG의 사용은 공정 여유도가 양호함에 의하여 크게 전망되는 기술이 될 것이다.

• 한국전기전자재료학회논문지
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• 제24권5호
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• pp.374-380
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• 2011

In this paper a printing process for patterning electrodes on large area substrate was developed by combining screen printing with reverse off-set printing. Ag ink was uniformly coated by screen printing. And then etching resist (ER) was patterned in the Ag film by reverse off-set printing, and then the non-desired Ag film was etched off by etchant. Finally, the ER was stripped-off to obtain the final Ag patterns. We extracted the suitable conditions of reverse Using the process we successfully fabricated gate electrodes and scan bus lines of OTFT-backplane used for e-paper, in which the diagonal size was 6 inch, the resolution $320{\times}240$, the minimum line width 30 um, and sheet resistance 1 ${\Omega}/{\Box}$.

• 한국전기전자재료학회논문지
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• 제26권6호
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• pp.462-467
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• 2013

In this paper, we analyzed the effects of doctoring process on the patterns of Ag ink in gravure off-set printing. The parameters of doctoring process were the angle and the pressure, which was represented by the depth of blade movement to the gravure roll, of doctor blade to the surface of gravure roll, and the angle of patterns engraved on the gravure roll to the doctor blade moving direction. The proper parameters were extracted for the fine patterns and they were 15 mm for the pressure, $60^{\circ}$ for the blade angle. And the angle of patterns with respect to the blade movement should be less than $40^{\circ}$ for the best results. The gravure off-set printing with the above parameters was carried out to print gate electrodes and scan bus lines of OTFT-backplane for e-paper. The line width of $50{\mu}m$ was successfully obtained. The thickness of electrodes was $2.5{\mu}m$ and the surface roughness was $0.65{\mu}m$ and the sheet resistance was $15.8{\Omega}/{\Box}$.

• 한국기계가공학회지
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• 제9권3호
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.217-221
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• 2002

In the coarse grain HAZ adjacent to the fusion line, most of the TiN particles in conventional Ti added steel are dissolved and austenite grain growth is easily occupied during welding process. To avoid this difficulty, thermal stability of TiN particle is improved by increasing the nitrogen content in steel. In this study, the effect of high nitrogen TiN particle on preventing austenite grain growth in HAZ was investigated. Increased thermal stability of TiN particle is helpful for preventing the austenite grain growth by pinning effect. High nitrogen TiN particle in simulated HAZ were not dissolved even at high temperature such as 1400 C and prevented the austenite grain growth in simulated HAZ. Owing to small austenite grain size in HAZ the width of coarse grain HAZ in high nitrogen TiN steel was decreased to 1/10 of conventional TiN steel. Even high heat input welding, the microstructure of coarse grain HAZ consisted of fine polygonal ferrite and pearlite and toughness of coarse grain HAZ was significantly improved.

• 대한기계학회논문집
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• 제8권3호
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• pp.224-231
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• 1984

본 연구에서는 이상과 같은 점을 고려하고, 인장시험을 통해 최대용접강도를 나타내는 최적용접조건을 구한 다음, 최적조건하에서 박강판을 1점 점용접한 재료의 너깃주위에 관찰되는 파괴거동을 광탄성 응력분포거동과 관련시켜 고찰하였다.