• Title/Summary/Keyword: Fin Performance

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Performance Evaluation of Heat Sink for Cooling of LED Projector (LED 프로젝터 방열용 히트싱크의 성능평가)

  • Lee, Kyoung-Yong;Choi, Young-Seok;Jeon, Dong-Soon;Kim, Seon-Chang;Son, Kwang-Eun
    • Proceedings of the SAREK Conference
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    • 2008.06a
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    • pp.1167-1171
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    • 2008
  • The flow and thermal performance of the skiving and louver fin type heat sinks for the cooling system of the small LED projector were experimentally evaluated. A small fan tester based on AMCA standards was used to control and measure the air flow rate into the heat sink. Three heat blocks were used to simulate the heat and light sources(red, green and blue) of the small LED projector. We measured the pressure drop, temperatures and input power at the specific air flow rate and discussed those results. As a result, it is found that the louver fin type heat sink has higher pressure drop and lower thermal resistance than the skiving type. From the comparison of the temperature of the heat block between skiving and louver fin type, the louver fin type heat sink was found to be more suitable for cooling the high power heat source than skiving type. The thermal performance of the fan-sink(louver fin type) system was discussed with the picture taken by a thermal video.

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Enhancement of thin film evaporation on low-fin tubes (낮은핀관의 액막 증발 촉진에 관한 연구)

  • 김내현
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.10 no.6
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    • pp.674-682
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    • 1998
  • In this study, thin film evaporation of water on low-fin tubes were experimentally investigated. Five low-fin tubes with different fin spacing and fin height were tested. Test range covered 0.146kg/ms $\leq$$\Gamma$$\leq$0.219kg/ms and 10㎾/$\m^2$$\leq$q $\leq$70㎾/$\m^2$. Saturation temperature was loot. Compared with the plain tube, low fin tubes enhanced the water film evaporation from 60% to 100%. Tubes with fin spacing smaller than 2mm and fin height higher than 1mm performed better than tubes with other fin configuration. However, when fin spacing was too small at high film flow or fin height was too high at low film flow, the performance decreased. The heat transfer coefficient slightly increased as the flow rate increased. Correlations are developed based on present data.

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Performance Analysis of a Thermally Asymmetric Triangular Fin (열적 비대칭 삼각 휜의 성능해석)

  • Gang, Hyeong-Seok
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.1
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    • pp.66-73
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    • 2002
  • Fin effectiveness and efficiency of a thermally asymmetric triangular fin are represented as a function of the ratio of fin lower surface Biot number to upper surface Biot number and the non-dimensional fin length. For this analysis, two dimensional separation of variables method is used. When fin effectiveness is 2 and efficiency is 90%, the relationship between the non-dimensional fin length and the ratio of fin lower stir(ace Biot number to upper surface Biot number is shown. The relationship between the non-dimensional fin length and the upper surface Biot number for the same condition is also presented.

2-Dimensional Performance Analysis of a Plate Fin (평판-핀의 2차원 성능 해석)

  • Kim, Yun-Ha;Kang, Hyung-Suk
    • Journal of Industrial Technology
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    • v.20 no.B
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    • pp.21-26
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    • 2000
  • Heat loss, fin effectiveness and efficiency of a plate fin are investigated as a function of non-dimensional fin length and Biot number using a two-dimensional separation of variables method. The value of temperature of the left side is set to be different from that of the right side for this plate fin to satisfy the real physical condition. Also temperature distribution within this plate fin is listed. One of the results shows that the fin can be considered to be useful in view of fin effectiveness on the given range of Biot number when non-dimensional fin length is larger than 3.

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Performance Optimization Study of FinFETs Considering Parasitic Capacitance and Resistance

  • An, TaeYoon;Choe, KyeongKeun;Kwon, Kee-Won;Kim, SoYoung
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.5
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    • pp.525-536
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    • 2014
  • Recently, the first generation of mass production of FinFET-based microprocessors has begun, and scaling of FinFET transistors is ongoing. Traditional capacitance and resistance models cannot be applied to nonplanar-gate transistors like FinFETs. Although scaling of nanoscale FinFETs may alleviate electrostatic limitations, parasitic capacitances and resistances increase owing to the increasing proximity of the source/drain (S/D) region and metal contact. In this paper, we develop analytical models of parasitic components of FinFETs that employ the raised source/drain structure and metal contact. The accuracy of the proposed model is verified with the results of a 3-D field solver, Raphael. We also investigate the effects of layout changes on the parasitic components and the current-gain cutoff frequency ($f_T$). The optimal FinFET layout design for RF performance is predicted using the proposed analytical models. The proposed analytical model can be implemented as a compact model for accurate circuit simulations.

Performance evaluation of PF-condenser adapted to Large Size air-conditioner (대형 에어컨에 적용된 PF열교환기의 성능평가)

  • Cho, J.P.;Choi, Y.H.;Kim, J.H.;Kim, N.H.;Kim, J.H.
    • Proceedings of the KSME Conference
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    • 2000.04b
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    • pp.1-6
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    • 2000
  • In this study, We evaluated the Performance of PFC and the system performance of large size air-conditioner applying to outdoor condenser. PFC can meet the same cooling capacity in 40.42% of volume to fin-tube condenser. Although the fin-tube condenser requires 3600g of refrigerant charging, PFC requires 1700g, 1800g, 1900g, 2000g refrigerant charging for each 2.0mm, 2.5mm, 3.0mm and 3.5mm fin pitches. Difference of condensing and evaporation pressure is the biggest point 2.0mm fin pitch and the smallest point 2.5mm fin pitch.

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Experimental Study on Cooling Performance of A/C applied Fin-tube and PF Heat Exchangers (핀-관, 평행류 열교환기를 적용한 공조기의 냉방성능 실험연구)

  • Kwon, Young-Chul;Park, Yoon-Chang;Kwon, Jeong-Tae;Park, Gyung-Man
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.10 no.8
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    • pp.1789-1794
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    • 2009
  • In the present study, the cooling performance characteristics on environment changes of A/C applied fin-tube and PF heat exchangers were experimentally investigated. Capacity and COP on an air velocity, an indoor/outdoor temperature and an indoor/outdoor relative humidity were obtained. Fin types of PF heat exchanger were a triangler and squarer form. The experimental data for the three kinds of heat exchangers were measured using the air-enthalpy calorimeter. Performance of PF A/C was more excellent than that of a fin-tube A/C. Also, the performance of PF-2 A/C with the squarer fin was more excellent than that of PF-1 A/C with the triangler fin. As the air velocity, the indoor temperature and the indoor relative humidity increase, capacity and COP increase. And as outdoor temperature increases, capacity and COP decrease. But, the performance change on the outdoor relative humidity was insignificant.

Development of a Plate-Fin Type Gas Turbine Recuperator

  • Kwak Jae-Su;Yang In-Young
    • Journal of Mechanical Science and Technology
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    • v.20 no.7
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    • pp.1068-1076
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    • 2006
  • A plate-fin type recuperator for a gas turbine/fuel cell hybrid power generation system was designed, manufactured, and tested. Performance analysis shows that the performance of the system is directly affected by the performance of the recuperator. Therefore, the recuperator should be designed and manufactured carefully, and its performance should be tested and verified before it is integrated into the system. In this paper, the developing procedure including designing, manufacturing, and testing of a cross flow plate-fin type recuperator was presented. Performance test results showed that the design requirements of the recuperator were almost satisfied. Based on the test results, improved design to reduce the size of the recuperator was suggested.

Trend and issues of the bulk FinFET (벌크 FinFET의 기술 동향 및 이슈)

  • Lee, Jong-Ho;Choi, Kyu-Bong
    • Vacuum Magazine
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    • v.3 no.1
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    • pp.16-21
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    • 2016
  • FinFETs are able to be scaled down to 22 nm and beyond while suppressing effectively short channel effect, and have superior performance compared to 2-dimensional (2-D) MOSFETs. Bulk FinFETs are built on bulk Si wafers which have less defect density and lower cost than SOI(Silicon-On-Insulator) wafers. In contrast to SOI FinFETs, bulk FinFETs have no floating body effect and better heat transfer rate to the substrate while keeping nearly the same scalability. The bulk FinFET has been developed at 14 nm technology node, and applied in mass production of AP and CPU since 2015. In the development of the bulk FinFETs at 10 nm and beyond, self-heating effects (SHE) is becoming important. Accurate control of device geometry and threshold voltage between devices is also important. The random telegraph noise (RTN) would be problematic in scaled FinFET which has narrow fin width and small fin height.

OPTIMUM PERFORMANCE AND DESIGN OF A RECTANGULAR FIN

  • Kang, H.S.
    • International Journal of Automotive Technology
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    • v.8 no.6
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    • pp.705-711
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    • 2007
  • A rectangular fin with a fluid in the inside wall is analyzed and optimized using a two-dimensional analytical method. The influence of the fluid convection characteristic number in the inside wall and the fin base thickness on the fin base temperature is listed. For the fixed fin volumes, the maximum heat loss and the corresponding optimum fin effectiveness and dimensions as a function of the fin base thickness, convection characteristic numbers ratio, convection characteristic number over the fin, fluid convection characteristic number in the inside wall, and the fin volume are represented. One of the results shows that both the optimum heat loss and the corresponding fin effectiveness increase as the fin base thickness decreases.