• 제목/요약/키워드: FETs

검색결과 222건 처리시간 0.026초

SWCNT 다중채널 FET용 표면 프로그램된 APTES와 OTS 패턴을 이용한 공정에 대한 연구 (Programmed APTES and OTS Patterns for the Multi-Channel FET of Single-Walled Carbon Nanotubes)

  • 김병철;김주연;안호명
    • 한국정보전자통신기술학회논문지
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    • 제8권1호
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    • pp.37-44
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    • 2015
  • 본 논문에서 전계효과 트랜지스터 (field effect transistor; FET) 제작을 위한 표면 프로그램된 aminopropylethoxysilane(APTES)와 1-octadecyltrichlorosilane(OTS) 패턴을 이용하여 단일벽 탄소 나노튜브(single-walled carbon nanotube; SWCNT)를 실리콘 기판 위에 선택적으로 흡착시키는 공정방법을 제안하였다. 양성 표면 분자 패턴을 만들기 위해 형성된 APTES 패턴은 많은 양의 SWCNT의 흡착을 위해 제작되었고, OTS 만을 이용한 공정보다 효과적인 SWCNT 흡착이 가능하다. 산화막(silicon dioxide)이 형성된 실리콘 기판 위에 사진공정(photolithography process)을 이용하여 임의의 감광액(photoresist; PR) 패턴이 형성되었다. PR 패턴이 형성된 기판은 헥산 용매를 이용하여 1:500 (v/v)로 희석된 OTS 용액 속에 담가진다. OTS 박막이 표면 전체에 만들어지고, PR 패턴이 제거되는 과정에서 PR 위에 형성되었던 OTS 박막도 같이 제거되어, 선택적으로 형성된 OTS 박막 패턴을 얻을 수 있다. 이 기판은 다시 에탄올 용매를 이용하여 희석된 APTES 용액 속에 담가진다. APTES 박막은 OTS 박막 패턴이 없는 노출된 산화막 위에 형성된다. 마지막으로 이처럼 APTES와 OTS에 의해 표면 프로그램된 기판은 SWCNT가 분산된 다이클로로벤젠(dichlorobenzene) 용액 속에 담가진다. 결과적으로 SWCNT는 양 극성을 띠는(positive charged) APTES 박막 패턴 위에만 흡착된다. 반면 중성O TS 박막 패턴 위에는흡착되지 않는다. 이러한 표면 프로그램 방법을 사용하여 SWCNT는 원하는 영역에 자기 조립시킬 수 있다. 우리는 이 방법을 이용하여 소오스와 드레인 전극사이에 SWCNT가 멀티 채널로 구성된 다중채널 FET를 성공적으로 제작하였다.

DIRECT PROBING OF CARRIER MOTION IN ORGANIC FIELD EFFECT TRANSISTOR BY OPTICAL SECOND HARMONIC GENERATION

  • Iwamoto, Mitsumasa;Manaka, Takaaki;Lim, Eun-Ju
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.1561-1563
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    • 2008
  • We report an optical second harmonic generation measurement that allows direct probing of dynamical carrier motion in organic field effect transistors. Carrier injection and transport process are discriminated. The mobility and contact resistance of pentacene FETs are determined from the visualized diffusion-like carrier motion.

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고스트 신호 제거기용 애널러그 위상변위기 설계 (Design of the analog phase shifter for the ghost signal elimination)

  • 주성호;김동현;이상설
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1999년도 추계종합학술대회 논문집
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    • pp.825-828
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    • 1999
  • In this paper, we design the analog phase shifter for the elimination of the ghost signal. Compensation of the delay between the reference signal and the relatively delayed signal is possible. This phase shifter uses the vector summing method. We use for the attenuator in our system FETs. The phase shifter is operated at the 200MHz and composed by lumped elements. The proposed analog phase shifter is simulated by the HP ADS software.

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Application of the EKV model to the DTMOS SOI transistor

  • Colinge, Jean-Pierre;Park, Jong-Tae
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제3권4호
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    • pp.223-226
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    • 2003
  • The EKV model, a continuous model for the MOS transistor, has been adapted to both partially depleted SOI MOSFETs with grounded body (GBSOI) and dynamic threshold MOS (DTMOS) transistors. Adaptation is straightforward and helps to understand the physics of the DTMOS. Excellent agreement is found between the model and the measured characteristics of GBSOI and DTMOS devices

FinFET for Terabit Era

  • Choi, Yang-Kyu
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제4권1호
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    • pp.1-11
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    • 2004
  • A FinFET, a novel double-gate device structure is capable of scaling well into the nanoelectronics regime. High-performance CMOS FinFETs , fully depleted silicon-on-insulator (FDSOI) devices have been demonstrated down to 15 nm gate length and are relatively simple to fabricate, which can be scaled to gate length below 10 nm. In this paper, some of the key elements of these technologies are described including sub-lithographic pattering technology, raised source/drain for low series resistance, gate work-function engineering for threshold voltage adjustment as well as metal gate technology, channel roughness on carrier mobility, crystal orientation effect, reliability issues, process variation effects, and device scaling limit.

반데르발스 2차원 반도체소자의 응용과 이슈 (Trend and Issues of van der Waals 2D Semiconductor Devices)

  • 임성일
    • 진공이야기
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    • 제5권2호
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    • pp.18-22
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    • 2018
  • wo dimensional (2D) van der Waals (vdW) nanosheet semiconductors have recently attracted much attention from researchers because of their potentials as active device materials toward future nano-electronics and -optoelectronics. This review mainly focuses on the features and applications of state-of-the-art vdW 2D material devices which use transition metal dichalcogenides, graphene, hexagonal boron nitride (h-BN), and black phosphorous: field effect transistors (FETs), complementary metal oxide semiconductor (CMOS) inverters, Schottky diode, and PN diode. In a closing remark, important remaining issues of 2D vdW devices are also introduced as requests for future electronics and photonics applications.

Non-Quasi-Static RF Model for SOI FinFET and Its Verification

  • Kang, In-Man
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제10권2호
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    • pp.160-164
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    • 2010
  • The radio frequency (RF) model of SOI FinFETs with gate length of 40 nm is verified by using a 3-dimensional (3-D) device simulator. This paper shows the equivalent circuit model which can be used in the circuit analysis simulator. The RMS modeling error of Y-parameter was calculated to be only 0.3 %.

Development of Airborne High Density High Voltage Power Supply for Traveling Wave Tubes

  • Park Young-Ju
    • Journal of Power Electronics
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    • 제5권4호
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    • pp.257-263
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    • 2005
  • This paper describes the development and testing results of a high density High Voltage Power Supply (HVPS) that drives microwave Traveling Wave Tubes (TWTs) of phased array transmitters for airborne EW systems. The HVPS is designed to consist of a number of modules connected in series. Among them, especially, the high-density pulse transformer module including the resonant circuit is newly designed to make the HVPS much more reliable. In addition, this paper describes the development of high voltage solid-state modulation using fast switching devices (FETs) and also represents the test results of a modulator module.

무전해 식각법으로 합성한 Si 나노와이어 Field Effect Transistor 유연소자의 특성 (Electrical Properties of Flexible Field Effect Transistor Devices Composed of Si Nanowire by Electroless Etching Method)

  • 이상훈;문경주;황성환;이태일;명재민
    • 한국재료학회지
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    • 제21권2호
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    • pp.115-119
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    • 2011
  • Si Nanowire (NW) field effect transistors (FETs) were fabricated on hard Si and flexible polyimide (PI) substrates, and their electrical characteristics were compared. Si NWs used as channels were synthesized by electroless etching method at low temperature, and these NWs were refined using a centrifugation method to get the NWs to have an optimal diameter and length for FETs. The gate insulator was poly(4-vinylphenol) (PVP), prepared using a spin-coating method on the PI substrate. Gold was used as electrodes whose gap was 8 ${\mu}m$. These gold electrodes were deposited using a thermal evaporator. Current-voltage (I-V) characteristics of the device were measured using a semiconductor analyzer, HP-4145B. The electrical properties of the device were characterized through hole mobility, $I_{on}/I_{off}$ ratio and threshold voltage. The results showed that the electrical properties of the TFTs on PVP were similar to those of TFTs on $SiO_2$. The bending durability of SiNWs TFTs on PI substrate was also studied with increasing bending times. The results showed that the electrical properties were maintained until the sample was folded about 500 times. But, after more than 1000 bending tests, drain current showed a rapid decrease due to the defects caused by the roughness of the surface of the Si NWs and mismatches of the Si NWs with electrodes.

마이크로미터 크기의 유기 전계 효과 트랜지스터 제작 (Fabrication of Micron-sized Organic Field Effect Transistors)

  • 박성찬;허정환;김규태;하정숙
    • 한국진공학회지
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    • 제20권1호
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    • pp.63-69
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    • 2011
  • 본 연구에서는 기존 실리콘 반도체 기술 기반의 포토 및 이빔 리소그래피 공정을 통하여 유기 반도체 소자를 패터닝하였다. P3HT나 PEDOT 등의 유기 반도체는 용매에 녹기 때문에 MIMIC (micro-molding in capillaries)이나 inkjet printing 기술을 이용하여 마이크로미터 크기의 소자 제작이 가능하였으나, 펜타신은 용매에 녹지 않기 때문에 매우 복잡한 방법으로 마이크로미터 크기의 소자를 제작하여왔다. 그러나, 본 연구에서는 원자층 증착 방법으로 증착한 산화 알루미늄막을 펜타신의 보호층으로 이용하여 기존의 포토 및 이빔 리소그래피 방법으로 마이크로미터크기의 펜타신 소자를 제작하였으며 그 전기 특성을 확인하였다.