• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Journal of Dental Rehabilitation and Applied Science
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• v.19 no.1
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• pp.7-15
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• 2003

This study used FEM(Finite Element method) based on micro-CT images to see the effects of occlusal force distribution with varying bone density and structure. the mandibular premolar region from human cadaver, thickness of 10mm was imaged using micro-CT. the cross sectional images were taken every $10{\mu}m$. these were reconstructed and the longitudinal image at the mid point of mesiodistal of the speciman was obtained for the specimen for the FEM. The stress disribution produced by a vertical force at 100N and 100N horizontal were analyzed by MSC Nastran FEM Package. according to the result of this study the occlusal force distribution depends on the structure of cancellus bone and for further information on the occlusal force distribution on the tooth and the surrounding structure requires further studies on cancellus bone structure. CEJ of all model show the highest peak and region whice meet teeth and bone show second high peak. Original model and cortical bone add model show different stress distribution. Stress distribution changed according to bone structures and densities.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.7A
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• pp.563-568
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106${\mu}{\textrm}{m}$ thick LTCC layers and its size is 5.24mm x 4.3mm x 0.53 mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200MHz, insertion loss of 2.326dB and return loss of 13.679dB. In addition, the attenuation is 28.052dB at 4.7GHz.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.8A
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• pp.607-612
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106$\mu\textrm{m}$ thick LTCC layers and its size is 5.24mm ${\times}$ 4.3mm${\times}$ 0.53mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200㎒, insertion loss of 2.326㏈ and return loss of 13.679㏈. In addition, the attenuation is 28.052㏈ at 4.7GHz.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• International Journal of Korean Welding Society
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• v.5 no.1
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• pp.60-65
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• 2005

In the field of welding the mechanical behavior of a welded structure under consideration may be predicted via heat transfer and welding residual stress analysis. Usually such numerical analyses are limited to small regular mesh models or test specimens. Nevertheless, there is very few strength assessment of the whole structure that includes the effect of welded residual stress. The present work is based on the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress including the external load on the welded RHS (Rectangular Hollow Section) T-joint connections of the whole structure. First the thermal history of the combined fillet and butt-welded T-joint equal width cold-formed RHS are calculated using nonlinear finite element analysis (FEA) considering the quarter model of the joint. Then using this thermal history the residual stress around the joints has been evaluated. To validity the FEA result, the calculated residual stresses were compared with the available experimental results. The residual stress obtained from the quarter model is mapped to the full model and then to the whole structure model using FEM codes. The results from the FEM codes were exported to the commercial package for visualization and further analysis applying loads and boundary conditions on the whole structure. The residual stress redistribution along with the external applied load is examined computationally.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.1
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• pp.29-35
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• 2015

In this study, a FEM analysis is undertaken of a rubber sleeve which is mounted onto a spreading mandrel so as to avoid marking the first wrappings of coils (known as the 'end-mark'), as occasionally occurs when a concentrated load is placed on the edge of a steel sheet, significantly reducing its quality. A commercial numerical package, ANSYS, was utilized to analyze the structural behavior of the rubber sleeve. In general, the strain of the sleeve increases as the thickness of the rubber layer (H) covering the tubes increases, thus also increasing the surface of the sleeve for a constant boundary condition, and decreasing the pitch (P) between each tube, resulting in an increase in the strain on the surface of the sleeve for all rubber thickness conditions tested here. In a comparison of two different materials, rubber and urethane, when H=3 mm and P=1.1D, the maximum total deformations in these cases are 0.12669 mm and 0.086623 mm, respectively.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.230-235
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• 2000

The extrusion process for long-length multi-filaments of BSCCO 2223 superconductor tape has been investigated with aids of Finite Element Method and experimental inspection. Since the arrangement of filaments in matrix material has characteristic of rotational symmetry, a 2-dimensional commercial FEM package, DEFORM-2D, was adopted to simulate extrusion process with different variables such as hardness of sheath material, lengths of each filament and arrangement. From the FEM analysis, since the inner filaments move faster than the outer one, distribution of filaments is needed to be optimized. In the case of pure Ag matrix, undesirable non-uniform distribution of filament was obtained due to low hardness of sheath material. Dummy sample(brass (sheath) and talc powder(filament)), however, which has relatively high hardness of sheath material, had been produced with desirable results. Therefore, it is necessary to optimize hardness of sheath material, extrusion temperature and billet design.

• Journal of the Society of Naval Architects of Korea
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• v.48 no.4
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• pp.368-374
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• 2011

Recently, the ship vibration analysis technique has been well set up by using FEM. The methods considering the hydrodynamic added mass and damping of the fluid surrounding a floating ship have been well developed, so that they can be calculated by using the commercial package FEM programs such as MSC/NASTRAN, ADINA and ANSYS. Especially, MSC/NASTRAN has the functions to consider the fluid in tanks(MFLUID) and to solve the Fluid-Structure Interaction(FSI) problem(DMAP). In this study, the global ship vibration with considering the added mass distributed at the grid points on the wetted shell surface is introduced to. In the new method, the velocity potentials of the fluid surrounding a floating ship are calculated by solving the Lapalce equation using the Boundary Element Method(BEM), and the point mass is obtained by integrating the potentials at the points. Then, the global vibration analyses of the ship structure with distributed added mass on the wetted surface are carried out for an oil/chemical tanker. During the future sea trial, the results will be confirmed by measurement.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.220-226
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• 2005

To achieve the weight reduction of a vehicle, Magnesium alloys are widely used in automobile parts because of its lightweight characteristics. Magnesium alloys also have advantages in recycling, stiffness, NVH , heat protection. But Magnesium alloy parts are mainly manufactured by diecasting processes, their productivity was not so high compared to by sheet metal working. We are developing vehicle hood using magnesium sheets. In this study we designed magnesium alloy hood which have equivalent mechanical characteristics to steel hood. Using finite element method we decided thickness of magnesium sheets under some design requirements and we changed the shape of hood inner panel and hinge reinforcements. Outer and inner panel thickness was 1.3mm, 1.5mm respectively. Panel dentibility analysis was performed to conform the new magnesium design by nonlinear FEM package. Formability and hemming of Magnesium sheets are the subjects for further study because they have poor stretchability compared to steel sheets.