• Title/Summary/Keyword: FEM package

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Analytical Study on the Effect of Forming Process on Springback of an Automobile Rear Frame (성형법에 따른 자동차 리어 프레임의 스프링백 해석대비)

  • Song Y. J.;Jung H. S.;Hahn Y. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2001.05a
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    • pp.63-67
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    • 2001
  • Springback after drawing and trimming is regarded as one of the most influential factors during forming structural frames since the part dimensions have dominant effect on assembly quality at later stages. In this study, analytical results were obtained from a commercial FEM package for an outer rear frame of an automobile. In terms of springback and twist the effect of forming process is compared and discussed between open and closed-ends forming

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Effect by Change of Geometries and Material Properties for Flip-Chip (플립 칩의 기하학적 형상과 구성재료의 변화에 따른 효과)

  • Kwon, Yong-Su;Choi, Sung-Ryul
    • Journal of the Korean Society of Industry Convergence
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    • v.3 no.1
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    • pp.69-75
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    • 2000
  • Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

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Numerical analysis of Brazilian split test on concrete cylinder

  • Wosatko, Adam;Winnicki, Andrzej;Pamin, Jerzy
    • Computers and Concrete
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    • v.8 no.3
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    • pp.243-278
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    • 2011
  • The paper presents simulations of the Brazilian test using two numerical models. Both models are regularized in order to obtain results independent of discretization. The first one, called gradient damage, is refined by additional averaging equation which contains gradient terms and an internal length scale as localization limiter. In the second one, called viscoplastic consistency model, the yield function depends on the viscoplastic strain rate. In this model regularization properties are governed by the assumed strain rate. The two models are implemented in the FEAP finite element package and compared in this paper. Parameter studies of the split test are performed in order to point out the features of each model.

Process Simulation of Investment Casting for Large Gas Turbine Component (대형 가스터빈 부품의 정밀주조 응고해석)

  • Seo, Seong-Mun;Jo, Chang-Yong;Lee, Jae-Hyeon;Choe, Seung-Ju
    • 연구논문집
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    • s.29
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    • pp.173-183
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    • 1999
  • The vacuum investment casting process for a large gas turbine component, Inner Preswirl Support (IPS), was simulated by using commercial FEM package ProCAST(TM) with view factor radiation method. The solid fraction in mushy zone was directly measured by Differential thermal analysis(DTA-DSC mode). Three types gating design. considering liquid flow and heat release through it. were proposed. Solidification had begun at the ribs or thin sections of the IPS casting and advanced further through the upper and lower gates. The computed temperature gradient G and G/R values at 70% solidified temperature were used for prediction of microshrinkage formation during casting. The effect of mold preheat on the thermal history of the casting displayed minute effect on the microshrinkage formation.

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Die Design of Hot Extrusion for Hexagonal Insert (Hexagonal 인서트용 열간압출 금형설계)

  • 권혁홍;이정로
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.1
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    • pp.32-37
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    • 2002
  • The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

Design of Hot Extrusion Dies for Hexagonal Insert (Hexagonal 인서트용 열간압출 금형설계)

  • 권혁홍;이정로
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2001.04a
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    • pp.72-77
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    • 2001
  • The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

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A Study on the Vibration Characteristics of Weaving Machine Structure using Component Mode Synthesis (부분구조합성법을 이용한 제직기 구조물의 진도특성에 관한 연구)

  • 권상석;김병옥;전두환
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2001.05a
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    • pp.535-539
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    • 2001
  • In these days. the finite element method(FEM) is a very common method for not only a simple vibration analysis but also the optimization of structures. Since the finite element model may contain thousands of degree of freedom, the eigensolutions require extreme computing power, which will result in a serious time-consuming problem. Thus, many researchers have challenged to find more improved modeling techniques and calculating methods to overcome such problems. The Guyan reduction method and the substructure synthesis method are typical examples of such methods. Of the substructure synthesis method, the component mode synthesis method (CMS) is widely used for dynamic analysis of structure. In this study. for the efficient analysis of jet loom structure. Component Mode Synthesis was carried out. The results of the finite element program developed are compared with those of the commercial package program ANSYS for the validation of the program. The results obtained by the program showed a good agreement with those of ANSYS. The program will be further refined and verified by test to yield more accurate results.

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Low cost high-Q veritcal inductor using bondwires for plastic-packaged MMICs (플라스틱 패키지되는 MMIC를 위한 저가격 고품질의 수직형 본딩와이어 인덕터)

  • 이용구;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.7
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    • pp.17-24
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    • 1998
  • We proposed a novel bondwire inductor buried in plastic package for low cost MMIC and characaterized the electrical perofmrance in a wide frequency range using the full-wave analysis of finite element method(FEM), and then we fabricated and measured the scale-up model in order to prove the characteristics. Th ebondwire inductor has higher quality factor and higher cutoff frequency than the conventional spiral inductor designed n the same area as the bondwire inductor. Since the air-bridge process is not requried for the bondwire inductor, it is very suitable for low cost plastic-packaged MMIC production. The bondwire inductor has the field distribution localized around the bondwire inductor and hence is more compatible to the crosstalk problems.

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The Analytical Model for the Reinforcement Bar Connection in Grout-Filled Steel Pipe Sleeve (모르터 충전 강관 슬리브를 이용한 철근 이음의 해석 모델)

  • 황재호;이용재;이원호;이리형
    • Proceedings of the Korea Concrete Institute Conference
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    • 1997.10a
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    • pp.519-526
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    • 1997
  • The purpose of this study is to develop the analytical model for the reinforcement bar connection in group-filled steel pipe sleeve, which consists of beam elements for the reinforcement bar and shell elements for the sleeve and the mortar and spring elements for the bond stress-slip relationship. In the reinforcement bar connection using grout-filled steel pipe sleeve, the major variables are the bond stiffness between reinforcement bar and mortar($K_1$) and between sleeve and mortar($K_2$). It is nearly difficult to predict the exact bond stiffness with the experimental results. Therefore, The linearly elastic analyses using ABAQUS, FEM package show the validity of the mathematical equations for the bond stiffness and the choice of material elements in this paper. To predict the behaviour between yield and ultimate tensile strength, the nonlinear analyses must be performed henceforth.

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The Modeling Aging Analysis due to Finite Eliment Method on Epoxy-Mica Composites (에폭시-마이카 복합재료의 FEM에 의한 MODELING 열화 해석)

  • Kim, Hee-Gon;Hyun, Jung-Seob;Kim, Hee-Dong;Jo, Han-Gu
    • Proceedings of the KIEE Conference
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    • 1996.07c
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    • pp.1710-1712
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    • 1996
  • This paper was practiced insulation failure test forcing to accelerate on frequency of 420 HZ. There was manufactured generator stator windings for 500MVA thermal plants and selected accelerating deterioration voltage of 5.5kV/mm for electrical aging. Moreover, so as to verification of this experiments, we carried out modeling analysis due to finite element method using to ANSYS5.0 program for common package and imitated multi-stress aging for analyzing electrical and mechanical stress distribution.

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