• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.5
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• pp.332-337
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• 2015

We have studied the effects of Ag on the characteristics of $Sn_{60}Pb_{40}Ag_x$ (wt%) solder for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of $Ag_3Sn$ after reacting with some part of Sn atoms, while they did not react with Pb atoms, but decreased the mean size of Pb solid phase. The enhancement of peel strength between solar cell and ribbon is an important part in the developments of long-lifespan solar module. The peel strength of the solder ribbon of $Sn_{60}Pb_{40}$ (wt%) was $169N/mm^2$, and it was largely enhanced by adding a small amount of Ag atoms. The maximum peel strength was $295N/mm^2$ in the solder ribbon of $Sn_{60}Pb_{40}Ag_2$ (wt%). This result is caused by the high binding energy of 162.9 kJ/mol between Ag atoms in the solder and Ag atoms in Ag sheet.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.188-192
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• 2007

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.171-177
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• 2001

The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.207-212
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• 2005

Al, Ti, Ta, and Cr thin films were deposited on a polyimide substrate using DC magnetron sputter to study the adhesion characteristics of metal films on polyimide substrates, while RF bias of 0 - 400 W was applied to the substrate during DC sputtering. The adhesion strength was evaluated using a 90-degree peel test. The peel tests showed that the adhesion strength was enhanced by applying the RF bias to the substrate in all specimens. Scanning electron microscopy and Auger depth profile of the fractured surfaces indicate that the polyimide underwent cohesive failure during peeling and heavy deformation was also observed in the metal films peeled from the polyimide substrate when the RF bias applied during the deposition. Cross-sectional transmission electron microscopy revealed that the metal/polyimide interface was not clear and complicated. This complicated interface, likely formed due to the RF bias applied to the substrate, was attributed to the adhesion enhancement observed during the bias sputtering.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.119-125
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• 2017

We have studied the effects of Ag on the characteristics of $Sn_{43}Bi_{57}Ag_x$(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic $Sn_{43}Bi_{57}$(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic $Sn_{43}Bi_{57}$(wt%) solder showed a low melting temperature of $138.9^{\circ}C$, and showed a very similar result regardless of the added amount of Ag atoms.

• Journal of Adhesion and Interface
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• v.8 no.3
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• pp.1-8
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• 2007

An atmospheric plasma pre-treatment method was applied to polyurethane foam to improve its contact angle and adhesion. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen, argon, oxygen, air), rate of gas flow (30~150 mL/min), and reaction time (0~30 sec) were examined in a plate plasma reactor. Also, the effects were compared to those of a conventional vacuum plasma pre-treatment system. The result of the surface modification with respect to the treatment procedure was characterized by using SEM and ATR-FTIR. Due to a decrease of the contact angle of polyurethane foam, the greatest adhesion strength was achieved at a flow rate of 100 mL/min and at a reaction time of 10s for N2 gas. Consequently, the atmospheric plasma treatment reduced the contact angle of the polyurethane foam and also resulted in the improvement of the peel strength.

• Journal of Adhesion and Interface
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• v.8 no.4
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• pp.23-31
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• 2007

An atmospheric plasma pre-treatment method was applied to EVA foam, Leather (Action), Rubber and Unwoven to improve its contact angle and adhesion using atmospheric plate type reactor. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen), rate of gas flow (30~100 mL/min), and reaction time (0~30 sec) were examined in a plate plasma reactor. The result of the surface modification with respect to the treatment procedure was characterized by using SEM. Due to a decrease of the contact angle of various materials, the greatest adhesion strength was achieved at optimum condition such as flow rate of 100 mL/min, reaction time of 10 second for an atmosphere nitrogen gas. Consequently, the atmospheric plasma treatment reduced the contact angle of the EVA foam, Leather (Action) and Rubber also resulted in the improvement of the adhesion.

• Journal of Adhesion and Interface
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• v.10 no.3
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• pp.148-153
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• 2009

An atmospheric plasma pre-treatment method was applied to PU foam, Leather (Action), Rubber to improve its adhesion using solvent and water soluble type pressure sensitive adhesion in atmospheric plate type reactor. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen), rate of gas flow (30~100 mL/min), and reaction time (0~30 s) were examined in a plate plasma reactor. The result of the surface modification with respect to the treatment procedure was characterized by using SEM. Due to a de-crease of the contact angle of various materials, the greatest adhesion strength was achieved at optimum condition such as flow rate of 100 mL/min, reaction time of 10 second for an atmospheric plasma treatment of the PU foam, EVA foam, Leather (Action) and Rubber also resulted in the improvement of the adhesion.

• Journal of Adhesion and Interface
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• v.12 no.4
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• pp.125-132
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• 2011

As the enhancement of indoor air quality is increasingly compelling the use of natural materials without any emission, this study reports the preparation and performance of natural garlic adhesives for wallpaper. The natural garlic adhesives were successfully prepared by the extraction of the clove of raw garlic with water to isolate carbohydrates and proteins. Properties of the prepared garlic adhesives such as the non volatile solids content, viscosity, density, and pH were 62%, 2,789 mPa.s, $1.3g/cm^3$, and 6.6, respectively. The non-volatile solids content has a great impact on the adhesion performance of the prepared garlic adhesives, which was adequate about 60%. Bonding strength of prepared garlic adhesives was greater than the requirement of a Korean standard for wallpaper. In addition, the garlic adhesives showed antibacterial activity inheriting from the garlic. It is expected that the prepared garlic adhesives could be used as safe and natural adhesives without emitting any volatile organic compounds and formaldehyde gas.

• Elastomers and Composites
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• v.44 no.4
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• pp.429-435
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• 2009

The pressure sensitive adhesives (PSA) were synthesized by soap-free emulsion polymerization of acrylic monomers such as butyl acrylate, 2-ethyl hexyl acrylate, and acrylic acid in the presence of starch as a protective colloid and copolymer. The peel strength and holding power of PSA were increased with starch contents due to the enhancement of gel content, But the initial tackiness of PSA was decreased with starch contents. The contact angle analysis of PSA indicated that the wettability was increased with starch contents owing to the increase of polarity by hydroxy group in starch. In the pH measurement of emulsion with time for biodegradability, the starch in the PSA accelerated the lowering of pH due to the formation of organic acids followed by decomposition of starch.