Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Effects of Ag on the Characteristics of Sn-Pb-Ag Solder for Photovoltaic Ribbon

태양광 리본용 Sn-Pb-Ag 솔더의 특성에 미치는 Ag의 영향

  • Son, Yeon-Su (Department of Nano Materials Engineering, Kyungpook National University) ;
  • Cho, Tae-Sik (Department of Nano Materials Engineering, Kyungpook National University)
  • 손연수 (경북대학교 과학기술대학 나노소재공학부 신소재공학전공) ;
  • 조태식 (경북대학교 과학기술대학 나노소재공학부 신소재공학전공)
  • Received : 2015.03.21
  • Accepted : 2015.04.07
  • Published : 2015.05.01
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Abstract

We have studied the effects of Ag on the characteristics of $Sn_{60}Pb_{40}Ag_x$ (wt%) solder for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of $Ag_3Sn$ after reacting with some part of Sn atoms, while they did not react with Pb atoms, but decreased the mean size of Pb solid phase. The enhancement of peel strength between solar cell and ribbon is an important part in the developments of long-lifespan solar module. The peel strength of the solder ribbon of $Sn_{60}Pb_{40}$ (wt%) was $169N/mm^2$, and it was largely enhanced by adding a small amount of Ag atoms. The maximum peel strength was $295N/mm^2$ in the solder ribbon of $Sn_{60}Pb_{40}Ag_2$ (wt%). This result is caused by the high binding energy of 162.9 kJ/mol between Ag atoms in the solder and Ag atoms in Ag sheet.

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References

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