DOI QR코드

DOI QR Code

Effects of Ag on the Characteristics of Sn43Bi57Agx(wt%) Lead-free Solder for Photovoltaic Ribbon

태양광 리본용 Sn43Bi57Agx(wt%) 무연 솔더의 특성에 미치는 Ag의 영향

  • Jeong, Joo-Hyeon (Department of Nano Materials Engineering, Kyungpook National University) ;
  • Cho, Tae-Sik (Department of Nano Materials Engineering, Kyungpook National University)
  • 정주현 (경북대학교 과학기술대학 나노소재공학부 신소재공학전공) ;
  • 조태식 (경북대학교 과학기술대학 나노소재공학부 신소재공학전공)
  • Received : 2016.09.27
  • Accepted : 2017.01.09
  • Published : 2017.02.01

Abstract

We have studied the effects of Ag on the characteristics of $Sn_{43}Bi_{57}Ag_x$(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic $Sn_{43}Bi_{57}$(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic $Sn_{43}Bi_{57}$(wt%) solder showed a low melting temperature of $138.9^{\circ}C$, and showed a very similar result regardless of the added amount of Ag atoms.

Keywords

References

  1. J. M. Pearce, Futures, 34, 663 (2002). [DOI: https://doi.org/10.1016/S0016-3287(02)00008-3]
  2. A. Rose, Physica Status Solidi. A, 56, 11 (1979). [DOI: https://doi.org/10.1002/pssa.2210560102]
  3. R. Lathrop and K. Pfluke, Published in the Proceedings of the 26th European Union Photovoltaic Solar Energy Conf., 5 (2011).
  4. T. S. Cho, C. S. Cho, and M. S. Chae, Trans. Electr. Electron. Mater., 15, 217 (2014). [DOI: https://doi.org/10.4313/TEEM.2014.15.4.217]
  5. T. S. Cho and C. S. Cho, Trans. Electr. Electron. Mater., 16, 20 (2015). [DOI: https://doi.org/10.4313/TEEM.2015.16.1.20]
  6. J. S. Jeong, N. Park, and C. Han, Microelectronics Reliability, 52, 2326 (2012). [DOI: https://doi.org/10.1016/j.microrel.2012.06.027]
  7. M. A. Quintana, D. L. King, T. J. McMahon, and C. R. Osterwald, Photovoltaic Specialists Conf., 1436 (2002).
  8. J. Wendt, M. Trager, R. Klengel, M. Petzold, D. Schade, and R. Sykes, 12th IEEE Intersociety Conf., 1 (2010).
  9. M. Schaefer, R. A. Fournelle, and J. Liang, J. of Electronic Materials, 27, 1167 (1998). [DOI: https://doi.org/10.1007/s11664-998-0066-7]
  10. Y. S. Son and T. S. Cho, J. Korean Inst. Electr. Electron. Mater. Eng., 28, 332 (2015).
  11. S. Choi, T. R. Bieler, K. N. Subramanian, and J. P. Lucas, Soldering & Surface Mount Technology, 13, 26 (2001). [DOI: https://doi.org/10.1108/09540910110385220]
  12. W. B. Hampshire, Soldering & Surface Mount Technology, 5, 49 (1993). [DOI :https://doi.org/10.1108/eb037826]
  13. C. Y. Liu, C. Chan, and K. N. Tu, J. of Applied Physics, 88, 5703 (2000). [DOI: https://doi.org/10.1063/1.1319327]
  14. J. H. Lee, Y. H. Lee, and Y. S. Kim, Scripta Materialia, 42, 789 (2000). [DOI: https://doi.org/10.1016/S1359-6462(99)00431-5]
  15. I.K.A. Qader and Y. B. Zainuddin, Interdisciplinary J. of Contemporary Research in Business, 3, 366 (2011).
  16. J. S. Jeong, C. M. Oh, G. Y. Goo, Y. H. Yoon, U. H. Hwang, and W. S Hong, J. of the Korean Welding and Joining Soc., 29 (2011).
  17. Official J. of the European Union, 46, 19 (2003).
  18. J. F. Li, S. H. Mannan, M. P. Clode, D. C. Whalley, and D. A. Hutt, Acta Materialia, 54, 2907 (2006). [DOI: https://doi.org/10.1016/j.actamat.2006.02.030]
  19. J. W. Yoon, C. B. Lee, and S. B. Jung, Materials Transactions, 43, 1821 (2002). [DOI: https://doi.org/10.2320/matertrans.43.1821]
  20. J. Gong, C. Liu, P. P. Conway, and V. V. Silberschmidt, Mater. Sci. and Eng. A, 427, 60 (2006). [DOI: https://doi.org/10.1016/j.msea.2006.04.034]
  21. L. R. Garcia, W. R. Osorio, and A. Garcia, Materials and Design, 32, 3008 (2011). https://doi.org/10.1016/j.matdes.2010.12.046
  22. D. Q. Yu, C. M. L. Wu, C. M. T. Law, L. Wang, and J.K.L. Lai, J. of Alloys and Compounds, 392, 192 (2005). [DOI: https://doi.org/10.1016/j.matdes.2010.12.046]
  23. R. A. Islam, Y. C. Chan, W. Jillek, and S. Islam, Microelectronics Journal, 37, 705 (2006). [DOI: https://doi.org/10.1016/j.mejo.2005.12.010]
  24. L. R. Garcia, W. R. Osorio, L. C. Peixoto, A. Garcia, Materials Characterization, 61, 212 (2010). [DOI: https://doi.org/10.1016/j.matchar.2009.11.012]
  25. C. M. Chen and C. C. Huang, J. of Alloys and Compounds, 461, 235 (2008). [DOI: https://doi.org/10.1016/j.jallcom.2007.07.059]
  26. K. Suganuma, T. Sakai, K. S. Kim, Y. Takagi, J. Sugimoto, and M. Ueshima, IEEE Trans. on Electr. Pack. Manuf., 25, 257 (2003). [DOI: https://doi.org/10.1109/TEPM.2002.807718]