• Ceramist
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• v.15 no.1
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• pp.7-12
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• 2012

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.11
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• pp.1176-1183
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• 2003

In this paper, miniature voltage-controlled oscillator(VCO) for 1.6 ㎓ PCS band is designed and implemented using the LTCC technique. Circuit level design using commercial components is performed, and passive L, C elements embedded in LTCC substrate is optimized by simulation tools. Embedded passive components are modeled into equivalent circuits and their circuit parameters are extracted for circuit simulation. Utilizing the designed embedded passive elements and 21 layers LTCC substrate, VCO with 4.0${\times}$4.0${\times}$1.6 ㎣ dimensions is designed and fabricated. Developed VCO operates in 2.7 V with 8.5 ㎃ current consumption. The phase noise performance of VCO is below -112.61 ㏈c/㎐ at 100 ㎑ offset and harmonic suppression characteristics is measured above -30 ㏈.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.344-348
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• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.593-596
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• 2002

In this paper, the effect of device model parameter variation on three-dimensional embedded passive devices was investigated using statistical analysis. The optimized equivalent circuit models for several different structures were obtained from HSPICE simulation. The mean and the standard deviation of model parameters were extracted and the sensitivity analysis for each component was performed. From the analysis, the performance and parametric yield of the devices can be analyzed.

• Journal of Electrical Engineering and Technology
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• v.7 no.4
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• pp.582-588
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• 2012

In this paper, a highly miniaturized and performed UWB bandpass filter has been newly designed and implemented by embedding all the passive elements into a multi-layered PCB substrate with high dielectric $SrTiO_3$ composite film for 3.1 - 4.75 GHz compact UWB system applications. The high dielectric composite film was utilized to increase the capacitance densities and quality factors of capacitors embedded into the PCB. In order to reduce the size of the filter and avoid parasitic EM coupling between the embedded filter circuit elements, it was designed by using a $3^{rd}$ order Chebyshev circuit topology and a capacitive coupled transformation technology. Independent transmission zeros were also applied for improving the attenuation of the filter at the desired stopbands. The measured insertion and return losses in the passband were better than 1.68 and 12 dB, with a minimum value of 0.78 dB. The transmission zeros of the measured response were occurred at 2.2 and 5.15 GHz resulting in excellent suppressions of 31 and 20 dB at WLAN bands of 2.4 and 5.15 GHz, respectively. The size of the fabricated bandpass filter was $2.9{\times}2.8{\times}0.55(H)mm^3$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.313-313
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• 2008

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.269-281
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.61-71
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.02a
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• pp.87-117
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• 2006