Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2006.02a
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- Pages.87-117
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- 2006
A Review of Wafer-Level Embedded Passive Technology
- Ham Suk-Jin (Packanging Center Samsung Advanced Institute of Technology)
- 함석진 (삼성종합기술원)
- Published : 2006.02.01
Abstract
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