• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.183-183
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• 2010

3D Display type have software and hardware architecture in generally got low transmittance characteristics and high price product equipment. In this article, specified polarizer adopted MLA type structure have 3D display with hardware configuration and high transmission wide view angle. Method of screen printing type is adopted B/L system with simple structure.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.1117-1118
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• 2008

The LightScribe Technology is for printing images on the label side of recordable media using CD laser diode. By implementing Optimum Labeling Power Calibration for LightScribe, Labeling Quality can be improved. This paper proposes a new laser power calibration method using RFSUM signal. This function is implemented based on GH22LP20 of LG Electronics.

• 한국전기전자재료학회논문지
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• 제14권12호
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• pp.987-993
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• 2001

In this paper, we presents the construction details and output characteristics of a thick film piezoresistive strain gage. The thick film was printed on the ceramic diaphragm back side by screen printing and cured at 850$^{\circ}C$. The strain distribution and deflection on ceramic diaphragm were performed with finite-element method(FEM tool ANSYS-5.3). Various thick film strain gage characteristics were analysed, including nonlinearity, hysteresis, stability and sensitivity of thick film strain gages.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 추계학술대회 논문집 학회본부 C
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• pp.428-430
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• 2000

In this paper, the Flexible information display was implemented using AC powder electroluminescent device. ZnS:Cu and $BaTiO_3$ was used as a phosphor and dielectric respectively. The preparation of phosphor and dielectric layer was performed with screen printing. The implemented system of the Flexible information display was divided as following; EL display, driving circuit, software for driving. The properties of fabricated devices was measured with EL spectrum and brightness.

• Clinics in Shoulder and Elbow
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• 제27권1호
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• pp.72-78
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• 2024

Background: Clinical outcomes after fixation of distal humerus intraarticular fractures are directly related to the quality of reduction. The use of three-dimensional (3D)-printed fracture models can benefit preoperative planning to ensure good reduction. This review aims to determine if surgery performed with 3D printing assistance are faster and result in fewer complications and improved clinical outcomes than conventional methods. We also outline the benefits and drawbacks of this novel technique in surgical management of distal humerus fractures. Methods: A systematic literature search was carried out in various electronic databases. Search results were screened based on title and abstract. Data from eligible studies were extracted into spreadsheets. Meta-analysis was performed using appropriate computer software. Results: Three randomized controlled trials with 144 cases were included in the final analysis. The 3D-printed group had significantly shorter mean operating time (mean difference, 16.25 minutes; 95% confidence interval [CI], 12.74-19.76 minutes; P<0.001) and mean intraoperative blood loss (30.40 mL; 95% CI, 10.45-60.36 mL; P=0.005) compared with the conventional group. The 3D-printed group also tended to have fewer complications and a better likelihood of good or excellent outcomes as per the Mayo elbow performance score, but this did not reach statistical significance. Conclusions: Three-dimensional-printing-assisted surgery in distal humerus fractures has several benefits in reduced operating time and lower blood loss, indirectly decreasing other complications such as infection and anemia-related issues. Future good-quality studies are required to conclusively demonstrate the benefits of 3D printing in improving clinical outcomes.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.23-29
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• 2013

현재까지 유연한 전자소자 개발은 주로 인쇄전자 기술을 이용한 유기재료 기반 위주로 연구 및 개발이 진행되어 오고 있다. 그러나 유기 기반의 소자는 성능 및 신뢰성에 많은 제약이 있다. 따라서 본 논문에서는 무기재료 기반의 실리콘 고성능 유연 전자소자를 개발하기 위한 방법으로 나노 및 마이크로 두께의 단결정 실리콘 박막을 transfer printing 기술을 이용하여 유연기판에 전사하여 제작하였다. 제작된 유연소자는 굽힘 시험과 인장 시험을 통하여 유연 신뢰성을 평가하였다. PI 기판에 부착된 두께 200 nm의 박막은 굽힘 시험 결과, 곡률 반경 4.8 mm 까지 굽힐 수 있었으며, 따라서 굽힘 유연성이 매우 우수함을 알 수 있었다. 인장 시험 결과 인장 변형률 1.8%에서 박막이 파괴되었으며, 기존 실리콘 박막에 비하여 연신율이 최대 1% 증가됨을 알 수 있었다. FPCB 기판에 부착된 마이크로 두께의 실리콘 박막의 경우 칩이 얇아질수록 굽힘 유연성이 향상됨을 알 수 있었으며, $20{\mu}m$ 두께의 박막의 경우 곡률 반경 2.5 mm 까지 굽힐 수 있음을 알 수 있었다. 이러한 유연성의 증가는 실리콘 박막과 유연 기판 사이의 접착제의 완충작용 때문이다. 따라서 유연 전자소자의 유연성을 증가시키기 위해서는 박막 제작 시 공정 중의 결함을 최소화하고, 적절한 접착제를 사용한다면 유연성을 크게 증가시킬 수 있음을 알 수 있었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.95-96
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.759-760
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• 2008

• 한국전기전자재료학회논문지
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• 제25권3호
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• pp.236-240
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• 2012

Limiting thermal exposure time using rapid thermal processing(RTP) has emerged as promising simplified process for manufacturing of solar cell in a continuous way. This paper reports the simplification of co-firing using RTP. Actual temperature profile for co-firing after screen printing is a key issue for high-quality metal-semiconductor contact. The plateau time during the firing process were varied at $450^{\circ}C$ for 10~16 sec. Glass frit in Ag paste etch anti-reflection layer with plateau time. Glass frit in Ag paste is important for the Ag/Si contact formation and performances of crystalline Si solar cell. We achieved 17.14% efficiency with optimum conditions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.29-29
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• 2008

Realization of electronics with performance equal to established technologies that use rigid semiconductor wafers, but in lightweight, foldable and stretchable formats would enable many new application possibilities. Examples include wearable systems for personal health monitoring, 'smart' surgical gloves with integrated electronics and electronic eye type imagers that incorporate focal plane arrays on hemispherical substrates. Circuits that use organic or certain classes of inorganic electronic materials on plastic or steel foil substrates can provide some degree of mechanical flexibility, but they cannot be folded or stretched. Also, with few exceptions such systems offer only modest electrical performance. In this talk, I will present a new approach to high performance, flexible and stretchable integrated circuits. These systems combine single-crystal silicon nanoribbons with thin plastic or elastomeric substrates using both "top-down" and "transfer-printing" technologies. The strategies represent promising routes to high performance, flexible and stretchable optoelectronic devices that can incorporate established, high performance inorganic electronic materials.